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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 最大电源电流 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 通用闪存接口 | I2C控制字节 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||||||||||||||||||||||||
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 | 24LC014HT-I/ST | Microchip Technology | 数据表 | 33000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 4.5V | 0.65mm | 40 | 24LC014H | 8 | 5V | I2C, Serial | 1Kb 128 x 8 | 3mA | 1MHz | 400ns | EEPROM | I2C | 8 | 5ms | 1 kb | I2C | 5ms | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93LC66AXT-I/SN | Microchip Technology | 数据表 | 17 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2011 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS | 2.5V~5.5V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | 93LC66A | 8 | 5.5V | 3/5V | 2.5V | Serial | 4Kb 512 x 8 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 8 | 6ms | 4 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S25FS128SAGMFI103 | Cypress Semiconductor Corp | 数据表 | 968 In Stock | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2016 | FS-S | 活跃 | 3 (168 Hours) | 8 | 8542.32.00.51 | 1.7V~2V | DUAL | 1 | 1.8V | 1.27mm | S-PDSO-G8 | 1.8V | 2V | 1.7V | SPI, Serial | 128Mb 16M x 8 | 133MHz | FLASH | SPI - Quad I/O, QPI | 32MX4 | 4 | 128 Mb | 2 | 2.159mm | 5.283mm | 5.283mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S29CD016J1JDGH014 | Cypress Semiconductor Corp | 数据表 | 8000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | Die | YES | Non-Volatile | -40°C~145°C TA | Tape & Reel (TR) | CD-J | Obsolete | 3 (168 Hours) | 74 | EAR99 | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK | 8542.32.00.51 | 1.65V~2.75V | UPPER | 未说明 | 1 | 2.6V | 未说明 | R-XUUC-N74 | 不合格 | 2.75V | 2.5V | 16Mb 512K x 32 | ASYNCHRONOUS | 40MHz | 54ns | FLASH | Parallel | 512KX32 | 32 | 60ns | 16777216 bit | 2.7V | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT93C46A-10TI-2.7 | Atmel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 8 | DIP, | IN-LINE | 64 | PLASTIC/EPOXY | -40 °C | 30 | 125 °C | 无 | AT93C46A-10TI2.7 | 1 MHz | 64 words | 5 V | DIP | RECTANGULAR | Atmel Corporation | Obsolete | ATMEL CORP | 8.7 | DIP | e0 | 锡铅 | DUAL | THROUGH-HOLE | 240 | 1 | 2.54 mm | compliant | 8 | R-PDIP-T8 | 不合格 | 5.5 V | AUTOMOTIVE | 2.7 V | SYNCHRONOUS | 64X16 | 5.334 mm | 16 | 1024 bit | SERIAL | EEPROM | MICROWIRE | 10 ms | 8 | 9.271 mm | 7.62 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24LC08BT/ST | Microchip Technology | 数据表 | 10000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 3V | 0.65mm | 40 | 24LC08B | 8 | 5.5V | 3/5V | 2.5V | I2C, Serial | 8Kb 256 x 8 x 4 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 8 kb | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XMMR | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 71V016SA12PHGI8 | Renesas Electronics America Inc. | 数据表 | 58 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | Volatile | Industrial grade | -40°C~85°C TA | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | 3V~3.6V | IDT71V016 | 1Mb 64K x 16 | SRAM | Parallel | 12ns | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24AA01HT-I/SN | Microchip Technology | 数据表 | 5000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 24AA01H | 8 | 2.5V | 5.5V | 2/5V | 1.7V | I2C, Serial | 1Kb 128 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 1 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XXXR | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24VL024HT/MS | Microchip Technology | 数据表 | 23654 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | Gold | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -20°C~85°C TA | Tape & Reel (TR) | 2008 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) - annealed | 1.5V~3.6V | DUAL | 260 | 1 | 1.8V | 0.65mm | 40 | 24VL024H | 8 | 不合格 | 3.3V | 3.6V | 1.5V | I2C, Serial | 2Kb 256 x 8 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1.1mm | 3mm | 3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MX25L12855FXCI-10G | Macronix | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 24-TBGA, CSPBGA | Non-Volatile | -40°C~85°C TA | Tray | 2009 | MXSMIO™ | 活跃 | 3 (168 Hours) | 2.7V~3.6V | SPI, Serial | 128Mb 16M x 8 | 104MHz | FLASH | SPI | 30μs, 3ms | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | W9864G6KH-5 | Winbond Electronics | 数据表 | 4 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 54-TSOP (0.400, 10.16mm Width) | YES | Volatile | 0°C~70°C TA | Tray | 2016 | 活跃 | 3 (168 Hours) | 54 | AUTO/SELF REFRESH | 3V~3.6V | DUAL | 未说明 | 1 | 3.3V | 0.8mm | 未说明 | R-PDSO-G54 | 3.6V | 3V | 64Mb 4M x 16 | 1 | SYNCHRONOUS | 200MHz | 5ns | DRAM | Parallel | 4MX16 | 16 | 67108864 bit | 1.2mm | 22.22mm | 10.16mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C2565KV18-400BZC | Cypress Semiconductor Corp | 数据表 | 2033 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | Obsolete | 3 (168 Hours) | 165 | 流水线结构 | 1.7V~1.9V | BOTTOM | 1 | 1.8V | 1mm | not_compliant | CY7C2565 | 165 | 不合格 | 1.8V | 1.9V | 1.7V | 72Mb 2M x 36 | 2 | 1A | 400MHz | 1 ms | SRAM | Parallel | 3-STATE | 36 | 19b | 72 Mb | SEPARATE | Synchronous | 36b | 1.7V | 1.4mm | 15mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1515V18-250BZC | Cypress Semiconductor Corp | 数据表 | 3 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e0 | Obsolete | 3 (168 Hours) | 165 | Tin/Lead (Sn/Pb) | 流水线结构 | 1.7V~1.9V | BOTTOM | 220 | 1 | 1.8V | 1mm | not_compliant | 未说明 | CY7C1515 | 165 | 不合格 | 1.8V | 1.9V | 1.7V | 72Mb 2M x 36 | 2 | 1.04A | 250MHz | 450 ps | SRAM | Parallel | 3-STATE | 36 | 38b | 72 Mb | SEPARATE | Synchronous | 36b | 1.7V | 1.4mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | W29GL256SH9C | Winbond Electronics | 数据表 | 86 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | 56-TFBGA | YES | Non-Volatile | -40°C~85°C TA | Tube | 2016 | Obsolete | 3 (168 Hours) | 56 | 2.7V~3.6V | BOTTOM | 1 | 3V | 0.8mm | R-PBGA-B56 | 不合格 | 3.6V | 3/3.3V | 2.7V | 256Mb 16M x 16 | ASYNCHRONOUS | FLASH | Parallel | 16MX16 | 16 | 90ns | 0.0001A | 268435456 bit | 90 ns | 3V | YES | YES | YES | 256 | 64K | 16words | YES | YES | 1.2mm | 9mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT21CS11-SSH10-T | Microchip Technology | 数据表 | 268 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | 8 | 2.7V~4.5V | DUAL | 未说明 | 1 | 1.27mm | 未说明 | AT21CS11 | R-PDSO-G8 | 4.5V | 2.7V | 1Kb 128 x 8 | SYNCHRONOUS | 125kHz | EEPROM | I2C, Single Wire | 128X8 | 8 | 5ms | 1024 bit | SERIAL | 1-WIRE | 5ms | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39LF400A-55-4C-EKE-T | Microchip Technology | 数据表 | 232 In Stock | - | 最小起订量: 1 最小包装量: 1 | 15 Weeks | 表面贴装 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | 48 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2000 | SST39 MPF™ | e3 | yes | 活跃 | 3 (168 Hours) | 48 | 3A991.B.1.A | Matte Tin (Sn) - annealed | 8542.32.00.51 | 3V~3.6V | DUAL | 260 | 3.3V | 0.5mm | 40 | SST39LF400A | 3.3V | 4Mb 256K x 16 | 30mA | 55ns | FLASH | Parallel | 16b | 256KX16 | 16 | 20μs | 18b | 4 Mb | 0.00002A | Asynchronous | 16b | YES | YES | YES | 128 | 2K | YES | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S25FL216K0PMFI011 | Cypress Semiconductor Corp | 数据表 | 1135 In Stock | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2013 | FL2-K | Obsolete | 3 (168 Hours) | 8 | 2.7V~3.6V | 1 | 3V | 1.27mm | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 16Mb 2M x 8 | 25mA | 65MHz | 5 ns | FLASH | SPI - Dual I/O | 8b | 16MX1 | 1 | 5ms | 1b | 16 Mb | 0.000032A | Synchronous | 8b | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256B | 2.159mm | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M95010-RMN6TP | STMicroelectronics | 数据表 | 10000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 13 Weeks | ACTIVE (Last Updated: 6 months ago) | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | e4 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 30 | M95010 | 8 | 5V | SPI, Serial | 1Kb 128 x 8 | 5mA | 20MHz | 60 ns | EEPROM | SPI | 8 | 5ms | 1 