category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

类别是'category.微处理器' (10000)

所有品牌

产品型号	品牌	数据表	库存	价格(含增值税)	数量	Contact plating	包装/外壳	表面安装	Number of pins	终端数量			Connector pinout layout	Contacts pitch	Core	Date Of Intro	Electrical mounting		Gross weight			Kind of connector																			Row pitch	Spatial orientation				Type of connector		Operating temperature	包装	系列	JESD-609代码	零件状态	ECCN 代码	端子表面处理	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	Current rating	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	资历状况	工作电源电压	温度等级	速度	uPs/uCs/外围ICs类型	电源电流-最大值	位元大小	数据总线宽度	座位高度-最大	地址总线宽度
MC9328MX21CVG	Freescale Semiconductor	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	289	BGA	14 X 14 MM, 1.41 MM HEIGHT, 0.65 MM PITCH, MAPBGA-289		32 MHz	3	85 °C	-40 °C	PLASTIC/EPOXY	LFBGA	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	1.65 V	1.45 V				无	Obsolete								FREESCALE SEMICONDUCTOR INC						e0		3A991.A.2	Tin/Lead (Sn/Pb)		8542.31.00.01	BOTTOM	BALL	220	0.65 mm	not_compliant		30	289	S-PBGA-B289	不合格		INDUSTRIAL	266 MHz	MICROPROCESSOR				1.49 mm	26	YES	YES	32	固定点	YES					14 mm	14 mm
PPC405GP-3DE133C	Applied Micro Circuits Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	456		BGA	BGA, BGA456,26X26,40		66.66 MHz	85 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA456,26X26,40	SQUARE	网格排列	2.7 V	2.3 V	2.5 V				无	Obsolete									APPLIED MICRO CIRCUITS CORP				e0		3A991.A.2	锡铅	ALSO REQUIRES 3.3V SUPPLY	8542.31.00.01	BOTTOM	BALL		1 mm	compliant			456	S-PBGA-B456	不合格		INDUSTRIAL	133 MHz	MICROPROCESSOR, RISC		32		2.65 mm	32	YES	YES	32	固定点	YES					27 mm	27 mm
IDT79RV4600-100MS	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	208	QFP	CAVITY DOWN, MQUAD-208		50 MHz	85 °C	PLASTIC/EPOXY	FQFP	QFP208,1.2SQ,20	SQUARE	FLATPACK, FINE PITCH	3.465 V	3.135 V	3.3 V				无	Obsolete								INTEGRATED DEVICE TECHNOLOGY INC						e0		3A991.A.2	锡铅		8542.31.00.01	QUAD	鸥翼		0.5 mm	not_compliant			208	S-PQFP-G208	不合格		OTHER	100 MHz	MICROPROCESSOR, RISC	1275 mA	64		3.86 mm	64	NO	YES	64	浮点	NO	0		7		27.69 mm	27.69 mm
TSPC603RMGU8LC	Teledyne e2v	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	255	200 MHz		125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	BGA	SQUARE	网格排列	2.625 V	2.375 V	2.5 V				Obsolete	TELEDYNE E2V (UK) LTD								BGA			BGA,						3A991.A.2			8542.31.00.01	BOTTOM	BALL		1.27 mm	unknown			255	S-CBGA-B255	不合格		MILITARY	200 MHz	MICROPROCESSOR, RISC		32		3 mm	32	YES	YES	64	浮点	YES					21 mm	21 mm
TSPC603RMGU8LC	Atmel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	255		BGA	BGA, BGA255,16X16,50		66.7 MHz	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	BGA	BGA255,16X16,50	SQUARE	网格排列	2.625 V	2.375 V	2.5 V				无	Transferred									ATMEL CORP				e0		3A991.A.2	Tin/Lead (Sn/Pb)		8542.31.00.01	BOTTOM	BALL		1.27 mm	unknown			255	S-CBGA-B255	不合格		MILITARY	200 MHz	MICROPROCESSOR, RISC		32		3 mm	32	YES	YES	64	浮点	YES					21 mm	21 mm
