类别是'category.微处理器' (10000)

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Rohs

工厂交货时间

生命周期状态

触点镀层

底架

包装/外壳

表面安装

引脚数

操作温度

包装

已出版

系列

JESD-609代码

无铅代码

零件状态

湿度敏感性等级(MSL)

终止次数

ECCN 代码

端子表面处理

HTS代码

端子位置

终端形式

峰值回流焊温度(摄氏度)

电源电压

端子间距

频率

时间@峰值回流温度-最大值(s)

基本部件号

引脚数量

JESD-30代码

工作电源电压

电源电压-最大值(Vsup)

电源

电源电压-最小值(Vsup)

电压

界面

内存大小

速度

内存大小

uPs/uCs/外围ICs类型

核心处理器

时钟频率

电源电流-最大值

位元大小

访问时间

数据总线宽度

定时器/计数器的数量

地址总线宽度

核心架构

边界扫描

低功率模式

外部数据总线宽度

格式

集成缓存

电压 - I/O

以太网

核数/总线宽度

图形加速

内存控制器

USB

附加接口

串行I/O数

协处理器/DSP

核数量

总线兼容性

保安功能

显示和界面控制器

DMA通道数

萨塔

座位高度(最大)

长度

宽度

器件厚度

辐射硬化

达到SVHC

RoHS状态

无铅

MC7448VU1250ND
MC7448VU1250ND
NXP USA Inc. 数据表

10086 In Stock

-

最小起订量: 1

最小包装量: 1

12 Weeks

360-CBGA, FCCBGA

YES

0°C~105°C TA

Tray

1994

MPC74xx

e2

活跃

1 (Unlimited)

360

3A991.A.1

TIN COPPER/TIN SILVER

8542.31.00.01

BOTTOM

260

1.1V

1.27mm

40

MC7448

S-CBGA-N360

1.15V

1.31.8/2.5V

1.05V

1.25GHz

MICROPROCESSOR, RISC

PowerPC G4

1250MHz

32

NO

YES

固定点

NO

1.5V 1.8V 2.5V

1 Core 32-Bit

Multimedia; SIMD

2.8mm

25mm

ROHS3 Compliant

MPC8358ECVRAGDGA
MPC8358ECVRAGDGA
NXP USA Inc. 数据表

2256 In Stock

-

最小起订量: 1

最小包装量: 1

12 Weeks

668-BBGA Exposed Pad

YES

-40°C~105°C TA

Tray

2002

MPC83xx

e2

活跃

3 (168 Hours)

668

5A002.A.1

TIN COPPER/TIN SILVER

8542.31.00.01

BOTTOM

BALL

260

1.2V

1mm

40

MPC8358

S-PBGA-B668

1.26V

1.14V

400MHz

MICROPROCESSOR, RISC

PowerPC e300

66.67MHz

32

32

YES

YES

32

浮点

YES

1.8V 2.5V 3.3V

10/100/1000Mbps (1)

1 Core 32-Bit

DDR, DDR2

USB 1.x (1)

DUART, HDLC, I2C, PCI, SPI, UART

Communications; QUICC Engine, Security; SEC

Cryptography, Random Number Generator

2.46mm

29mm

ROHS3 Compliant

MCIMX6S7CVM08AB
MCIMX6S7CVM08AB
NXP USA Inc. 数据表

282 In Stock

-

最小起订量: 1

最小包装量: 1

15 Weeks

624-LFBGA

YES

-40°C~105°C TA

Tray

2002

i.MX6S

e1

不用于新设计

3 (168 Hours)

624

5A992

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

260

0.8mm

40

MCIMX6

S-PBGA-B624

1.5V

1.275V

800MHz

MICROPROCESSOR, RISC

ARM® Cortex®-A9

32

26

YES

YES

32

浮点

YES

1.8V 2.5V 2.8V 3.3V

10/100/1000Mbps (1)

1 Core 32-Bit

LPDDR2, LVDDR3, DDR3

USB 2.0 + PHY (4)

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Multimedia; NEON™ SIMD

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Keypad, LCD

1.6mm

21mm

ROHS3 Compliant

MPC7410THX500LE
MPC7410THX500LE
NXP USA Inc. 数据表

2 In Stock

-

最小起订量: 1

最小包装量: 1

360-BCBGA, FCCBGA

YES

-40°C~105°C TA

Tray

1994

MPC74xx

Obsolete

1 (Unlimited)

