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类别是'category.片上系统（SoC）' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 材料 | 终端数量 | 电阻材料 | 厂商 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | 零件状态 | 湿度敏感性等级(MSL) | 温度系数 | 类型 | 颜色 | 功率(瓦特) | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 端子间距 | Reach合规守则 | 频率 | 频率稳定性 | 输出量 | 终端样式 | JESD-30代码 | 功能 | 基本谐振器 | 最大电流源 | 执行器类型 | 温度等级 | 电流 - 电源（禁用）（最大值） | 速度 | 内存大小 | 核心处理器 | 周边设备 | 连接方式 | 建筑学 | 座位高度-最大 | 可编程逻辑类型 | 套管螺纹 | 调整类型 | 转弯数量 | 评估套件 | 锥度 | 速度等级 | 内置开关 | 绝对牵引范围 (APR) | 执行器直径 | 主要属性 | 轮调 | 插座数量 | 电阻(欧姆) | 发光二极管 | 闪光大小 | 座位高度(最大) | 长度 | 宽度 | 执行器长度 | 辐射硬化 | 评级结果 | ||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 10AS027H1F34I1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | Non-Compliant | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | 网格排列 | PLASTIC/EPOXY | -40 °C | 0.9 V | 0.87 V | 100 °C | 有 | 10AS027H1F34I1SG | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 0.93 V | 5.64 | 384 | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Discontinued at Digi-Key | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.65 mm | 现场可编程门阵列 | FPGA - 270K Logic Elements | -- | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||
| XCZU2EG-1SFVA625I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | 180 | Tray | XCZU2 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU3EG-2SFVC784E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 252 | Tray | XCZU3 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU17EG-2FFVC1760I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | Tray | XCZU17 | 活跃 | -- | 512 | -40°C ~ 100°C (TJ) | * | 活跃 | -- | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU19EG-1FFVB1517I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 面板安装 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | Carbon | AMD | -- | 644 | Tray | XCZU19 | 活跃 | -40°C ~ 100°C (TJ) | Bulk | RV4 | ±10% | 活跃 | -- | -- | 2W | 焊片 | Slotted | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3/8-32 | 用户定义 | 1 | Linear | None | 0.249 (6.32mm) | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | 314° | 1 | 100k | - | 0.875 (22.23mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU4CG-2FBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | Nylon | AMD | 活跃 | -- | 204 | Tray | XCZU4 | 0°C ~ 100°C (TJ) | RL2 | 活跃 | -- | White | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | 所有矩形LED | - | 0.330 (8.38mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1302-1MSENBVB1024 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD | 316 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1302-2LSENBVB1024 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD | 316 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1402-2LLEVFVC1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 748 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1302-1LSIVFVC1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 532 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1402-2MLIVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 748 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1802-1MSIVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 770 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1402-2HSIVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 726 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ Prime | 800MHz, 1.65GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU43DR-1FSVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | 366 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1802-1LSEVSVA2197 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD 赛灵思 | 770 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU48DR-L2FFVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | Non-Compliant | 366 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU48DR-1FFVG1517I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD 赛灵思 | 561 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU47DR-1FFVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | Non-Compliant | 366 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 有 | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU48DR-1FFVG1517E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD 赛灵思 | 561 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU7CG-1FFVF1517I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | 1517-FCBGA (40x40) | AMD | 464 | Tray | XCZU7 | 活跃 | -40°C ~ 85°C | Tape & Reel (TR) | SiT8208 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | 活跃 | XO (Standard) | 1.8V | 25.000625MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 31mA | 30mA | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | -- | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | 0.039 (1.00mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU7EG-2FFVF1517I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | 1517-FCBGA (40x40) | AMD | 464 | Tray | XCZU7 | 活跃 | -40°C ~ 85°C | Tape & Reel (TR) | SiT8208 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | 活跃 | XO (Standard) | 2.5V | 24MHz | ±10ppm | LVCMOS, LVTTL | Standby (Power Down) | MEMS | 33mA | 70µA | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -- | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | 0.039 (1.00mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU5EV-L2SFVC784E | AMD | 数据表 | 2 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | 784-FCBGA (23x23) | AMD | 252 | Tray | XCZU5 | 活跃 | -40°C ~ 85°C | Tape & Reel (TR) | SiT8208 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | 活跃 | XO (Standard) | 2.8V | 24MHz | ±10ppm | LVCMOS, LVTTL | Standby (Power Down) | MEMS | 33mA | 70µA | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2L | -- | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | 0.039 (1.00mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU17EG-1FFVB1517E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | 1517-FCBGA (40x40) | AMD | 644 | Tray | XCZU17 | 活跃 | -40°C ~ 85°C | Tape & Reel (TR) | SiT8209 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | 活跃 | XO (Standard) | 1.8V | 133.3333MHz | ±10ppm | LVCMOS, LVTTL | Standby (Power Down) | MEMS | 33mA | 10µA | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | -- | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | 0.032 (0.80mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU3EG-L1SBVA484I | AMD | 数据表 | 943 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 6-SMD, No Lead | 484-FCBGA (19x19) | AMD | 82 | Tray | XCZU3 | 活跃 | -20°C ~ 70°C | Tape & Reel (TR) | SiT9120 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | 活跃 | XO (Standard) | 3.3V | 166.6MHz | ±10ppm | LVDS | Enable/Disable | MEMS | 55mA | 35mA | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -- | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | 0.032 (0.80mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU11EG-1FFVC1760I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | 1760-FCBGA (42.5x42.5) | AMD | 512 | Tray | XCZU11 | 活跃 | -20°C ~ 70°C | Tape & Reel (TR) | SiT8208 | 0.106 L x 0.094 W (2.70mm x 2.40mm) | 活跃 | XO (Standard) | 1.8V | 33.33333MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 31mA | 30mA | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -- | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | 0.032 (0.80mm) | -- |
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10AS027H1F34I1SG
ALTERA
分类:Embedded - System On Chip (SoC)
-
XCZU2EG-1SFVA625I
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU3EG-2SFVC784E
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU17EG-2FFVC1760I
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU19EG-1FFVB1517I
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU4CG-2FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1302-1MSENBVB1024
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1302-2LSENBVB1024
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1402-2LLEVFVC1596
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1302-1LSIVFVC1596
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1402-2MLIVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1802-1MSIVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1402-2HSIVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU43DR-1FSVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCVC1802-1LSEVSVA2197
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU48DR-L2FFVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU48DR-1FFVG1517I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU47DR-1FFVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU48DR-1FFVG1517E
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU7CG-1FFVF1517I
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU7EG-2FFVF1517I
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU5EV-L2SFVC784E
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU17EG-1FFVB1517E
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU3EG-L1SBVA484I
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU11EG-1FFVC1760I
AMD
分类:Embedded - System On Chip (SoC)