category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

类别是'category.片上系统（SoC）' (7695)

所有品牌

产品型号	品牌	数据表	库存	价格(含增值税)	数量	底架	安装类型	包装/外壳	表面安装	供应商器件包装	质量	形状	终端数量															厂商																																	操作温度	包装	系列	JESD-609代码	零件状态	端子表面处理	HTS代码	子类别	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	深度	Reach合规守则	基本部件号	JESD-30代码	输出的数量	资历状况	工作电源电压	电源	温度等级	配置	振荡器类型	速度	内存大小	核心处理器	芯尺寸	程序内存大小	连接方式	建筑学	组织结构	测试电流
AGFC019R25A1I1V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	Details	480	Tray	活跃							0.000145 oz	12000	Panjit	Panjit	-40°C ~ 100°C (TJ)	Reel	Agilex F					Diodes & Rectifiers																	1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT				EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Diodes - General Purpose, Power, Switching		FPGA - 1.9M Logic Elements					-	Diodes - General Purpose, Power, Switching
XCVC1502-1MSEVSVA2197	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	SOD-123-2	2197-FCBGA (45x45)	AMD	0.1 uA	200 mW	+ 150 C	0.000353 oz	- 55 C	5000	SMD/SMT	Panjit	Panjit	47 V	Details	586	Tray	活跃							0.1 uA	100 Ohms	0°C ~ 100°C (TJ)	Reel	Versal™ AI Core					Diodes & Rectifiers															Single		600MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe				CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			5 mA			齐纳二极管		Versal™ AI Core FPGA, 800k Logic Cells	0.1 uA				-	齐纳二极管	0.9 mm	1.95 mm	1.35 mm
AGFB008R16A3I3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel			Advanced Energy	Advanced Energy	1	384	Tray	活跃					-40°C ~ 100°C (TJ)		Agilex F					DC-DC Converter																	1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT				EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Non-Isolated DC-DC Converters		FPGA - 764K Logic Elements					-	Non-Isolated DC/DC Converters
XCVM1402-1MSENBVB1024-ES9919	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		1	Amphenol	Amphenol Aerospace	38999	Details	+ 100 C	0 C											D38999 III					Circular Connectors												800 mV																				军规圆形连接器								军规圆形连接器
5CSXFC4C6U23C6N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	672-FBGA	YES	672-UBGA (23x23)	672	FBGA, BGA672,28X28,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA672,28X28,32	1.1 V	未说明	1.07 V	85 °C	有	5CSXFC4C6U23C6N	FBGA	SQUARE	Intel Corporation		活跃	INTEL CORP	1.13 V	5.58					MCU - 181, FPGA - 145	0°C ~ 85°C (TJ)	Tray	Cyclone® V SX		活跃			现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	0.8 mm		compliant	5CSXFC4	S-PBGA-B672	145	不合格		1.1,1.2/3.3,2.5 V	OTHER			925MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT				CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	145			1.85 mm	现场可编程门阵列			FPGA - 40K Logic Elements			40000		--			23 mm	23 mm
5ASXFB3G4F35C5N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	YES	1152-FBGA (35x35)	1152	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	1.1 V	未说明	1.07 V	85 °C	有	5ASXFB3G4F35C5N	BGA	SQUARE	Intel Corporation		生命周期结束	INTEL CORP	1.13 V	5.28					MCU - 208, FPGA - 385	0°C ~ 85°C (TJ)	Tray	Arria V SX	e1	活跃	Tin/Silver/Copper (Sn/Ag/Cu)	8542.39.00.01	现场可编程门阵列		BOTTOM	BALL	未说明	1 mm		compliant	5ASXFB3	S-PBGA-B1152	540	不合格		1.1,1.2/3.3,2.5 V	商业扩展			800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT				EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	540	13207 CLBS		2.7 mm	现场可编程门阵列			FPGA - 350K Logic Elements		13207	350000		--			35 mm	35 mm
5CSXFC6C6U23C6N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	672-FBGA	YES	672-UBGA (23x23)	672		MCU - 181, FPGA - 145	FBGA, BGA672,28X28,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA672,28X28,32	1.1 V	未说明	1.07 V	85 °C	有	5CSXFC6C6U23C6N	FBGA	SQUARE	Intel Corporation		活跃	FPGA - Field Programmable Gate Array Cyclone V SX dual -core ARM Cortex-A9	INTEL CORP	1.13 V	5.56				0°C ~ 85°C (TJ)	Tray	Cyclone® V SX		活跃		8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	0.8 mm		compliant	5CSXFC6	S-PBGA-B672	145	不合格		1.1,1.2/3.3,2.5 V	OTHER			925MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT				CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	145			1.85 mm	现场可编程门阵列			FPGA - 110K Logic Elements			110000		--			23 mm	23 mm
