类别是'category.片上系统(SoC)' (7695)

  • 所有品牌

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

包装/外壳

表面安装

供应商器件包装

终端数量

厂商

操作温度

包装

系列

尺寸/尺寸

容差

零件状态

终止次数

温度系数

类型

电阻

组成

功率(瓦特)

HTS代码

子类别

技术

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

JESD-30代码

输出的数量

资历状况

失败率

电源

温度等级

界面

速度

内存大小

核心处理器

周边设备

程序内存大小

连接方式

建筑学

输入数量

座位高度-最大

可编程逻辑类型

产品类别

主要属性

逻辑单元数

核数量

闪光大小

特征

产品类别

座位高度(最大)

长度

宽度

XCZU1EG-L2SFVC784E
XCZU1EG-L2SFVC784E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Axial

Axial

AMD

Tray

活跃

-

-55°C ~ 150°C

Bulk

PTF

0.145 Dia x 0.375 L (3.68mm x 9.53mm)

±0.1%

活跃

2

±15ppm/°C

150 kOhms

Metal Film

0.25W, 1/4W

--

CAN/Serial I2C/SPI/U

533MHz, 600MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

MPU, FPGA

-

-

Moisture Resistant

--

10AS016C3U19I2LG
10AS016C3U19I2LG
ALTERA 数据表

548 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA, FCBGA

YES

484-UBGA (19x19)

484

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

160000 LE

0.423288 oz

1

SMD/SMT

20000 LAB

964675

Intel

Intel / Altera

Arria 10 SoC

2 x 32 kB

-

FBGA, BGA484,22X22,32

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

BGA484,22X22,32

-40 °C

0.9 V

未说明

0.87 V

100 °C

10AS016C3U19I2LG

FBGA

SQUARE

活跃

INTEL CORP

0.93 V

5.47

192

Non-Compliant

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

0.8 mm

compliant

S-PBGA-B484

192

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

192

3.25 mm

现场可编程门阵列

SoC FPGA

FPGA - 160K Logic Elements

160000

2 Core

--

SoC FPGA

19 mm

19 mm

XCVM1302-2MSENSVF1369
XCVM1302-2MSENSVF1369
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1369-BFBGA

1369-BGA (35x35)

AMD

Tray

活跃

316

0°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.4GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XCZU55DR-1FSVE1156I
XCZU55DR-1FSVE1156I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

Tray

活跃

-

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC DR

500MHz, 1.2GHz

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Zynq® UltraScale+™ RFSoC

-

XAZU1EG-1SFVC784Q
XAZU1EG-1SFVC784Q
AMD 数据表

590 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

Tray

活跃

180

-40°C ~ 125°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Zynq®UltraScale+™ FPGA, 82K Logic Cells

-

XCVM1402-2MSIVSVD1760
XCVM1402-2MSIVSVD1760
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

Tray

726

活跃

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.4GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-

XCZU55DR-2FSVE1156I
XCZU55DR-2FSVE1156I
AMD 数据表

775 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

Tray

活跃

-

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC DR

533MHz, 1.3GHz

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Zynq® UltraScale+™ RFSoC

-

XCZU55DR-L1FFVE1156I
XCZU55DR-L1FFVE1156I
AMD 数据表

927 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

Tray

活跃

-

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC DR

500MHz, 1.2GHz

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Zynq® UltraScale+™ RFSoC

-

XCVC1802-2MSEVIVA1596
XCVC1802-2MSEVIVA1596
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Axial

Axial

AMD

Tray

活跃

500

-55°C ~ 150°C

Tape & Reel (TR)

PTF

0.145 Dia x 0.375 L (3.68mm x 9.53mm)

±0.1%

活跃

2

±15ppm/°C

715 kOhms

Metal Film

0.25W, 1/4W

--

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

Moisture Resistant

--

XCZU57DR-2FSVE1156I
XCZU57DR-2FSVE1156I
AMD 数据表

669 In Stock

-

最小起订量: 1

最小包装量: 1

Axial

Axial

AMD

Tray

活跃

-

-55°C ~ 150°C

Tape & Reel (TR)