CM8071504650608S RL5Y	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1
CN8063801307903	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1
PIC64GX1000-V/FCS	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCSG-325	RISC-V	看门狗定时器					符合RoHS标准	400 kHz					32 kB		32 kB	SMD/SMT				CAN, I2C, SPI, UART	DDR4		1		Tray																		970 mV to 1.08 V						16 bit
XC7455ARX1250PF	Motorola Semiconductor Products	数据表	N/A	-	最小起订量: 1 最小包装量: 1				,										Transferred	MOTOROLA INC												8542.31.00.01					unknown
XC7455ARX1250PF	NXP Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	无	Obsolete						NXP SEMICONDUCTORS		,	1													e0			锡铅		8542.31.00.01			220		not_compliant		30							MICROPROCESSOR, RISC
FH8065301729501	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	gold-plated	2	2x1	2.54mm	2018-07-27	THT	0.11 g	female	活跃	INTEL CORP		2.54mm	straight	socket			pin strips		-40...163°C								8542.31.00.01					compliant	1.5A								MICROPROCESSOR												60V		beryllium copper			0.254µm	UL94V-0
FS32R264JCK0MMM	NXP Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	gold-plated	6	1x6	2.54mm	THT	0.57 g	female			NXP SEMICONDUCTORS	,			straight			socket	pin strips	Obsolete	-40...163°C								8542.31.00.01					unknown	1.5A								MICROCONTROLLER, RISC												60V		beryllium copper			0.75µm	UL94V-0
BCM58522BB1KF10G	Broadcom Limited	数据表	N/A	-	最小起订量: 1 最小包装量: 1																	Bulk	*		Obsolete
IBM25PPC750FX-GR0533V	IBM	数据表	N/A	-	最小起订量: 1 最小包装量: 1																	Bulk	*		活跃
PPC8541EPX533J	Freescale Semiconductor	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	783	BGA783,28X28,40	SQUARE	网格排列				无	Obsolete						FREESCALE SEMICONDUCTOR INC		BGA, BGA783,28X28,40			3		PLASTIC/EPOXY		BGA				e0			锡铅银		8542.31.00.01	BOTTOM	BALL	245	1 mm	not_compliant		30		S-PBGA-B783	不合格			333 MHz	MICROPROCESSOR, RISC		32
CN6880LP-1200BG1936-AAP-Y22-G	Marvell Technology Group Ltd	数据表	N/A	-	最小起订量: 1 最小包装量: 1
MC6800CL	Freescale Semiconductor	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	40	85 °C	DIP, DIP40,.6	MOTOROLA SEMICONDUCTOR PRODUCTS	Obsolete	无				IN-LINE	RECTANGULAR						DIP40,.6				DIP	CERAMIC			-40 °C				e0			Tin/Lead (Sn/Pb)			DUAL	THROUGH-HOLE		2.54 mm	unknown				R-XDIP-T40	不合格		INDUSTRIAL	1 MHz	MICROPROCESSOR, RISC		8
PC7410VG500LE	Teledyne e2v	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	360		CERAMIC, METAL-SEALED COFIRED	BGA	BGA360,19X19,50	SQUARE	网格排列	1.9 V	1.7 V	1.8 V				Obsolete	TELEDYNE E2V (UK) LTD								BGA		25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360		133 MHz						3A991.A.2			8542.31.00.01	BOTTOM	BALL		1.27 mm	compliant			360	S-CBGA-B360	不合格			500 MHz	MICROPROCESSOR, RISC		32		3.2 mm	32	YES	YES	64	浮点	YES					25 mm	25 mm