XCZU7EG-2FFVC1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	External	1156-BBGA, FCBGA	1156-FCBGA (35x35)	100 g	Rectangular	AMD			Compliant	360	Tray	XCZU7	活跃		-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																						533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT				CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 504K+ Logic Cells					-			55 mm	44 mm
XCZU46DR-L1FSVH1760I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	AMD 赛灵思					800	574	Tray	活跃			-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC											86											500MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe				CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 930K+ Logic Cells					-		51		38
AGFA022R31C2I3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	Tray	活跃							720	-40°C ~ 100°C (TJ)		Agilex F																						1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT				EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA								FPGA - 2.2M Logic Elements					-
XCVM1502-1LSENFVB1369	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	AMD	活跃									478	Tray	0°C ~ 100°C (TJ)		Versal™ Prime																						400MHz, 1GHz	256KB		Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe				CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA								Versal™ Prime FPGA, 1M Logic Cells					-
AGFB022R24C2E1V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	Tray	活跃							744	0°C ~ 100°C (TJ)		Agilex F																						1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT				EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA								FPGA - 2.2M Logic Elements					-
AGFA022R31C3E4X	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	Tray	活跃							720	0°C ~ 100°C (TJ)		Agilex F																						1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT				EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA								FPGA - 2.2M Logic Elements					-
M2S060TS-VFG784	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-FBGA	784-VFBGA (23x23)	微芯片技术							395	Tray	活跃	56500 LE	+ 85 C	0 C	SMD/SMT	0°C ~ 85°C (TJ)		SmartFusion®2																						166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES				CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA								FPGA - 60K Logic Modules					256KB
AGFA006R16A2I2V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	Tray	活跃							384	-40°C ~ 100°C (TJ)		Agilex F																						1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT				EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA								FPGA - 573K Logic Elements					-
XCVM1502-1MSEVFVC1760	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	AMD					Tray	活跃							*
XCVM1802-2MSIVFVC1760-5189	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1									+ 110 C		- 40 C	1	Xilinx	Xilinx								SOC - Systems on a Chip												800 mV																				System-On-Modules - SOM								SoC FPGA
10AS022E3F27E2SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-672	YES	672	27500 LAB	973471	Intel	Intel / Altera	Arria 10 SoC		2 x 32 kB	-	BGA, BGA672,26X26,40	网格排列	PLASTIC/EPOXY	BGA672,26X26,40	0.9 V	未说明	0.87 V	100 °C	有	10AS022E3F27E2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.46						240	Non-Compliant	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	220000 LE	1	SMD/SMT	0°C ~ 100°C (TJ)	Tray	Arria 10 SX		活跃		8542.39.00.01	SOC - Systems on a Chip	CMOS	BOTTOM	BALL	未说明	1 mm		compliant		S-PBGA-B672	240	不合格		0.9 V	OTHER			1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	240			3.25 mm	现场可编程门阵列	SoC FPGA	FPGA - 220K Logic Elements	220000	2 Core	--	SoC FPGA	27 mm	27 mm
CY8C4146LQS-S273	Infineon	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Surface Mount, Wettable Flank	40-UFQFN Exposed Pad	40-QFN (6x6)	Infineon Technologies	有	4900	Infineon	Infineon Technologies	Details						34	Tray	A/D 16x10b, 12x12b SAR; D/A 2x7b	活跃	-40°C ~ 105°C (TA)	Tray	Automotive, AEC-Q100, PSOC® 4 CY8C4100					SOC - Systems on a Chip																External, Internal	48MHz	8K x 8	1.71V ~ 5.5V	ARM® Cortex®-M0+	Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT	FLASH	32-Bit	64KB (64K x 8)	FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART							ARM Microcontrollers - MCU	-							SoC FPGA
