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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 电源电流 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 时钟频率 | 位元大小 | 数据总线宽度 | 无卤素 | 定时器/计数器的数量 | 地址总线宽度 | 核心架构 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 电压 - I/O | UART 通道数 | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 协处理器/DSP | 核数量 | 外部中断数量 | 总线兼容性 | 桶式移位器 | 内部总线架构 | 保安功能 | 显示和界面控制器 | 萨塔 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | RoHS状态 | 无铅 | |||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | MPC8572VJATLE | NXP USA Inc. | 数据表 | 2033 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 18 Weeks | 1023-BBGA, FCBGA | 0°C~105°C TA | Tray | 2008 | MPC85xx | yes | 活跃 | 3 (168 Hours) | 245 | 30 | MPC8572 | 1.2GHz | MICROPROCESSOR | PowerPC e500 | 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 2 Core 32-Bit | 无 | DDR2, DDR3 | DUART, HSSI, I2C, RapidIO | Signal Processing; SPE | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8323EVRADDC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 516-BBGA | YES | 0°C~105°C TA | Tray | 2004 | MPC83xx | Obsolete | 3 (168 Hours) | 516 | 5A002 | 8542.31.00.01 | BOTTOM | BALL | 1V | 1mm | MPC8323 | S-PBGA-B516 | 1.05V | 0.95V | 266MHz | MICROPROCESSOR, RISC | PowerPC e300c2 | 14 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; QUICC Engine, Security; SEC 2.2 | Cryptography | 2.55mm | 27mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | P5040NSN72QC | NXP USA Inc. | 数据表 | 420 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 1295-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2012 | QorIQ P5 | e1 | 活跃 | 3 (168 Hours) | 3A991.A.1 | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.2V | 1mm | 30 | S-PBGA-B1295 | 1.23V | 1.17V | 2.2GHz | MICROPROCESSOR, RISC | PowerPC e5500 | 166MHz | 16 | YES | YES | 64 | 固定点 | YES | 1.0V 1.2V | 1Gbps (10), 10Gbps (2) | 4 Core 64-Bit | 无 | DDR3, DDR3L | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | SATA 3Gbps (2) | 3.53mm | 37.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8378ECVRAGDA | NXP USA Inc. | 数据表 | 64 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | -40°C~125°C TA | Tray | 2002 | MPC83xx | e2 | 不用于新设计 | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8378 | S-PBGA-B689 | 1.05V | 0.95V | 400MHz | MICROPROCESSOR | PowerPC e300c4s | 66.66MHz | 32 | 15 | YES | YES | 64 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | Security; SEC 3.0 | Cryptography, Random Number Generator | 2.46mm | 31mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8572EVTARLE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1023-BFBGA, FCBGA | 0°C~105°C TA | Tray | 2008 | MPC85xx | Obsolete | 3 (168 Hours) | 5A002 | 8542.31.00.01 | MPC8572 | 1.067GHz | MICROPROCESSOR, RISC | PowerPC e500 | 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 2 Core 32-Bit | 无 | DDR2, DDR3 | DUART, HSSI, I2C, RapidIO | Signal Processing; SPE, Security; SEC | Cryptography, Random Number Generator | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | OMAP3530ECBC | Texas Instruments | 数据表 | 1695 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 16 Weeks | ACTIVE (Last Updated: 6 days ago) | 表面贴装 | 515-VFBGA, FCBGA | 515 | L2 Cache, ROM, SRAM | 0°C~90°C TJ | Tray | OMAP-35xx | e1 | 活跃 | 3 (168 Hours) | 515 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 0.5mm | 600MHz | OMAP3530 | 515 | 1.35V | I2C, SPI, UART, USB | 1.35V | 985mV | 112kB | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32b | ARM | 1.8V 3.0V | 3 | 1 Core 32-Bit | 有 | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Signal Processing; C64x+, Multimedia; NEON™ SIMD | LCD | 950μm | 14mm | 14mm | 630μm | 无 | Non-RoHS Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