PTF

0.145 Dia x 0.375 L (3.68mm x 9.53mm)

±0.1%

活跃

2

±5ppm/°C

243 Ohms

Metal Film

0.25W, 1/4W

--

533MHz, 1.3GHz

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Zynq® UltraScale+™ RFSoC

-

Moisture Resistant

--

XCZU1EG-1SFVA625I
XCZU1EG-1SFVA625I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

AMD

Tray

活跃

-

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™

CAN/Serial I2C/SPI/U

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

MPU, FPGA

-

-

XCVM1402-2LSEVFVC1596
XCVM1402-2LSEVFVC1596
AMD 数据表

577 In Stock

-

最小起订量: 1

最小包装量: 1

1596-BFBGA

1596-BGA (37.5x37.5)

AMD

Tray

活跃

748

0°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-

XCVM1302-2MSEVSVD1760
XCVM1302-2MSEVSVD1760
AMD 数据表

841 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

Tray

活跃

402

0°C ~ 100°C (TJ)

Versal™ Prime

Adaptive Compute Acc

600MHz, 1.4GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XCVC1902-2HSIVSVA2197
XCVC1902-2HSIVSVA2197
AMD 数据表

726 In Stock

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

Tray

活跃

770

-40°C ~ 100°C (TJ)

Versal™ AI Core

800MHz, 1.65GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

XCVM1302-1LLINBVB1024
XCVM1302-1LLINBVB1024
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1024-BFBGA

1024-BGA (31x31)

AMD

Tray

活跃

316

-40°C ~ 100°C (TJ)

Versal™ Prime

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XCZU1EG-2UBVA494I
XCZU1EG-2UBVA494I
AMD 数据表

2157 In Stock

-

最小起订量: 1

最小包装量: 1

494-WFBGA, FCBGA

494-FCBGA (14x14)

AMD

Tray

活跃

180

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

MPU, FPGA

Zynq®UltraScale+™ FPGA, 81K+ Logic Cells

-

XCZU1EG-2SFVC784E
XCZU1EG-2SFVC784E
AMD 数据表

2818 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

Tray

活跃

-

0°C ~ 100°C (TJ)

Zynq® UltraScale+™

CAN/Serial I2C/SPI/U

533MHz, 600MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

MPU, FPGA

-

-

XCZU1CG-L1SFVC784I
XCZU1CG-L1SFVC784I
AMD 数据表

2589 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

Tray

活跃

-

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™

CAN/Serial I2C/SPI/U

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

-

MPU, FPGA

-

-

XAZU1EG-1SFVC784I
XAZU1EG-1SFVC784I
AMD 数据表

2651 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

Tray

活跃

-

XCZU1CG-L2SFVC784E
XCZU1CG-L2SFVC784E
AMD 数据表

2475 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

Tray

活跃

-

0°C ~ 100°C (TJ)

Zynq® UltraScale+™

CAN/Serial I2C/SPI/U

533MHz, 1.333GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

-

MPU, FPGA

-

-

XCVC1802-1MLIVSVA2197
XCVC1802-1MLIVSVA2197
AMD 数据表

515 In Stock

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

Tray

活跃

770

-40°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

XCZU65DR-L1FFVE1156I
XCZU65DR-L1FFVE1156I
AMD 数据表

783 In Stock

-

最小起订量: 1

最小包装量: 1

XCZU43DR-1FSVE1156E
XCZU43DR-1FSVE1156E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

Tray

活跃

366

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU47DR-1FSVG1517I
XCZU47DR-1FSVG1517I
AMD 数据表

596 In Stock

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

Tray

活跃

561

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCVM1302-2MSIVFVC1596
XCVM1302-2MSIVFVC1596
AMD 数据表

880 In Stock

-

最小起订量: 1

最小包装量: 1

1596-BFBGA

1596-BGA (37.5x37.5)

AMD

Tray

活跃

532

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.4GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-