CY8C4147LQE-S273T	Infineon	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Surface Mount, Wettable Flank	40-UFQFN Exposed Pad	40-QFN (6x6)	Infineon Technologies	Tape & Reel (TR)	CY8C4147	A/D 16x10b, 20x12b SAR	活跃	有	2500	Infineon	Infineon Technologies	Details						34	-40°C ~ 125°C (TA)	Reel	Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus					SOC - Systems on a Chip																External, Internal	24MHz	16K x 8	1.71V ~ 5.5V	ARM® Cortex®-M0+	Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT	FLASH	32-Bit	128KB (128K x 8)	FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART							ARM Microcontrollers - MCU	-							SoC FPGA
CY8C4147AZE-S275T	Infineon	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	64-LQFP	64-TQFP (10x10)	Infineon Technologies	Tape & Reel (TR)	CY8C4147	A/D 16x10b, 20x12b SAR	活跃	有	1500	Infineon	Infineon Technologies	Details						54	-40°C ~ 125°C (TA)	Reel	Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus					SOC - Systems on a Chip																Internal	24MHz	16K x 8	1.71V ~ 5.5V	ARM® Cortex®-M0+	Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT	FLASH	32-Bit	128KB (128K x 8)	I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART							ARM Microcontrollers - MCU	-							SoC FPGA
CY8C4126LQA-S453T	Infineon	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Surface Mount, Wettable Flank	40-UFQFN Exposed Pad	40-QFN (6x6)	Infineon Technologies	Tape & Reel (TR)	CY8C4126	A/D 16x10b, 20x12b SAR	活跃	有	2500	Infineon	Infineon Technologies	Details						34	-40°C ~ 85°C (TA)	Reel	PSOC® 4 CY8C4100S Plus					SOC - Systems on a Chip																Internal	24MHz	8K x 8	1.71V ~ 5.5V	ARM® Cortex®-M0+	Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT	FLASH	32-Bit	64KB (64K x 8)	I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART							ARM Microcontrollers - MCU	-							SoC FPGA
CY8C4126LQE-S453	Infineon	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Surface Mount, Wettable Flank	40-UFQFN Exposed Pad	40-QFN (6x6)	Infineon Technologies	4900	Infineon	Infineon Technologies	活跃	Details						34	Tray	A/D 16x10b, 20x12b SAR	有	-40°C ~ 125°C (TA)	Tray	Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus					SOC - Systems on a Chip																Internal	24MHz	8K x 8	1.71V ~ 5.5V	ARM® Cortex®-M0+	Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT	FLASH	32-Bit	64KB (64K x 8)	I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART							ARM Microcontrollers - MCU	-							SoC FPGA
CY8C4126LQA-S453	Infineon	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Surface Mount, Wettable Flank	40-UFQFN Exposed Pad	40-QFN (6x6)	Infineon Technologies	有	4900	Infineon	Infineon Technologies	Details						34	Tray	A/D 16x10b, 20x12b SAR	活跃	-40°C ~ 85°C (TA)	Tray	Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus					SOC - Systems on a Chip																Internal	24MHz	8K x 8	1.71V ~ 5.5V	ARM® Cortex®-M0+	Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT	FLASH	32-Bit	64KB (64K x 8)	I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART							ARM Microcontrollers - MCU	-							SoC FPGA
CY8C4147LQS-S273	Infineon	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Surface Mount, Wettable Flank	40-UFQFN Exposed Pad	40-QFN (6x6)	Infineon Technologies	Tray	CY8C4147	A/D 16x10b, 20x12b SAR	活跃	有	4900	Infineon	Infineon Technologies	Details						34	-40°C ~ 105°C (TA)	Tray	Automotive, AEC-Q100, PSOC® 4 CY8C4100					SOC - Systems on a Chip																External, Internal	24MHz	16K x 8	1.71V ~ 5.5V	ARM® Cortex®-M0+	Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT	FLASH	32-Bit	128KB (128K x 8)	FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART							ARM Microcontrollers - MCU	-							SoC FPGA