 | MPC860ENCVR66D4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 357-BBGA | YES | -40°C~95°C TA | Tray | 1995 | MPC8xx | e1 | 不用于新设计 | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 66MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (4) | 1 Core 32-Bit | 无 | DRAM | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
| MPC8572LVTAULE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1023-BFBGA, FCBGA | 0°C~105°C TA | Tray | 2008 | MPC85xx | Obsolete | 3 (168 Hours) | MPC8572 | 1.333GHz | PowerPC e500 | 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 2 Core 32-Bit | 无 | DDR2, DDR3 | DUART, HSSI, I2C, RapidIO | Signal Processing; SPE | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Z84C0010VEG | Zilog | 数据表 | 500 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 44-LCC (J-Lead) | 44 | ROMless | -40°C~100°C TA | Tube | 2002 | Z80 | e3 | yes | 活跃 | 3 (168 Hours) | 44 | 3A001.A.2.C | Matte Tin (Sn) | 内存刷新计数器 | 8542.31.00.01 | QUAD | J BEND | 260 | 5V | 1.27mm | 10MHz | 40 | Z84C00 | 44 | 5V | 5V | 5V | 64kB | MICROPROCESSOR | 8 | 8b | 16 | NO | YES | 固定点 | NO | 0 | 5.0V | 1 Core 8-Bit | 无 | 2 | 4.57mm | 16.5862mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
| P1013NSE2LFB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2002 | QorIQ P1 | e2 | 活跃 | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | P1013 | S-PBGA-B689 | 1.05V | 0.95V | 1.055GHz | MICROPROCESSOR | PowerPC e500v2 | 133MHz | 32 | YES | YES | 浮点 | YES | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, I2S, MMC/SD, SPI | Security; SEC | Cryptography, Random Number Generator | LCD | SATA 3Gbps (2) | 2.46mm | 31mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX6QP4AVT1AB | NXP USA Inc. | 数据表 | 2503 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 624-FBGA, FCBGA | YES | -40°C~125°C TJ | Tray | i.MX6QP | 活跃 | 3 (168 Hours) | 624 | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B624 | 1.5V | 1.35V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | 有 | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LPC2141FBD64,118 | NXP Semiconductors / Freescale | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 64 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC68360ZQ25LR2 | Freescale Semiconductor, Inc. (NXP Semiconductors) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA | 357 | 2.1737g | 25MHz | 70°C | 0°C | 25MHz | Ethernet, UART | 2.5kB | 32b | 不含卤素 | Coldfire | 1 | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX258CVM4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 400-LFBGA | YES | -40°C~85°C TA | Tray | 2008 | i.MX25 | e1 | Obsolete | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.45V | 0.8mm | 40 | MCIMX258 | S-PBGA-B400 | 1.52V | 1.38V | 400MHz | MICROPROCESSOR | ARM926EJ-S | 24MHz | 32 | 26 | YES | YES | 16 | 固定点 | YES | 2.0V 2.5V 2.7V 3.0V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LPDDR, DDR, DDR2 | USB 2.0 + PHY (2) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection | Keypad, LCD, Touchscreen | 1.6mm | 17mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX6X1CVO08AC | NXP USA Inc. | 数据表 | 100000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 15 