3A991.A.1

8542.31.00.01

BOTTOM

BALL

1.8V

MPC7410

R-PBGA-B

1.9V

1.7V

500MHz

MICROPROCESSOR, RISC

PowerPC G4

NO

NO

固定点

NO

1.8V 2.5V 3.3V

1 Core 32-Bit

Non-RoHS Compliant

MPC8250AZUMHBC
MPC8250AZUMHBC
NXP USA Inc. 数据表

500 In Stock

-

最小起订量: 1

最小包装量: 1

480-LBGA Exposed Pad

YES

0°C~105°C TA

Tray

1997

MPC82xx

e0

Obsolete

3 (168 Hours)

480

3A991.A.2

Tin/Lead (Sn/Pb)

8542.31.00.01

BOTTOM

BALL

220

2V

1.27mm

30

MPC8250

S-PBGA-B480

2.2V

1.9V

266MHz

MICROPROCESSOR, RISC

PowerPC G2

32

32

YES

NO

64

浮点

YES

3.3V

10/100Mbps (3)

1 Core 32-Bit

DRAM, SDRAM

I2C, SCC, SMC, SPI, UART, USART

Communications; RISC CPM

1.65mm

37.5mm

Non-RoHS Compliant

AM5K2E02ABDA4
AM5K2E02ABDA4
Texas Instruments 数据表

2643 In Stock

-

最小起订量: 1

最小包装量: 1

26 Weeks

ACTIVE (Last Updated: 3 days ago)

1089-BFBGA, FCBGA

YES

1089

-40°C~100°C TC

Tray

Sitara™

e1

yes

活跃

4 (72 Hours)

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

BALL

1V

0.8mm

1.4GHz

AM5K2E02

1.05V

0.95V

1400 MHz

MICROPROCESSOR, RISC

ARM® Cortex®-A15

ARM

YES

YES

浮点

YES

1.35V 1.5V 1.8V 3.3V

1GBE (8)

2 Core 32-Bit

DDR3, SRAM

USB 3.0 (2)

EBI/EMI, I2C, PCIe, SPI, TSIP, UART, USIM

Network

2

32

3.55mm

27mm

27mm

2.98mm

ROHS3 Compliant

无铅

SB80L188EC13
SB80L188EC13
Intel 数据表

282 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

100-BFQFP

100

0°C~70°C TA

Tray

1996

i186

e0

Obsolete

3 (168 Hours)

100

Tin/Lead (Sn/Pb)

QUAD

鸥翼

3V

0.5mm

13MHz

100

3/5V

3V

MICROPROCESSOR

80C186

36mA

16

13 μs

20

NO

YES

8

固定点

NO

3.0V

1 Core 16-Bit

DRAM

Serial Communications Unit (SCU)

1.66mm

14mm

Non-RoHS Compliant

MC68340AG25E
MC68340AG25E
NXP USA Inc. 数据表

N/A

-

最小起订量: 1

最小包装量: 1

10 Weeks

144-LQFP

0°C~70°C TA

Tray

1995

M683xx

不用于新设计

3 (168 Hours)

MC68340

25MHz

CPU32

5.0V

1 Core 32-Bit

DRAM

USART

ROHS3 Compliant

MPC852TCZT100A
MPC852TCZT100A
NXP USA Inc. 数据表

20 In Stock

-

最小起订量: 1

最小包装量: 1

12 Weeks

256-BBGA

YES

-40°C~100°C TA

Tray

1999

MPC8xx

e0

Obsolete

3 (168 Hours)

256

3A991.A.2

Tin/Lead/Silver (Sn/Pb/Ag)

8542.31.00.01

BOTTOM

BALL

220

1.8V

1.27mm

30

MPC852

S-PBGA-B256

1.9V

1.83.3V

1.7V

100MHz

MICROPROCESSOR, RISC

66MHz

32

32

YES

YES

32

固定点

YES

3.3V

10Mbps (1)

1 Core 32-Bit

DRAM

HDLC/SDLC, PCMCIA, SPI, UART

Communications; CPM

2.54mm

23mm

Non-RoHS Compliant

AM3352ZCE27
AM3352ZCE27
Texas Instruments 数据表

600 In Stock

-

最小起订量: 1

最小包装量: 1

Copper, Silver, Tin

298-LFBGA

YES

298

Cache, RAM, ROM

0°C~90°C TJ

Tray

Sitara™

e1

yes

Obsolete

3 (168 Hours)

