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产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	触点镀层	底架	包装/外壳	表面安装	引脚数	供应商器件包装			操作温度	包装	已出版	系列	JESD-609代码	无铅代码	零件状态	湿度敏感性等级(MSL)	终止次数	ECCN 代码	最高工作温度	最小工作温度	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	电源电压	端子间距	频率	时间@峰值回流温度-最大值(s)	基本部件号	JESD-30代码	输出的数量	资历状况	电源电压-最大值(Vsup)	电源	电源电压-最小值(Vsup)	界面	最大电源电压	最小电源电压	速度	内存大小	uPs/uCs/外围ICs类型	核心处理器	周边设备	传播延迟	连接方式	接通延迟时间	建筑学	数据总线宽度	输入数量	可编程逻辑类型	核心架构	最高频率	边界扫描	内存(字)	主要属性	寄存器数量	逻辑单元数	总线兼容性	座位高度(最大)	长度	宽度	RoHS状态
5CSEMA5F31C7N	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8 Weeks		896-BGA	YES			MCU - 181, FPGA - 288		0°C~85°C TJ	Tray	2018	Cyclone® V SE	e1		活跃	3 (168 Hours)	896		Tin/Silver/Copper (Sn/Ag/Cu)			8542.39.00.01	BOTTOM	BALL	未说明	1.1V	1mm		未说明	5CSEMA5	S-PBGA-B896	288	不合格	1.13V	1.11.2/3.32.5V	1.07V				800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA		288	现场可编程门阵列					FPGA - 85K Logic Elements		85000		2mm	31mm	31mm	符合RoHS标准
XCZU11EG-1FFVC1156E	Xilinx Inc.	数据表	30 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		1156-BBGA, FCBGA				360		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)						8542.31.00.01			未说明				未说明											500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 653K+ Logic Cells							ROHS3 Compliant
10AS016C4U19E3SG	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8 Weeks		484-BFBGA	YES			192		0°C~100°C TJ	Tray		Arria 10 SX			活跃	3 (168 Hours)	484					8542.39.00.01	BOTTOM	BALL	未说明	0.9V	0.8mm		未说明		S-PBGA-B484	192	不合格	0.93V	0.9V	0.87V				1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA		192	现场可编程门阵列					FPGA - 160K Logic Elements		160000		3.25mm	19mm	19mm	符合RoHS标准
XCZU6CG-2FFVC900I	Xilinx Inc.	数据表	675 In Stock	1: ¥23,599.205003 10: ¥22,823.215669 25: ¥22,664.563723 50: ¥22,507.014623 查看所有的价格 -	最小起订量: 1 最小包装量: 1	11 Weeks		900-BBGA, FCBGA	YES			204		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	900					8542.31.00.01	BOTTOM	BALL	未说明	0.85V			未说明		R-PBGA-B900			0.876V		0.825V				533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 469K+ Logic Cells							ROHS3 Compliant
XCZU2CG-2SBVA484E	Xilinx Inc.	数据表	507 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		484-BFBGA, FCBGA				82		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG		yes	活跃	4 (72 Hours)						8542.31.00.01			未说明				未说明											533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 103K+ Logic Cells							ROHS3 Compliant
XCZU3EG-2SFVC784E	Xilinx Inc.	数据表	1399 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA				252		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		yes	活跃	4 (72 Hours)						8542.31.00.01			未说明				未说明											533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 154K+ Logic Cells							ROHS3 Compliant
XCZU3EG-1SFVA625I	Xilinx Inc.	数据表	646 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		625-BFBGA, FCBGA				180		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)						8542.31.00.01			未说明				未说明											500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 154K+ Logic Cells							ROHS3 Compliant
XCZU6EG-L1FFVC900I	Xilinx Inc.	数据表	1456 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		900-BBGA, FCBGA	YES			204		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	900				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明		R-PBGA-B900			0.742V		0.698V				500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 469K+ Logic Cells							ROHS3 Compliant
XCZU7EV-1FBVB900E	Xilinx Inc.	数据表	947 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		900-BBGA, FCBGA				204		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)						8542.31.00.01			未说明				未说明											500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 504K+ Logic Cells							ROHS3 Compliant
XCZU5EV-2SFVC784E	Xilinx Inc.	数据表	110 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA				252		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV		yes	活跃	4 (72 Hours)						8542.31.00.01			未说明				未说明											533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 256K+ Logic Cells							ROHS3 Compliant
XCZU2EG-1SFVA625I	Xilinx Inc.	数据表	2564 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		625-BFBGA, FCBGA				180		-40°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)						8542.31.00.01			未说明				未说明											500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 103K+ Logic Cells							ROHS3 Compliant
5CSEMA5U23C6N	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8 Weeks		672-FBGA	YES			MCU - 181, FPGA - 145		0°C~85°C TJ	Tray	2018	Cyclone® V SE			活跃	3 (168 Hours)	672						BOTTOM	BALL	未说明	1.1V	0.8mm		未说明	5CSEMA5	S-PBGA-B672	145	不合格	1.13V	1.11.2/3.32.5V	1.07V				925MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA		145	现场可编程门阵列					FPGA - 85K Logic Elements		85000		1.85mm	23mm	23mm	符合RoHS标准
