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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	安装类型	包装/外壳	表面安装	供应商器件包装	终端数量																		厂商																																操作温度	包装	系列	JESD-609代码	无铅代码	零件状态	终端	端子表面处理	应用	附加功能	HTS代码	子类别	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	深度	Reach合规守则	时间@峰值回流温度-最大值(s)	输出量	引脚数量	JESD-30代码	功能	输出的数量	资历状况	输出电压	输出类型	工作电源电压	电源	温度等级	速度	周边设备	连接方式	建筑学	输入数量	组织结构	座位高度-最大
M2S050-1FG896I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	896-BGA	896-FBGA (31x31)	微芯片技术	Electri-Flex	1.2000 V	377	Tray	M2S050	活跃	-	166 MHz	56340 LE	SMD/SMT	-	64 kB					-40 to 100 °C		SmartFusion®2																			896										166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							1	FPGA - 50K Logic Modules			1 Core		256KB
A2F200M3F-1PQG208I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	208-BFQFP	YES	208-PQFP (28x28)	208	微芯片技术	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.575 V	5.59			1.5000 V	1.425 V	200000	1.575 V	MCU - 22, FPGA - 66	Tray	A2F200	活跃	28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208	FLATPACK, FINE PITCH	3	PLASTIC/EPOXY	QFP208,1.2SQ,20	1.5 V	30	1.425 V	有	A2F200M3F-1PQG208I	100 MHz	FQFP	-40 to 100 °C		SmartFusion®		有			Pure Matte Tin (Sn)			8542.39.00.01	现场可编程门阵列	CMOS	QUAD	鸥翼	245	0.5 mm		compliant				S-PQFP-G208		66	不合格				1.5,1.8,2.5,3.3 V		100MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA	66	4608 CLBS, 200000 GATES	4.1 mm	现场可编程门阵列			1	ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops	4608	4608		200000	256KB						28 mm	28 mm
XCZU11EG-1FFVB1517E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD					RSM40RKM50-10M/S1587/BL67	Turck	0.8500 V	0.808 V	0.892 V	488	Tray	XCZU11	活跃	0 to 100 °C		Zynq® UltraScale+™ MPSoC EG																													500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							1	Zynq®UltraScale+™ FPGA, 653K+ Logic Cells					-
XAZU3EG-L1SFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD					7000-08701-3170750	Murrelektronik	0.7200 V	0.698 V	0.742 V	128	Tray	XAZU3	活跃	-40 to 100 °C		Zynq® UltraScale+™ MPSoC EG																													500MHz, 1.2GHz	1.8MB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, I²C, SPI, UART/USART, USB	MPU, FPGA							1L	Zynq®UltraScale+™ FPGA, 154K+ Logic Cells					-
M2S005-TQG144	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	144-LQFP	144-TQFP (20x20)	微芯片技术	84	Tray	M2S005	活跃	有	-	191 kbit	166 MHz	6060 LE	+ 85 C	0.035380 oz	0 C	60	SMD/SMT	505 LAB	Microchip	Microchip Technology / Atmel	Details	-	64 kB					0°C ~ 85°C (TJ)	Tray	SmartFusion®2									SOC - Systems on a Chip																	1.2 V			166MHz	64KB	ARM® Cortex®-M3	-	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					SoC FPGA			FPGA - 5K Logic Modules			1 Core		128KB				SoC FPGA
A2F060M3E-CSG288	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	288	MICROSEMI CORP	1.575 V	8.46						TFBGA,	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	1.5 V	1.425 V	85 °C	A2F060M3E-CSG288	TFBGA	SQUARE	Microsemi Corporation	Obsolete											8542.39.00.01		CMOS	BOTTOM	BALL		0.5 mm		compliant				S-PBGA-B288								OTHER									1536 CLBS, 60000 GATES	1.05 mm	现场可编程门阵列					1536			60000										11 mm	11 mm
A2F060M3E-1FGG256	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	256	GRID ARRAY, LOW PROFILE	3	PLASTIC/EPOXY	BGA256,16X16,40	1.5 V	30	1.425 V	85 °C	有	A2F060M3E-1FGG256	100 MHz	LBGA	SQUARE	Microsemi Corporation	Obsolete	MICROSEMI CORP		1.575 V	5.8					LBGA, BGA256,16X16,40				e1				Tin/Silver/Copper (Sn/Ag/Cu)			8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	250	1 mm		compliant				S-PBGA-B256		66	不合格				1.5,1.8,2.5,3.3 V	OTHER								66	1536 CLBS, 60000 GATES	1.7 mm	现场可编程门阵列					1536	1536		60000										17 mm	17 mm