298

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

BALL

260

1.1V

0.65mm

275MHz

AM3352

298

1.1V

1.15V

CAN, Ethernet, I2C, SPI, UART, USB

64kB

MICROPROCESSOR, RISC

ARM® Cortex®-A8

32

32b

28

ARM

YES

YES

固定点

YES

1.8V 3.3V

10/100/1000Mbps (2)

1 Core 32-Bit

LPDDR, DDR2, DDR3, DDR3L

USB 2.0 + PHY (2)

CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART

Multimedia; NEON™ SIMD

1

Cryptography, Random Number Generator

LCD, Touchscreen

ROHS3 Compliant

无铅

MPC8555PXAPF
MPC8555PXAPF
NXP USA Inc. 数据表

N/A

-

最小起订量: 1

最小包装量: 1

12 Weeks

783-BBGA, FCBGA

YES

0°C~105°C TA

Tray

2002

MPC85xx

e0

Obsolete

3 (168 Hours)

783

5A992

Tin/Lead (Sn/Pb)

8542.31.00.01

BOTTOM

BALL

245

1.2V

1mm

30

MPC8555

S-PBGA-B783

1.26V

1.14V

833MHz

MICROPROCESSOR, RISC

PowerPC e500

166MHz

32

64

YES

YES

64

浮点

YES

2.5V 3.3V

10/100/1000Mbps (2)

1 Core 32-Bit

DDR, SDRAM

USB 2.0 (1)

DUART, I2C, PCI, SPI, TDM, UART

Communications; CPM

3.75mm

29mm

Non-RoHS Compliant

MPC8347VRADDB
MPC8347VRADDB
NXP USA Inc. 数据表

12 In Stock

-

最小起订量: 1

最小包装量: 1

12 Weeks

620-BBGA Exposed Pad

YES

0°C~105°C TA

Tray

2002

MPC83xx

e2

活跃

3 (168 Hours)

620

3A991.A.2

Tin/Silver (Sn/Ag)

8542.31.00.01

BOTTOM

BALL

260

1.2V

1mm

40

MPC8347

S-PBGA-B620

1.26V

1.2V

1.14V

266MHz

MICROPROCESSOR

PowerPC e300

66MHz

32

32

YES

YES

32

浮点

YES

2.5V 3.3V

10/100/1000Mbps (2)

1 Core 32-Bit

DDR

USB 2.0 + PHY (2)

DUART, I2C, PCI, SPI

2.46mm

29mm

ROHS3 Compliant

MPC855TZQ50D4
MPC855TZQ50D4
NXP USA Inc. 数据表

N/A

-

最小起订量: 1

最小包装量: 1

12 Weeks

357-BBGA

YES

0°C~95°C TA

Tray

1997

MPC8xx

e0

不用于新设计

3 (168 Hours)

357

3A991.A.2

Tin/Lead (Sn/Pb)

8542.31.00.01

BOTTOM

BALL

245

3.3V

1.27mm

30

MPC855

S-PBGA-B357

3.465V

3.3V

3.135V

50MHz

MICROPROCESSOR, RISC

50MHz

32

32

YES

YES

32

固定点

YES

3.3V

10Mbps (1), 10/100Mbps (1)

1 Core 32-Bit

DRAM

HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

Communications; CPM

2.52mm

25mm

Non-RoHS Compliant

MPC8572ELVTAVNE
MPC8572ELVTAVNE
NXP USA Inc. 数据表

N/A

-

最小起订量: 1

最小包装量: 1

26 Weeks

1023-BFBGA, FCBGA

YES

0°C~105°C TA

Tray

2008

MPC85xx

Obsolete

3 (168 Hours)

5A002

8542.31.00.01

BOTTOM

BALL

1.1V

1mm

MPC8572

S-PBGA-B1023

1.155V

1.045V

1.5GHz

MICROPROCESSOR, RISC

PowerPC e500

133MHz

32

32

YES

YES

32

浮点

YES

1.5V 1.8V 2.5V 3.3V

10/100/1000Mbps (4)

2 Core 32-Bit

DDR2, DDR3

DUART, HSSI, I2C, RapidIO

Signal Processing; SPE, Security; SEC

Cryptography, Random Number Generator

3.38mm

33mm

ROHS3 Compliant

LS2088AXE7V1B
LS2088AXE7V1B
NXP USA Inc. 数据表

2425 In Stock

-

最小起订量: 1

最小包装量: 1

18 Weeks

1292-BFBGA, FCBGA

-40°C~105°C

QorIQ® Layerscape

活跃

3 (168 Hours)