kb | 0.0005A | SPI | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S34ML08G201TFI000 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | Tin | 表面贴装 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2013 | ML-2 | e3 | Discontinued | 3 (168 Hours) | 48 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 1 | 3.3V | 0.5mm | 3.3V | 3.6V | 2.7V | 8Gb 1G x 8 | 30mA | 30 μs | FLASH | Parallel | 8b | 1GX8 | 8 | 25ns | 31b | 8 Gb | 0.00005A | 3V | NO | NO | YES | 4K | 256K | 2kB | YES | 1.2mm | 18.4mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24AA08T-I/STG | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | Compliant | 4.40 MM, ROHS COMPLIANT, PLASTIC, MO-153, TSSOP-8 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 1 | 1000 | PLASTIC/EPOXY | TSSOP8,.25 | -40 °C | 40 | 85 °C | 有 | 24AA08T-I/STG | 0.1 MHz | 1024 words | 2.5 V | TSSOP | RECTANGULAR | Microchip Technology Inc | 活跃 | MICROCHIP TECHNOLOGY INC | 5.25 | TSSOP | Tape & Reel (TR) | e3 | 有 | EAR99 | Matte Tin (Sn) | 85 °C | -40 °C | 8542.32.00.51 | EEPROMs | CMOS | DUAL | 鸥翼 | 260 | 1 | 0.65 mm | compliant | 400 kHz | 8 | R-PDSO-G8 | 不合格 | 5.5 V | 2/5 V | INDUSTRIAL | 1.7 V | I2C | 5.5 V | 1.8 V | 1 kB | SYNCHRONOUS | 0.003 mA | 900 ns | 1KX8 | 1.2 mm | 8 | 0.000001 A | 8192 bit | 400 kHz | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010XMMR | 4.4 mm | 3 mm | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| CY7C2644KV18-300BZXI | Cypress Semiconductor Corp | 数据表 | 2658 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 165-LBGA | YES | 165 | Volatile | -40°C~85°C TA | Tray | 2003 | 活跃 | 3 (168 Hours) | 165 | 3A991.B.2.A | 流水线结构 | 8542.32.00.41 | 1.7V~1.9V | BOTTOM | 1 | 1.8V | 1mm | CY7C2644 | 1.9V | 1.7V | 144Mb 4M x 36 | 300MHz | SRAM | Parallel | 4MX36 | 36 | 150994944 bit | 1.4mm | 17mm | 15mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT28LV010-20TU-235 | Microchip Technology | 数据表 | 22 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | 表面贴装 | 32-TFSOP (0.724, 18.40mm Width) | YES | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 1997 | e3 | 活跃 | 3 (168 Hours) | 32 | Matte Tin (Sn) | 3V~3.6V | DUAL | 未说明 | 1 | 3.3V | 0.5mm | 未说明 | R-PDSO-G32 | 3.465V | 3.135V | 1Mb 128K x 8 | ASYNCHRONOUS | 200ns | EEPROM | Parallel | 128KX8 | 8 | 10ms | 1048576 bit | 3V | 10ms | 1.2mm | 18.4mm | 8mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | W25Q64CVSFIG | Winbond Electronics | 数据表 | 1462 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | 16 | Non-Volatile | -40°C~85°C TA | Tube | 2011 | SpiFlash® | Obsolete | 3 (168 Hours) | 16 | 3A991.B.1.A | 8542.32.00.51 | 2.7V~3.6V | DUAL | 1 | 3V | 1.27mm | 16 | 3.3V | 3.6V | 2.7V | SPI, Serial | 64Mb 8M x 8 | 18mA | 80MHz | 7 ns | FLASH | SPI - Quad I/O | 8MX8 | 8 | 50μs, 3ms | 24b | 64 Mb | 0.000005A | Synchronous | 8b | 2.7V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256B | 2.64mm | 10.31mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS21ES04G-JCLI | ISSI, Integrated Silicon Solution Inc | 数据表 | 10 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 153-VFBGA | YES | 153 | Non-Volatile | -40°C~85°C TA | Tray | e1 | 活跃 | 3 (168 Hours) | 153 | Tin/Silver/Copper (Sn/Ag/Cu) | 2.7V~3.6V | BOTTOM | 未说明 | 1 | 3.3V | 0.5mm | 未说明 | 3.6V | 2.7V | 32Gb 4G x 8 | SYNCHRONOUS | 200MHz | FLASH | eMMC | 4GX8 | 8 | 34359738368 bit | PARALLEL | 3.3V | 1mm | 13mm | 11.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT28HC256E-12TU | Microchip Technology | 数据表 | 246 In Stock | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | Tin | 表面贴装 | 表面贴装 | 28-TSSOP (0.465, 11.80mm Width) | 28 | Non-Volatile | -40°C~85°C TC | Tray | 1997 | e3 | yes | 活跃 | 3 (168 Hours) | 28 | 4.5V~5.5V | DUAL | 未说明 | 1 | 5V | 0.55mm | 未说明 | AT28HC256 | 不合格 | 5V | 5V | 256Kb 32K x 8 | 80mA | ASYNCHRONOUS | 120ns | EEPROM | Parallel | 32KX8 | 8 | 10ms | 256 kb | 0.0003A | 5V | 100000 Write/Erase Cycles | 10ms | YES | YES | NO | 64words | 1.2mm | 11.8mm | 8mm | ROHS3 Compliant |
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