PC7410VG500LE	Atmel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	360		CERAMIC, METAL-SEALED COFIRED	BGA	BGA360,19X19,50	SQUARE	网格排列	1.9 V	1.7 V	1.8 V				Transferred	ATMEL CORP								BGA		BGA, BGA360,19X19,50		133 MHz						3A991.A.2			8542.31.00.01	BOTTOM	BALL		1.27 mm	unknown			360	S-CBGA-B360	不合格			500 MHz	MICROPROCESSOR, RISC		32		3.2 mm	32	YES	YES	64	浮点	YES					25 mm	25 mm
MPC8548VTATGA	Freescale Semiconductor	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	783		BGA	29 X 29 MM, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, FCBGA-783		3	105 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA783,28X28,40	SQUARE	网格排列	1.155 V	1.045 V	1.1 V				有	Obsolete									FREESCALE SEMICONDUCTOR INC									8542.31.00.01	BOTTOM	BALL	260	1 mm	not_compliant		40	783	S-PBGA-B783	不合格				SoC				3.38 mm											29 mm	29 mm
TMPZ84C00AP-10	Toshiba America Electronic Components	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	40	10 MHz		85 °C	-40 °C	PLASTIC/EPOXY	DIP	RECTANGULAR	IN-LINE	5.5 V	4.5 V	5 V				Obsolete	TOSHIBA CORP								DIP			DIP,								BUILT-IN REFRESH CIRCUIT FOR DYNAMIC MEMORY	8542.31.00.01	DUAL	THROUGH-HOLE		2.54 mm	unknown			40	R-PDIP-T40	不合格		INDUSTRIAL	10 MHz	MICROPROCESSOR	50 mA	8		4.8 mm	16	NO	YES	8	固定点	NO	0		2		50.7 mm	15.24 mm
XPC860DPZP66D3	Freescale Semiconductor	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	357		PLASTIC/EPOXY	BGA	BGA357,19X19,50	SQUARE	网格排列	3.465 V	3.135 V	3.3 V				Obsolete	FREESCALE SEMICONDUCTOR INC								BGA		BGA, BGA357,19X19,50		66 MHz						5A991			8542.31.00.01	BOTTOM	BALL		1.27 mm	unknown			357	S-PBGA-B357	不合格			66 MHz	MICROPROCESSOR, RISC		32		2.05 mm	32	YES	YES	32	固定点	YES					25 mm	25 mm
PR3000A-33MQ160C	Pyramid Semiconductor Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	160	QFP	QFP, QFP160,1.2SQ		66 MHz	70 °C	PLASTIC/EPOXY	QFP	QFP160,1.2SQ	SQUARE	FLATPACK	5.25 V	4.75 V	5 V				无	Obsolete								PERFORMANCE SEMICONDUCTOR CORP						e0		3A991.A.2	锡铅	28 VAX MIPS; 5 PIPELINE STAGES	8542.31.00.01	QUAD	鸥翼		0.64 mm	unknown			160	S-PQFP-G160	不合格		COMMERCIAL	33 MHz	MICROPROCESSOR, RISC	700 mA	32		3.85 mm	32	NO	NO	32	固定点	NO	0		6		27.65 mm	27.65 mm
XPC860ENZP66C1	Motorola Mobility LLC	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	357	BGA, BGA357,19X19,50		66 MHz	PLASTIC/EPOXY	BGA	BGA357,19X19,50	SQUARE	网格排列	3.465 V	3.135 V	3.3 V				无	Obsolete								MOTOROLA INC			BGA				e0		3A991.A.2	锡铅		8542.31.00.01	BOTTOM	BALL		1.27 mm	unknown			357	S-PBGA-B357	不合格			66 MHz	MICROPROCESSOR, RISC		32		2.05 mm	32			32							25 mm	25 mm
MC68LC060FE50	Freescale Semiconductor	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	208	CERAMIC, METAL-SEALED COFIRED	QFP	SQUARE	FLATPACK	3.465 V	3.135 V	3.3 V				Obsolete	FREESCALE SEMICONDUCTOR INC						QFP				QFP,	50 MHz								3A991.A.2			8542.31.00.01	QUAD	鸥翼		2.54 mm	unknown			208	S-CQFP-G208	不合格			50 MHz	MICROPROCESSOR		32		4.15 mm	32	YES	NO	32	浮点	YES					27.305 mm	27.305 mm