2.0GHz

ARM® Cortex®-A72

10GbE (8) or 1GbE (16) & 2.5GbE (1)

8 Core 64-Bit

DDR4

USB 3.0 (2) + PHY

SATA 6Gbps (2)

ROHS3 Compliant

MCIMX6U8DVM10AB
MCIMX6U8DVM10AB
NXP USA Inc. 数据表

126 In Stock

-

最小起订量: 1

最小包装量: 1

15 Weeks

624-LFBGA

YES

0°C~95°C TJ

Tray

2002

i.MX6DL

不用于新设计

3 (168 Hours)

624

BOTTOM

BALL

未说明

0.8mm

未说明

MCIMX6

S-PBGA-B624

1.5V

1.35V

1.0GHz

MICROPROCESSOR, RISC

ARM® Cortex®-A9

26

YES

YES

64

固定点

YES

1.8V 2.5V 2.8V 3.3V

10/100/1000Mbps (1)

2 Core 32-Bit

LPDDR2, LVDDR3, DDR3

USB 2.0 + PHY (4)

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Multimedia; NEON™ SIMD

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Keypad, LCD

1.6mm

21mm

ROHS3 Compliant

MCIMX6X1EVO10AB
MCIMX6X1EVO10AB
NXP USA Inc. 数据表

5 In Stock

-

最小起订量: 1

最小包装量: 1

15 Weeks

400-LFBGA

YES

179

Commercial grade

-20°C~105°C TJ

Tray

2014

i.MX6SX

活跃

3 (168 Hours)

400

5A992

8542.31.00.01

BOTTOM

BALL

0.8mm

S-PBGA-B400

1.5V

1.35V

227MHz, 1GHz

MICROPROCESSOR, RISC

ARM® Cortex®-A9, ARM® Cortex®-M4

1000MHz

15

YES

32

1.8V 2.5V 2.8V 3.15V

10/100/1000Mbps (2)

2 Core 32-Bit

LPDDR2, LVDDR3, DDR3

USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)

AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART

6

Multimedia; NEON™ MPE

CAN, ETHERNET, I2C, I2S, PCI, SPI, UART, USB

A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE

Keypad, LCD

1.53mm

17mm

ROHS3 Compliant

MCIMX6X1CVK08AB
MCIMX6X1CVK08AB
NXP USA Inc. 数据表

30 In Stock

-

最小起订量: 1

最小包装量: 1

15 Weeks

400-LFBGA

YES

-40°C~105°C TA

Tray

2002

i.MX6SX

e1

活跃

3 (168 Hours)

400

5A992

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

260

0.8mm

40

S-PBGA-B400

1.5V

1.275V

200MHz, 800MHz

MICROPROCESSOR, RISC

ARM® Cortex®-A9, ARM® Cortex®-M4

15

YES

YES

32

浮点

YES

1.8V 2.5V 2.8V 3.15V

10/100/1000Mbps (2)

2 Core 32-Bit

LPDDR2, LVDDR3, DDR3

USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)

AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART

Multimedia; NEON™ MPE

A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE

Keypad, LCD

1.3mm

14mm

ROHS3 Compliant

MCIMX6S6AVM10AD
MCIMX6S6AVM10AD
NXP USA Inc. 数据表

3000 In Stock

-

最小起订量: 1

最小包装量: 1

14 Weeks

624-LFBGA

YES

-40°C~125°C TJ

Tray

i.MX6S

e1

活跃

3 (168 Hours)

624

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

260

0.8mm

40

S-PBGA-B624

1.5V

1.4V

1GHz

MICROPROCESSOR, RISC

ARM® Cortex®-A9

16

YES

YES

32

浮点

YES

1.8V 2.5V 2.8V 3.3V

10/100/1000Mbps (1)

1 Core 32-Bit

LPDDR2, LVDDR3, DDR3

USB 2.0 + PHY (4)

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Multimedia; NEON™ SIMD

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Keypad, LCD

1.6mm

21mm

ROHS3 Compliant

MCIMX6Q5EYM10ACR
MCIMX6Q5EYM10ACR
NXP USA Inc. 数据表

12 In Stock

-

最小起订量: 1

最小包装量: 1

15 Weeks

624-LFBGA, FCBGA

YES

-20°C~105°C TJ

Tape & Reel (TR)

2002

i.MX6Q

e1

不用于新设计

3 (168 Hours)