Weeks | 400-LFBGA | YES | 14 | -40°C~105°C TA | Tray | 2017 | i.MX6SX | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B400 | 1.5V | 1.275V | 200MHz, 800MHz | ARM® Cortex®-A9, ARM® Cortex®-M4 | 15 | YES | 32 | 144K | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | 无 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | Multimedia; NEON™ MPE | CAN; ETHERNET; I2C; I2S; IRDA; RS-232; RS-485; SPI; UART; USB | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | 1.53mm | 17mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LS1012AXN7EKB | NXP USA Inc. | 数据表 | 5 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 24 Weeks | 211-VFLGA | -40°C~105°C | 2016 | QorIQ® Layerscape | 活跃 | 3 (168 Hours) | 600MHz | ARM® Cortex®-A53 | GbE (2) | 1 Core 64-Bit | DDR3L | USB 2.0 (1), USB 3.0 + PHY | Secure Boot, TrustZone® | SATA 6Gbps (1) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC7448VS1400ND | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 360-CLGA, FCCLGA | YES | 0°C~105°C TA | Tray | 1994 | MPC74xx | 活跃 | 1 (Unlimited) | 360 | 3A991.A.1 | 8542.31.00.01 | BOTTOM | 245 | 1.15V | 1.27mm | 30 | MC7448 | S-CBGA-N360 | 1.2V | 1.31.8/2.5V | 1.1V | 1.4GHz | MICROPROCESSOR, RISC | PowerPC G4 | 1400MHz | 32 | NO | YES | 固定点 | NO | 1.5V 1.8V 2.5V | 1 Core 32-Bit | 无 | Multimedia; SIMD | 2.8mm | 25mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | FWIXP420BD | Intel | 数据表 | 71 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA | 492 | 70°C | Bulk | 2004 | Discontinued | 1 (Unlimited) | 492 | 3A991.A.2 | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 225 | 1.3V | 1.27mm | 533MHz | 未说明 | 492 | 不合格 | 1.33.3V | COMMERCIAL | 1.3V | MICROPROCESSOR, RISC | 32 | 32 | YES | NO | 32 | 固定点 | YES | 2.59mm | 35mm | 35mm | 符合RoHS标准 | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC755BRX300LE | NXP USA Inc. | 数据表 | 1 In Stock | - | 最小起订量: 1 最小包装量: 1 | 360-BCBGA, FCCBGA | YES | 0°C~105°C TA | Tray | 2001 | MPC7xx | e0 | Obsolete | 1 (Unlimited) | 360 | 3A991 | Tin/Lead (Sn/Pb) | ALSO REQUIRES 2.5V OR 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 220 | 2V | 1.27mm | 30 | MPC755 | S-CBGA-B360 | 2.1V | 1.8V | 300MHz | MICROPROCESSOR, RISC | PowerPC | 100MHz | 32 | 32 | YES | YES | 64 | 浮点 | YES | 2.5V 3.3V | 1 Core 32-Bit | 无 | 3.2mm | 25mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AM1806BZCE3 | Texas Instruments | 数据表 | 31234 In Stock | - | 最小起订量: 1 最小包装量: 1 | Copper, Silver, Tin | 表面贴装 | 361-LFBGA | 361 | 0°C~90°C TJ | Tray | Sitara™ | e1 | Obsolete | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 375MHz | AM1806 | 361 | 1.2V | 1.32V | I2C, SPI, UART, USB | 1.32V | 1.14V | 8kB | MICROPROCESSOR, RISC | ARM926EJ-S | 32 | 32b | 23 | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 3 | 1 Core 32-Bit | 无 | LPDDR, DDR2 | USB 2.0 + PHY (1) | I2C, McASP, McBSP, SPI, MMC/SD, UART | System Control; CP15 | LCD | 1.4mm | 16mm | ROHS3 Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||
