类别是'category.微处理器' (10000)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 制造商包装标识符 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 振荡器类型 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 电源电流-最大值 | 位元大小 | 访问时间 | 数据总线宽度 | 定时器/计数器的数量 | 地址总线宽度 | 核心架构 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 电压 - I/O | UART 通道数 | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 串行I/O数 | 定时器数量 | 协处理器/DSP | 只读存储器可编程性 | 核数量 | 总线兼容性 | 桶式移位器 | 内部总线架构 | 片上数据 RAM 宽度 | 保安功能 | 显示和界面控制器 | DMA通道数 | 萨塔 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | RoHS状态 | 无铅 | ||||
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![]() | MC9328MX21CVK | NXP USA Inc. | 数据表 | 45 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 15 Weeks | 289-LFBGA | YES | -40°C~85°C TA | Tray | 2006 | i.MX21 | e1 | 不用于新设计 | 3 (168 Hours) | 289 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 0.65mm | 40 | MC9328MX21 | S-PBGA-B289 | 1.65V | 1.45V | 266MHz | MICROPROCESSOR | ARM926EJ-S | 32MHz | 32 | 26 | YES | YES | 32 | 固定点 | YES | 1.8V 3.0V | 1 Core 32-Bit | 无 | SDRAM | USB 1.x (2) | 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART | Keypad, LCD | 1.49mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MCIMX6D5EYM10ADR | NXP USA Inc. | 数据表 | 100000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 15 Weeks | 624-LFBGA, FCBGA | -20°C~105°C TJ | Tape & Reel (TR) | 2011 | i.MX6D | 活跃 | 3 (168 Hours) | 1.0GHz | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPC8280CZUUPEA | NXP USA Inc. | 数据表 | 198 In Stock | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | 480-LBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 1994 | MPC82xx | e0 | 活跃 | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | 40 | MPC8280 | S-PBGA-B480 | 1.6V | 1.53.3V | 1.45V | 450MHz | MICROPROCESSOR, RISC | PowerPC G2_LE | 100MHz | 32 | 32 | YES | NO | 64 | 浮点 | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 1.65mm | 37.5mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPC8250ACZUMHBC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 480-LBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 1997 | MPC82xx | Obsolete | 3 (168 Hours) | 480 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 220 | 2V | 1.27mm | 30 | MPC8250 | S-PBGA-B480 | 2.2V | 1.9V | 266MHz | MICROPROCESSOR, RISC | PowerPC G2 | 32 | 32 | YES | NO | 64 | 浮点 | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DRAM, SDRAM | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 1.65mm | 37.5mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT91SAM9CN12B-CFUR | Microchip Technology | 数据表 | 49 In Stock | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | Copper, Silver, Tin | 表面贴装 | 247-LFBGA | 247 | 205.307246mg | L1 Cache, ROM, SRAM | 105 | 有 | -40°C~85°C TA | Tape & Reel (TR) | 2004 | SAM9CN | e1 | yes | 活跃 | 3 (168 Hours) | 247 | 锡银铜 | BOTTOM | BALL | 1V | 0.5mm | 400MHz | AT91SAM9CN | 2-Wire, EBI/EMI, I2C, SPI, Serial, UART, USART, USB | 1.1V | 900mV | 128kB | Internal | 32kB | MICROPROCESSOR, RISC | ARM926EJ-S | DMA, LCD, POR, PWM, WDT | 32 | 32b | 2 | 26 | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 1 Core 32-Bit | 无 | LPDDR, LPDDR2, DDR2, SDR, SRAM | USB 2.0 (2) | EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | 1 | LCD, Touchscreen | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
![]() | P2041NSN7NNC | NXP USA Inc. | 数据表 | 2012 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 780-BBGA, FCBGA | 0°C~105°C TA | Tray | 2002 | QorIQ P2 | e1 | 活跃 | 3 (168 Hours) | 3A991.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | 245 | 30 | P2041 | 1.3GHz | MICROPROCESSOR, RISC | PowerPC e500mc | 1.0V 1.35V 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (5), 10Gbps (1) | 4 Core 32-Bit | 无 | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | SATA 3Gbps (2) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPC852TZT50A | NXP USA Inc. | 数据表 | 578 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 256-BBGA | YES | 0°C~95°C TA | Tray | 1999 | MPC8xx | e0 | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.8V | 1.27mm | 30 | MPC852 | S-PBGA-B256 | 1.9V | 1.83.3V | 1.7V | 50MHz | MICROPROCESSOR, RISC | 66MHz | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (1) | 1 Core 32-Bit | 无 | DRAM | HDLC/SDLC, PCMCIA, SPI, UART | Communications; CPM | 2.54mm | 23mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPC8378CVRAGDA | NXP USA Inc. | 数据表 | 23 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | -40°C~125°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8378 | S-PBGA-B689 | 1.05V | 11.8/2.52.5/3.3V | 0.95V | 400MHz | MICROPROCESSOR | PowerPC e300c4s | 66.66MHz | 32 | 15 | YES | YES | 64 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | 2.46mm | 31mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MCIMX6Q4AVT10AD | NXP USA Inc. | 数据表 | 2336 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 15 Weeks | 624-FBGA, FCBGA | YES | 7 | Automotive grade | -40°C~125°C TJ | Tray | 2002 | i.MX6Q | e1 | 活跃 | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B624 | 1.5V | 1.35V | 1.0GHz | ARM® Cortex®-A9 | 16 | YES | 64 | 272K | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPC8358ECZQAGDGA | NXP USA Inc. | 数据表 | 317 In Stock | - | 最小起订量: 1 最小包装量: 1 | 668-BBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 2006 | MPC83xx | e0 | Obsolete | 3 (168 Hours) | 668 | 5A002.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8358 | S-PBGA-B668 | 1.26V | 1.14V | 400MHz | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine, Security; SEC | Cryptography, Random Number Generator | 2.46mm | 29mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC68LC302AF16CT | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 100-LQFP | 0°C~70°C TA | Tray | 1995 | M683xx | e3 | 不用于新设计 | 3 (168 Hours) | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | 260 | 40 | MC68LC302 | 16MHz | MICROCONTROLLER, RISC | M68000 | 5.0V | 1 Core 8/16-Bit | 无 | DRAM | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | P1024NSE5DFB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 561-FBGA | 0°C~125°C TA | Tray | 2002 | QorIQ P1 | 活跃 | 3 (168 Hours) | 5A002.A.1 | 8542.31.00.01 | 260 | P1024 | 667MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 10/100/1000Mbps (3) | 2 Core 32-Bit | 无 | DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Security; SEC 3.3 | Cryptography, Random Number Generator | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPC860DTVR50D4 | NXP USA Inc. | 数据表 | 2161 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 357-BBGA | YES | 0°C~95°C TA | Tray | 1995 | MPC8xx | e1 | 不用于新设计 | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 50MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (2), 10/100Mbps (1) | 1 Core 32-Bit | 无 | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MCIMX6DP5EYM1AB | NXP USA Inc. | 数据表 | 2126 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 15 Weeks | 624-LFBGA, FCBGA | -20°C~105°C TJ | Tray | 2002 | i.MX6DP | 活跃 | 3 (168 Hours) | 8542.39.00.01 | 260 | 40 | 1.0GHz | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | 有 | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | SATA 3Gbps (1) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TG80960JS25 | Intel | 数据表 | 10000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 132-QFP | 0°C~100°C TC | Tray | 2002 | i960 | e1 | Obsolete | 4 (72 Hours) | 132 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.635mm | 25MHz | 132 | S-PQFP-G132 | 3.33.3/5V | 3V | 1kB | MICROPROCESSOR, RISC | 185mA | 32 | 25 μs | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 1 Core 32-Bit | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ATSAMA5D27C-D5M-CUR | Microchip Technology | 数据表 | 17000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 289-LFBGA | YES | -40°C~85°C TA | Tray | SAMA5D2 | 活跃 | 3 (168 Hours) | 289 | 8542.31.00.01 | BOTTOM | BALL | 1.8V | 0.8mm | ATSAMA5D27 | S-PBGA-B289 | 1.9V | 1.7V | 500MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | 24MHz | 16 | YES | YES | 浮点 | YES | 65536 | 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 有 | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | 9 | Multimedia; NEON™ MPE | 16 | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | 51 | 1.2mm | 14mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPC8270ZUQLDA | NXP USA Inc. | 数据表 | 108 In Stock | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | 480-LBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 1997 | MPC82xx | e0 | 活跃 | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | 40 | MPC8270 | S-PBGA-B480 | 1.6V | 1.53.3V | 1.45V | 333MHz | MICROPROCESSOR, RISC | PowerPC G2_LE | 83.33MHz | 32 | 32 | YES | NO | 64 | 浮点 | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 1.65mm | 