624

5A992

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

260

1.4V

0.8mm

40

MCIMX6

S-PBGA-B624

1.5V

1.35V

1.0GHz

MICROPROCESSOR

ARM® Cortex®-A9

16

YES

YES

64

固定点

YES

1.8V 2.5V 2.8V 3.3V

10/100/1000Mbps (1)

4 Core 32-Bit

LPDDR2, LVDDR3, DDR3

USB 2.0 + PHY (4)

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Multimedia; NEON™ SIMD

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Keypad, LCD

SATA 3Gbps (1)

1.6mm

21mm

ROHS3 Compliant

MCIMX6Y0DVM05AB
MCIMX6Y0DVM05AB
NXP USA Inc. 数据表

5364 In Stock

-

最小起订量: 1

最小包装量: 1

12 Weeks

289-LFBGA

0°C~95°C TJ

Tray

2015

i.MX6

活跃

3 (168 Hours)

8542.39.00.01

260

40

528MHz

ARM® Cortex®-A7

1.8V 2.8V 3.3V

10/100Mbps (1)

1 Core 32-Bit

LPDDR2, DDR3, DDR3L

USB 2.0 OTG + PHY (1)

I2C, SPI, UART

Multimedia; NEON™ MPE

A-HAB, ARM TZ, CSU, SJC, SNVS

Electrophoretic, LCD

ROHS3 Compliant

Z8S18020VSG
Z8S18020VSG
Zilog 数据表

300 In Stock

-

最小起订量: 1

最小包装量: 1

13 Weeks

表面贴装

68-LCC (J-Lead)

68

ROMless

0°C~70°C TA

Tube

2000

Z180

e3

yes

活跃

3 (168 Hours)

68

哑光锡

QUAD

J BEND

260

5V

20MHz

40

68

5V

5V

SCI

1MB

MICROPROCESSOR

Z8S180

8

8b

2

20

Z8

NO

YES

固定点

NO

5.0V

1 Core 8-Bit

DRAM

ASCI, CSIO, UART

4.57mm

无SVHC

ROHS3 Compliant

无铅

MPC860PCVR66D4
MPC860PCVR66D4
NXP USA Inc. 数据表

2023 In Stock

-

最小起订量: 1

最小包装量: 1

357-BBGA

YES

-40°C~95°C TA

Tray

1995

MPC8xx

e1

不用于新设计

3 (168 Hours)

357

3A991.A.2

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

245

3.3V

1.27mm

30

MPC860

S-PBGA-B357

3.465V

3.3V

3.135V

66MHz

MICROPROCESSOR, RISC

50MHz

32

32

YES

YES

32

固定点

YES

3.3V

10Mbps (4), 10/100Mbps (1)

1 Core 32-Bit

DRAM

HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

Communications; CPM

2.52mm

25mm

ROHS3 Compliant

MPC850SRVR50BU
MPC850SRVR50BU
NXP USA Inc. 数据表

42 In Stock

-

最小起订量: 1

最小包装量: 1

256-BBGA

YES

0°C~95°C TA

Tray

1997

MPC8xx

e1

Obsolete

3 (168 Hours)

256

3A991.A.2

Tin/Silver/Copper (Sn/Ag/Cu)

8542.31.00.01

BOTTOM

BALL

260

3.3V

1.27mm

40

MPC850

S-PBGA-B256

3.6V

3.3V

3V

50MHz

MICROPROCESSOR, RISC

32

26

YES

YES

32

固定点

YES

3.3V

10Mbps (1)

1 Core 32-Bit

DRAM

USB 1.x (1)

HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART

Communications; CPM

2.54mm

23mm

ROHS3 Compliant

MPC866TZP133A
MPC866TZP133A
NXP USA Inc. 数据表

8750 In Stock

-

最小起订量: 1

最小包装量: 1

8 Weeks

357-BBGA

YES

0°C~95°C TA

Tray

1999

MPC8xx

e0

Obsolete

3 (168 Hours)

357

3A991.A.2

Tin/Lead (Sn/Pb)

8542.31.00.01

BOTTOM

BALL

220

1.8V

1.27mm

30

MPC866

S-PBGA-B357

1.9V

1.83.3V

1.7V

133MHz

MICROPROCESSOR, RISC

133MHz

32

32

YES

YES

32

固定点

YES

3.3V

10Mbps (4), 10/100Mbps (1)

1 Core 32-Bit

DRAM

HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

Communications; CPM

2.52mm

25mm

Non-RoHS Compliant