M2S050T-FG484I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BGA	484-FPBGA (23x23)	微芯片技术	56340 LE	SMD/SMT	-	64 kB					267	Tray	M2S050	活跃	-	166 MHz	-40°C ~ 100°C (TJ)		SmartFusion®2																													166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							STD	FPGA - 50K Logic Modules			1 Core		256KB
A2F060M3E-1CSG288I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	288	30	1.425 V	有	A2F060M3E-1CSG288I	100 MHz	TFBGA	SQUARE	Microsemi Corporation	Obsolete	MICROSEMI CORP	1.575 V	5.25						TFBGA, BGA288,21X21,20	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA288,21X21,20	1.5 V				e1				锡银铜			8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	260	0.5 mm		compliant				S-PBGA-B288		68	不合格				1.5,1.8,2.5,3.3 V									68	1536 CLBS, 60000 GATES	1.05 mm	现场可编程门阵列					1536	1536		60000										11 mm	11 mm
M2S060T-VFG400I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	400-LFBGA	400-VFBGA (17x17)	微芯片技术	1.2000 V	1.14 V	1.26 V	Non-Compliant	207	Tray	M2S060	活跃	-	166 MHz	56520 LE	-	64 kB				-40 to 100 °C		SmartFusion®2																													166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							STD	FPGA - 60K Logic Modules			1 Core		256KB
M2S025-VFG400I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	400-VFBGA (17x17)	微芯片技术	SMD/SMT	2308 LAB	Microchip	Microchip Technology / Atmel	Details	-	64 kB	207	Tray	M2S025	活跃					有	-	166 MHz	27696 LE	0.227784 oz	90	-40°C ~ 100°C (TJ)	Tray	SmartFusion2									SOC - Systems on a Chip																				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					SoC FPGA		STD	FPGA - 25K Logic Modules			1 Core		256KB				SoC FPGA
A2F060M3E-CS288I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	288	20	1.425 V	无	A2F060M3E-CS288I	80 MHz	TFBGA	SQUARE	Microsemi Corporation	Obsolete	MICROSEMI CORP	1.575 V	5.84						11 X 11 MM, 1.05 MM HEIGHT, 0.50 MM PITCH, BGA-288	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA288,21X21,20	1.5 V				e0				Tin/Lead/Silver (Sn/Pb/Ag)			8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	235	0.5 mm		compliant				S-PBGA-B288		68	不合格				1.5,1.8,2.5,3.3 V									68	1536 CLBS, 60000 GATES	1.05 mm	现场可编程门阵列					1536	1536		60000										11 mm	11 mm
A2F060M3E-1FG256	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	256	GRID ARRAY, LOW PROFILE	3	PLASTIC/EPOXY	BGA256,16X16,40	1.5 V	20	1.425 V	85 °C	无	A2F060M3E-1FG256	100 MHz	LBGA	SQUARE	Microsemi Corporation	Obsolete	MICROSEMI CORP		1.575 V	5.84					1 MM PITCH, FBGA-256				e0				Tin/Lead (Sn/Pb)			8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	225	1 mm		unknown				S-PBGA-B256		66	不合格				1.5,1.8,2.5,3.3 V	OTHER								66	1536 CLBS, 60000 GATES	1.7 mm	现场可编程门阵列					1536	1536		60000										17 mm	17 mm
M2S025T-1VFG256I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	256-LBGA	256-FPBGA (17x17)	微芯片技术	Tray	M2S025	活跃	-	166 MHz	27696 LE	SMD/SMT	-	64 kB				1.2000 V	Compliant	138	-40 to 100 °C		SmartFusion®2																													166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							1	FPGA - 25K Logic Modules			1 Core		256KB
A2F060M3E-TQG144I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	144	PLASTIC/EPOXY	QFP144,.87SQ,20	1.5 V	30	1.425 V	有	A2F060M3E-TQG144I	80 MHz	LFQFP	SQUARE	Microsemi Corporation	Obsolete	MICROSEMI CORP	1.575 V		8.63					LFQFP, QFP144,.87SQ,20	FLATPACK, LOW PROFILE, FINE PITCH	3				e3				PURE MATTE TIN (394)			8542.39.00.01	现场可编程门阵列	CMOS	QUAD	鸥翼	250	0.5 mm		compliant				S-PQFP-G144		33	不合格				1.5,1.8,2.5,3.3 V									33	1536 CLBS, 60000 GATES	1.6 mm	现场可编程门阵列					1536	1536		60000										20 mm	20 mm
5CSXFC2C6U23I7LN	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1									Tray	*			活跃
