category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	包装/外壳	表面安装	供应商器件包装	终端数量					厂商																			操作温度	包装	系列	JESD-609代码	零件状态	端子表面处理	子类别	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	基本部件号	JESD-30代码	输出的数量	资历状况	电源	温度等级	速度	内存大小	核心处理器	周边设备	连接方式	建筑学	输入数量	组织结构	座位高度-最大	可编程逻辑类型	主要属性	逻辑块数量
AGFA008R16A2I1V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	活跃			384	Tray	-40°C ~ 100°C (TJ)		Agilex F																	1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					FPGA - 764K Logic Elements			-
10AS027E1F27E1SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	672-BBGA, FCBGA	672-FBGA (27x27)			240	Non-Compliant		0°C ~ 100°C (TJ)	Tray	Arria 10 SX		Discontinued at Digi-Key															1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					FPGA - 270K Logic Elements			--
10AS057H2F34E1SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	1152-FCBGA (35x35)	492				0°C ~ 100°C (TJ)	Tray	Arria 10 SX		Discontinued at Digi-Key															1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					FPGA - 570K Logic Elements			--
AGFA027R31C2I3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	活跃			720	Tray	-40°C ~ 100°C (TJ)		Agilex F																	1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					FPGA - 2.7M Logic Elements			-
XCVC1902-2LLEVSVD1760	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD	活跃			692	Tray	0°C ~ 100°C (TJ)		Versal™ AI Core																	450MHz, 1.08GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					Versal™ AI Core FPGA, 1.9M Logic Cells			-
XC7Z020-3CLG400E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA, CSPBGA	400-CSPBGA (17x17)	AMD			130	Tray	XC7Z020	活跃	0°C ~ 100°C (TJ)		Zynq®-7000																	866MHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Artix™-7 FPGA, 85K Logic Cells			-
5CSEBA4U19C6N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-FBGA	YES	484-UBGA (19x19)	484		BGA484,22X22,32	1.1 V	未说明	1.07 V	85 °C	有	5CSEBA4U19C6N	FBGA	SQUARE	Intel Corporation	活跃	INTEL CORP	1.13 V	5.58	MCU - 151, FPGA - 66	FBGA, BGA484,22X22,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	0°C ~ 85°C (TJ)	Tray	Cyclone® V SE		活跃		现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	0.8 mm	compliant		S-PBGA-B484	66	不合格	1.1,1.2/3.3,2.5 V	OTHER	925MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	66		1.9 mm	现场可编程门阵列	FPGA - 40K Logic Elements		40000	--	19 mm	19 mm
5CSEMA6U23I7N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	672-FBGA	672-UBGA (23x23)	MCU - 181, FPGA - 145				-40°C ~ 100°C (TJ)	Tray	Cyclone® V SE		活跃									5CSEMA6						800MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					FPGA - 110K Logic Elements			--
5ASXFB5G6F35C6N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	1152-FBGA (35x35)	MCU - 208, FPGA - 385				0°C ~ 85°C (TJ)	Tray	Arria V SX		活跃									5ASXFB5						700MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					FPGA - 462K Logic Elements			--
5ASXBB3D4F40C5N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	YES	1517-FBGA (40x40)	1517		BGA1517,39X39,40	1.1 V	未说明	1.07 V	85 °C	有	5ASXBB3D4F40C5N	BGA	SQUARE	Intel Corporation	生命周期结束	INTEL CORP	1.13 V	5.28	MCU - 208, FPGA - 540	FBGA-1517	网格排列	PLASTIC/EPOXY	0°C ~ 85°C (TJ)	Tray	Arria V SX	e1	活跃	Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM	BALL	未说明	1 mm	compliant	5ASXBB3	S-PBGA-B1517	540			商业扩展	800MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	540	13207 CLBS	2.7 mm	现场可编程门阵列	FPGA - 350K Logic Elements	13207	350000	--	40 mm	40 mm
5ASXBB5D6F40C6N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	YES	1517-FBGA (40x40)	1517	1.1 V	1.07 V	85 °C	5ASXBB5D6F40C6N	BGA	SQUARE	Intel Corporation	生命周期结束	INTEL CORP	1.13 V	5.28	MCU - 208, FPGA - 540	FBGA-1517	网格排列	PLASTIC/EPOXY		BGA1517,39X39,40	0°C ~ 85°C (TJ)	Tray	Arria V SX		活跃				BOTTOM	BALL		1 mm	compliant	5ASXBB5	S-PBGA-B1517	540			商业扩展	700MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	540	17434 CLBS	2.7 mm	现场可编程门阵列	FPGA - 462K Logic Elements	17434	462000	--	40 mm	40 mm
AGFB022R24C2I3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	活跃			744	Tray	-40°C ~ 100°C (TJ)		Agilex F																	1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					FPGA - 2.2M Logic Elements			-
XCZU6EG-1FFVB1156E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD			328	Tray	XCZU6	活跃	0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																	500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 469K+ Logic Cells			-
XCZU1CG-1SFVA625E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	625-BFBGA, FCBGA	625-FCBGA (21x21)	AMD	活跃			-	Tray	0°C ~ 100°C (TJ)		Zynq® UltraScale+™																	500MHz, 1.2GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	-	MPU, FPGA					-			-
XC7Z030-3FBG676E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	676-BBGA, FCBGA	676-FCBGA (27x27)	AMD			130	Tray	XC7Z030	活跃	0°C ~ 100°C (TJ)		Zynq®-7000																	1GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Kintex™-7 FPGA, 125K Logic Cells			-
XCVP1502-1MSEVSVA2785	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2785-BFBGA	2785-BGA (50x50)	AMD	活跃			702	Tray	0°C ~ 100°C (TJ)		Versal® Premium																	600MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					Versal™ Premium FPGA, 3.7M Logic Cells			-
XCVC1802-2LLEVSVA2197	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD	活跃			770	Tray	0°C ~ 100°C (TJ)		Versal™ AI Core																	450MHz, 1.08GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					Versal™ AI Core FPGA, 1.5M Logic Cells			-
XCVC1702-2LSEVSVA2197	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD	活跃			608	Tray	0°C ~ 100°C (TJ)		Versal™ AI Core																	450MHz, 1.08GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					Versal™ AI Core FPGA, 1M Logic Cells			-
AGFB022R31C2I2VAA	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	活跃			720	Tray	-40°C ~ 100°C (TJ)		Agilex F																	1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					FPGA - 2.2M Logic Elements			-
AGFD019R25A3E4X	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	活跃			480	Tray	0°C ~ 100°C (TJ)		Agilex F																	1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					FPGA - 1.9M Logic Elements			-
XCZU7EV-2FFVF1517E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD			464	Tray	XCZU7	活跃	0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EV																	533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 504K+ Logic Cells			-
AGFB006R16A2E4X	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	活跃			384	Tray	0°C ~ 100°C (TJ)		Agilex F																	1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					FPGA - 573K Logic Elements			-
MPFS460T-FCG1152EPP	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	1152-FCBGA (35x35)	微芯片技术	活跃			MCU - 136, FPGA - 468	Tray	0°C ~ 100°C		PolarFire™																	-	3.95MB	RISC-V	DMA, PCI, PWM	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA					FPGA - 461K Logic Modules			128kB
AGFC019R25A3I3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	活跃			480	Tray	-40°C ~ 100°C (TJ)		Agilex F																	1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					FPGA - 1.9M Logic Elements			-
AGFB006R24C2E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	576			Tray	活跃	0°C ~ 100°C (TJ)		Agilex F																	1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					FPGA - 573K Logic Elements			-