 | XOMAP3503BCBB | Texas Instruments | 数据表 | 1500 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 515-VFBGA, FCBGA | 515 | FLASH | 188 | 0°C~90°C TJ | Tray | OMAP-35xx | Obsolete | 4 (72 Hours) | 515 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1.8V | 0.5mm | 600MHz | OMAP3503 | 515 | 3V | 1.35V | I2C, MMC, SDIO, UART, USB | 256kB | 2mA | 64kB | DIGITAL SIGNAL PROCESSOR, MIXED | ARM® Cortex®-A8 | 32b | 12 | 26 | YES | YES | 浮点 | 1.8V 3.0V | 1 Core 32-Bit | 无 | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | NO | MULTIPLE | LCD | 1mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6D5EZK08AD | NXP USA Inc. | 数据表 | 38556 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 15 Weeks | 569-LFBGA | YES | Commercial grade | -20°C~105°C TJ | Tray | 2002 | i.MX6D | e1 | 活跃 | 3 (168 Hours) | 569 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.4V | 0.4mm | 40 | S-PBGA-B569 | 1.5V | 1.275V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 26 | YES | YES | 32 | 固定点 | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 1.25mm | 12mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8560VTAQFB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BBGA, FCBGA | 0°C~105°C TA | Tray | 2002 | MPC85xx | Obsolete | 3 (168 Hours) | MPC8560 | 1.0GHz | PowerPC e500 | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, SDRAM | I2C, PCI, RapidIO, SPI, TDM, UART | Communications; CPM | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| HD63C09EP | Hitachi | 数据表 | 22 In Stock | - | 最小起订量: 1 最小包装量: 1 | NO | e0 | 40 | Tin/Lead (Sn/Pb) | 75°C | -20°C | DUAL | THROUGH-HOLE | 5V | 2.54mm | 40 | R-PDIP-T40 | 不合格 | 5V | 商业扩展 | 5.5V | 4.5V | 3 MHz | MICROPROCESSOR | 3MHz | 8 | 8b | 16b | NO | YES | 固定点 | NO | 0 | 3 | 5.06mm | 52.8mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LS1046ASE8P1A | NXP USA Inc. | 数据表 | 1000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 18 Weeks | 780-FBGA, FCBGA | YES | 76 | 0°C~105°C | Tray | 2016 | QorIQ® Layerscape | 活跃 | 3 (168 Hours) | 780 | BOTTOM | BALL | 250 | 1V | 0.8mm | 30 | S-PBGA-B780 | 1.03V | 0.97V | 1.4GHz | ARM® Cortex®-A72 | 14 | YES | 64 | 10GbE (2), 2.5GbE (1), 1GbE (4) | 4 Core 64-Bit | DDR4 | USB 3.0 (3) + PHY | I2C, PCI, SPI, UART, USB | Secure Boot, TrustZone® | SATA 6Gbps (1) | 2.61mm | 23mm | ROHS3 Compliant |
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MPC8572VJATLE
NXP USA Inc.
分类:Embedded - Microprocessors
3,376.582809
-
MPC8323EVRADDC
NXP USA Inc.
分类:Embedded - Microprocessors
-
P5040NSN72QC
NXP USA Inc.
分类:Embedded - Microprocessors
-
MPC8378ECVRAGDA
NXP USA Inc.
分类:Embedded - Microprocessors
590.063158
-
MPC8572EVTARLE
NXP USA Inc.
分类:Embedded - Microprocessors
-
OMAP3530ECBC
Texas Instruments
分类:Embedded - Microprocessors
282.730490
-
MPC860ENCVR66D4
NXP USA Inc.
分类:Embedded - Microprocessors
-
MPC8572LVTAULE
NXP USA Inc.
分类:Embedded - Microprocessors
-
Z84C0010VEG
Zilog
分类:Embedded - Microprocessors
-
P1013NSE2LFB
NXP USA Inc.
分类:Embedded - Microprocessors
-
MCIMX6QP4AVT1AB
NXP USA Inc.
分类:Embedded - Microprocessors
1,320.693729
-
LPC2141FBD64,118
NXP Semiconductors / Freescale
分类:Embedded - Microprocessors
-
MC68360ZQ25LR2
Freescale Semiconductor, Inc. (NXP Semiconductors)
分类:Embedded - Microprocessors
-
MCIMX258CVM4
NXP USA Inc.
分类:Embedded - Microprocessors
-
MCIMX6X1CVO08AC
NXP USA Inc.
分类:Embedded - Microprocessors
-
LS1012AXN7EKB
NXP USA Inc.
分类:Embedded - Microprocessors
197.491765
-
MC7448VS1400ND
NXP USA Inc.
分类:Embedded - Microprocessors
-
FWIXP420BD
Intel
分类:Embedded - Microprocessors
-
MPC755BRX300LE
NXP USA Inc.
分类:Embedded - Microprocessors
-
AM1806BZCE3
Texas Instruments
分类:Embedded - Microprocessors
-
XOMAP3503BCBB
Texas Instruments
分类:Embedded - Microprocessors
-
MCIMX6D5EZK08AD
NXP USA Inc.
分类:Embedded - Microprocessors
414.721715
-
MPC8560VTAQFB
NXP USA Inc.
分类:Embedded - Microprocessors
-
HD63C09EP
Hitachi
分类:Embedded - Microprocessors
-
LS1046ASE8P1A
NXP USA Inc.
分类:Embedded - Microprocessors
653.247204