XCZU4CG-1FBVB900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	AMD					XTAE080FS1TD5E100	Cutler Hammer, Div of Eaton Co	0.8500 V	0.808 V	0.892 V	204	Tray	XCZU4	活跃	-40 to 100 °C		Zynq® UltraScale+™ MPSoC CG																													500MHz, 1.2GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							1	Zynq®UltraScale+™ FPGA, 192K+ Logic Cells					-
M2S025-1FG484I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BGA	484-FPBGA (23x23)	微芯片技术	166 MHz	27696 LE	SMD/SMT	-	64 kB					Clarostat-Honeywell	73JA500	1.2000 V	1.14 V	1.26 V	267	Tray	M2S025	活跃	-	-40 to 100 °C		SmartFusion®2																													166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							1	FPGA - 25K Logic Modules			1 Core		256KB
M2S060T-FCSG325I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	DIN Rail,Surface	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	微芯片技术	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	2.36	SHS1S24A	CSA, UL	Syrelec, Brand of Crouzet Control	无	1	1.2000 V	1.14 V	1.26 V	8542390000	200	Tray	M2S060	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	1.14 V	有	-40 to 100 °C		SmartFusion®2	e1			0.250 in Flat Blade	Tin/Silver/Copper (Sn/Ag/Cu)		LG-MIN, WD-MIN		现场可编程门阵列	CMOS	BOTTOM	BALL	250	0.5 mm		compliant	40			S-PBGA-B325		200	不合格				1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200		1.01 mm	现场可编程门阵列			STD	FPGA - 60K Logic Modules		56520			256KB	Interval		固态	IP66		11 mm	11 mm	无铅
M2S150-FCG1152	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	1152-FCBGA (35x35)	微芯片技术					HS350100G134C	Hollowshaft	Hollow	Danaher Controls	1.2000 V	574	Tray	M2S150	活跃	-40 to 70 Degrees C		SmartFusion®2				6 ft Cable																				5~26 VDC	Differential				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							STD	FPGA - 150K Logic Modules					512KB			5~26 VDC			有	IP67	不包括
XCZU17EG-2FFVC1760E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	AMD	XCZU17	活跃					Miscellaneous	512	Tray	0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																													533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 926K+ Logic Cells					-
XCZU7EV-3FFVF1517E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD	464	Tray	XCZU7	活跃					QAA1011.AATU	Siemens Building Technologies	无显示	0.927 V	0.873 V	0.9000 V	0 to 100 °C		Zynq® UltraScale+™ MPSoC EV						Indoor												1 kOhm Platinum RTD			Temperature								600MHz, 1.5GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							3	Zynq®UltraScale+™ FPGA, 504K+ Logic Cells					-
M2S150T-FCS536I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	536-LFBGA, CSPBGA	YES	536-CSPBGA (16x16)	536	微芯片技术	1.14 V	无	M2S150T-FCS536I	BGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.81			1.2000 V	1.14 V	1.26 V	293	Tray	M2S150	活跃	-	166 MHz	146124 LE	-	64 kB	FBGA-536	网格排列	PLASTIC/EPOXY	BGA536,30X30,20	1.2 V	30	-40 to 100 °C		SmartFusion®2	e0				Tin/Lead (Sn/Pb)			8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	240			not_compliant			536	S-PBGA-B536		293	不合格				1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	293			现场可编程门阵列			STD	FPGA - 150K Logic Modules		146124	1 Core		512KB
M2S060TS-1VFG400T2	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA	400-VFBGA (17x17)	微芯片技术				IRTR68	Miscellaneous	207	Tray	M2S060	活跃	,	3	40	有	活跃	MICROSEMI CORP	5.8		-40°C ~ 125°C (TJ)		Automotive, AEC-Q100, SmartFusion®2	e1	有			Tin/Silver/Copper (Sn/Ag/Cu)								250			compliant													166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA				现场可编程门阵列			1	FPGA - 60K Logic Modules					256KB
M2S060TS-1FGG676T2	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	676-BGA	676-FBGA (27x27)	微芯片技术	387	M2S060	活跃					JHSN_DRIV_VSD-II	VS027431B-SM1P3	Johnson Controls	Panel	-40°C ~ 125°C (TJ)		Automotive, AEC-Q100, SmartFusion®2															15.3125														166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						320 Hz	1	FPGA - 60K Logic Modules					256KB		480 VAC								9.40625