37.5mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPC8541EVTALF | NXP USA Inc. | 数据表 | 27 In Stock | - | 最小起订量: 1 最小包装量: 1 | 783-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC85xx | e2 | Obsolete | 3 (168 Hours) | 783 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8541 | R-PBGA-B783 | 1.26V | 1.14V | 667MHz | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | 64 | YES | YES | 64 | 浮点 | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, SDRAM | DUART, I2C, PCI | Security; SEC | Cryptography, Random Number Generator | 3.75mm | 29mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPC8541EVTAJD | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 783-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC85xx | e2 | Obsolete | 3 (168 Hours) | 783 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8541 | R-PBGA-B783 | 1.26V | 1.14V | 533MHz | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | 64 | YES | YES | 64 | 浮点 | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, SDRAM | DUART, I2C, PCI | Security; SEC | Cryptography, Random Number Generator | 3.75mm | 29mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MCIMX6S6AVM08ACR | NXP USA Inc. | 数据表 | 100000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 15 Weeks | 624-LFBGA | YES | 14 | -40°C~125°C TJ | Tape & Reel (TR) | 2002 | i.MX6S | yes | 活跃 | 3 (168 Hours) | 624 | BOTTOM | BALL | 未说明 | 0.8mm | 未说明 | S-PBGA-B624 | 1.5V | 1.275V | 800MHz | ARM® Cortex®-A9 | 16 | YES | 32 | 144K | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | P2020NSE2KFC | NXP USA Inc. | 数据表 | 30 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | 0°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | 活跃 | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | 40 | P2020 | S-PBGA-B689 | 1.1V | 1.05V | 1V | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | 32 | YES | YES | 16 | 浮点 | YES | 10/100/1000Mbps (3) | 2 Core 32-Bit | 无 | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Security; SEC 3.3 | Cryptography, Random Number Generator | 2.46mm | 31mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | AM1808EZCED4 | Texas Instruments | 数据表 | 30 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | Copper, Silver, Tin | 表面贴装 | 361-LFBGA | 361 | AM1808EZCED4 | -40°C~90°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.3V | 0.65mm | 456MHz | AM1808 | I2C, SPI, UART, USB | 64kB | 8kB | MICROPROCESSOR, RISC | ARM926EJ-S | 32 | 32b | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LPDDR, DDR2 | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | I2C, McASP, McBSP, SPI, MMC/SD, UART | System Control; CP15 | 1 | LCD | SATA 3Gbps (1) | 1.3mm | 13mm | 13mm | 890μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||
![]() | MCIMX6QP5EVT2AA | NXP USA Inc. | 数据表 | 19 In Stock | - | 最小起订量: 1 最小包装量: 1 | 15 Weeks | 624-FBGA, FCBGA | -20°C~105°C TJ | Tray | i.MX6QP | 活跃 | 3 (168 Hours) | 8542.39.00.01 | 1.2GHz | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | 有 | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | SATA 3Gbps (1) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | OMAP3503ECBB | Texas Instruments | 数据表 | 500 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 6 Weeks | ACTIVE (Last Updated: 6 days ago) | 表面贴装 | 515-VFBGA, FCBGA | 515 | L2 Cache, ROM, SRAM | 0°C~90°C TJ | Tray | OMAP-35xx | e1 | yes | 活跃 | 3 (168 Hours) | 515 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 0.4mm | 600MHz | OMAP3503 | 515 | 1.8V | 1.35V | I2C, SPI, UART, USB | 1.89V | 1.71V | DIGITAL SIGNAL PROCESSOR, OTHER | ARM® Cortex®-A8 | 32b | ARM | YES | YES | 浮点 | YES | 64000 | 1.8V 3.0V | 3 | 1 Core 32-Bit | 无 | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 15 | Multimedia; NEON™ SIMD | MROM | NO | SINGLE | LCD | 900μm | 12mm | 12mm | 610μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||
![]() | MPC8306SCVMABDCA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 369-LFBGA | YES | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 369 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | MPC8306 | S-PBGA-B369 | 1.05V | 11.83.3V | 0.95V | 133MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 66.67MHz | 32 | YES | YES | 浮点 | YES | 1.8V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DDR2 | USB 2.0 (1) | DUART, I2C, SPI, TDM | Communications; QUICC Engine | 1.61mm | 19mm | ROHS3 Compliant |
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