XCZU19EG-2FFVB1517I	Xilinx Inc.	数据表	200 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		1517-BBGA, FCBGA				644		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)						8542.31.00.01			未说明				未说明											533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells							ROHS3 Compliant
XCZU2CG-1SFVA625E	Xilinx Inc.	数据表	2506 In Stock	1: ¥1,827.467050 10: ¥1,724.025517 100: ¥1,626.439169 500: ¥1,534.376575 查看所有的价格 -	最小起订量: 1 最小包装量: 1	11 Weeks		625-BFBGA, FCBGA				180		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG	e1		活跃	4 (72 Hours)			Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			8542.31.00.01			未说明				未说明											500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 103K+ Logic Cells							ROHS3 Compliant
XC7Z100-L2FFG1156I	Xilinx Inc.	数据表	70 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	1156-BBGA, FCBGA	1156		130		-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	4 (72 Hours)		3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)		PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	1mm	800MHz	未说明								CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	120 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	120 ps	MCU, FPGA				ARM		YES	256000	Kintex™-7 FPGA, 444K Logic Cells	554800		CAN; ETHERNET; I2C; SPI; UART; USB	3.1mm	35mm	35mm	ROHS3 Compliant
XCZU5CG-L2SFVC784E	Xilinx Inc.	数据表	763 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA	YES			252		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	784				IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)	8542.31.00.01	BOTTOM	BALL		0.72V					S-PBGA-B784									533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 256K+ Logic Cells							ROHS3 Compliant
XCZU3EG-1SBVA484E	Xilinx Inc.	数据表	311 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		484-BFBGA, FCBGA				82		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)						8542.31.00.01			未说明				未说明											500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 154K+ Logic Cells							ROHS3 Compliant
5CSXFC6D6F31C8N	Intel	数据表	3000 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks		896-BGA	YES			MCU - 181, FPGA - 288		0°C~85°C TJ	Tray	2018	Cyclone® V SX	e1		活跃	3 (168 Hours)	896		Tin/Silver/Copper (Sn/Ag/Cu)			8542.39.00.01	BOTTOM	BALL	未说明	1.1V	1mm		未说明	5CSXFC6	S-PBGA-B896	288	不合格	1.13V	1.11.2/3.32.5V	1.07V				600MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA		288	现场可编程门阵列					FPGA - 110K Logic Elements		110000					符合RoHS标准
XCZU4EG-1FBVB900E	Xilinx Inc.	数据表	2480 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		900-BBGA, FCBGA				204		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)						8542.31.00.01			未说明				未说明											500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 192K+ Logic Cells							ROHS3 Compliant
XCZU6EG-3FFVB1156E	Xilinx Inc.	数据表	244 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		1156-BBGA, FCBGA				328		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)						8542.31.00.01			未说明				未说明											600MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 469K+ Logic Cells							ROHS3 Compliant
XCZU7CG-1FFVC1156I	Xilinx Inc.	数据表	817 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		1156-BBGA, FCBGA				360		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)						8542.31.00.01			未说明				未说明											500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 504K+ Logic Cells							ROHS3 Compliant
XCZU5EV-1SFVC784I	Xilinx Inc.	数据表	200 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA				252		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)						8542.31.00.01			未说明				未说明											500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 256K+ Logic Cells							ROHS3 Compliant
XCZU7EV-2FBVB900E	Xilinx Inc.	数据表	500 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		900-BBGA, FCBGA				204		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV		yes	活跃	4 (72 Hours)						8542.31.00.01			未说明				未说明											533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 504K+ Logic Cells							ROHS3 Compliant
XC7Z030-2SB485I	Xilinx Inc.	数据表	2269 In Stock	1: ¥1,857.374801 10: ¥1,752.240378 100: ¥1,653.056960 500: ¥1,559.487703 查看所有的价格 -	最小起订量: 1 最小包装量: 1	11 Weeks			484-FBGA, FCBGA		485	485-FCBGA (19x19)	ROMless	130	-40°C~100°C TJ	Tray	2009	Zynq®-7000			活跃	3 (168 Hours)			100°C	-40°C								800MHz									CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB			800MHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	32b			ARM	800MHz			Kintex™-7 FPGA, 125K Logic Cells							ROHS3 Compliant
XCZU9CG-1FFVC900I	Xilinx Inc.	数据表	1459 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		900-BBGA, FCBGA				204		-40°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)						8542.31.00.01			未说明				未说明											500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								Zynq®UltraScale+™ FPGA, 599K+ Logic Cells							ROHS3 Compliant