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类别是'category.片上系统（SoC）' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | 零件状态 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | Reach合规守则 | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | 核心处理器 | 周边设备 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 建筑学 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 产品类别 | EEPROM 大小 | 主要属性 | 逻辑单元数 | 闪光大小 | 产品类别 | 长度 | 宽度 | ||||||||||||||||||||||||||||
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 | XCVM1502-2MSIVFVB1369 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | + 110 C | - 40 C | 800 mV | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1302-2HSIVSVD1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD 赛灵思 | - 40 C | 402 | Tray | 活跃 | + 110 C | -40°C ~ 100°C (TJ) | Versal™ Prime | 880 mV | 800MHz, 1.65GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1402-2MLIVSVF1369 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | + 110 C | - 40 C | 800 mV | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFD023R25A1E1V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 480 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU67DR-2FSVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Xilinx | 1 | Xilinx | SOC - Systems on a Chip | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CY8C4147LQE-S473T | Infineon | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | 活跃 | 有 | 2500 | Infineon | Infineon Technologies | Details | 34 | Tape & Reel (TR) | CY8C4147 | A/D 16x10b, 20x12b SAR | -40°C ~ 125°C (TA) | Reel | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | External, Internal | 24MHz | 16K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 128KB (128K x 8) | CANbus, FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||
| CY8C4126AZE-S455T | Infineon | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 64-LQFP | 64-TQFP (10x10) | Infineon Technologies | Infineon | Infineon Technologies | Details | 54 | Tape & Reel (TR) | A/D 16x10b, 20x12b SAR | 活跃 | 有 | 1500 | -40°C ~ 125°C (TA) | Reel | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | External, Internal | 24MHz | 8K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 64KB (64K x 8) | FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||
| CY8C4147LQS-S283T | Infineon | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | 活跃 | 有 | 2500 | Infineon | Infineon Technologies | Details | 34 | Tape & Reel (TR) | CY8C4147 | A/D 16x10b, 20x12b SAR | -40°C ~ 105°C (TA) | Reel | Automotive, AEC-Q100, PSOC® 4 CY8C4100 | SOC - Systems on a Chip | External, Internal | 24MHz | 16K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 128KB (128K x 8) | CANbus, FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||
| 1SX040HH1F35E1VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 374 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 400K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1702-2MLENSVG1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | AMD | Tray | 活跃 | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFA014R24B3E4X | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 768 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU4CG-L1FBVB900I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | Tray | XCZU4 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1502-2MSEVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | AMD | Tray | 活跃 | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFA022R25A2I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 624 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 1SX040HH1F35I2VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 374 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 400K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVP1502-2LSEVSVA3340 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3340-BFBGA | 3340-BGA (55x55) | AMD | 486 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal® Premium | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Premium FPGA, 3.7M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU19EG-2FFVC1760E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | XCZU19 | 活跃 | Tray | 512 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFB027R25A2E2V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 624 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1502-1LLINSVG1369 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD 赛灵思 | 478 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 80k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1302-1MSENSVF1369 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD 赛灵思 | 316 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 5CSXFC6D6F31C7N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 896-BGA | YES | 896-FBGA (31x31) | 896 | 85 °C | 有 | 5CSXFC6D6F31C7N | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.13 V | 5.56 | MCU - 181, FPGA - 288 | BGA, BGA896,30X30,40 | 网格排列 | PLASTIC/EPOXY | BGA896,30X30,40 | 1.1 V | 未说明 | 1.07 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SX | 活跃 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5CSXFC6 | S-PBGA-B896 | 288 | 不合格 | 1.1,1.2/3.3,2.5 V | OTHER | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 2 mm | 现场可编程门阵列 | FPGA - 110K Logic Elements | 110000 | -- | 31 mm | 31 mm | |||||||||||||||||||||||
| XCVM1402-2HSINSVF1369 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD 赛灵思 | 424 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ Prime | 800MHz, 1.65GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XAZU1EG-L1SFVC784I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD 赛灵思 | 180 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 82K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1402-2MLENSVF1369 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD 赛灵思 | 424 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1702-2LSENSVG1369 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD 赛灵思 | 活跃 | Tray | 500 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - |
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XCVM1502-2MSIVFVB1369
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCVM1302-2HSIVSVD1760
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCVM1402-2MLIVSVF1369
Xilinx
分类:Embedded - System On Chip (SoC)
-
AGFD023R25A1E1V
Intel
分类:Embedded - System On Chip (SoC)
-
XCZU67DR-2FSVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
-
CY8C4147LQE-S473T
Infineon
分类:Embedded - System On Chip (SoC)
-
CY8C4126AZE-S455T
Infineon
分类:Embedded - System On Chip (SoC)
-
CY8C4147LQS-S283T
Infineon
分类:Embedded - System On Chip (SoC)
-
1SX040HH1F35E1VG
Intel
分类:Embedded - System On Chip (SoC)
-
XCVC1702-2MLENSVG1369
AMD
分类:Embedded - System On Chip (SoC)
-
AGFA014R24B3E4X
Intel
分类:Embedded - System On Chip (SoC)
-
XCZU4CG-L1FBVB900I
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1502-2MSEVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
-
AGFA022R25A2I3E
Intel
分类:Embedded - System On Chip (SoC)
-
1SX040HH1F35I2VG
Intel
分类:Embedded - System On Chip (SoC)
-
XCVP1502-2LSEVSVA3340
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU19EG-2FFVC1760E
AMD
分类:Embedded - System On Chip (SoC)
-
AGFB027R25A2E2V
Intel
分类:Embedded - System On Chip (SoC)
-
XCVC1502-1LLINSVG1369
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCVM1302-1MSENSVF1369
Xilinx
分类:Embedded - System On Chip (SoC)
-
5CSXFC6D6F31C7N
ALTERA
分类:Embedded - System On Chip (SoC)
-
XCVM1402-2HSINSVF1369
Xilinx
分类:Embedded - System On Chip (SoC)
-
XAZU1EG-L1SFVC784I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCVM1402-2MLENSVF1369
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCVC1702-2LSENSVG1369
Xilinx
分类:Embedded - System On Chip (SoC)