category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

类别是'category.片上系统（SoC）' (7695)

所有品牌

产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	生命周期状态	包装/外壳	表面安装	供应商器件包装	终端数量		Core								厂商																										操作温度	包装	已出版	系列	JESD-609代码	无铅代码	零件状态	终止次数	ECCN 代码	端子表面处理	附加功能	HTS代码	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	电源电压	端子间距	Reach合规守则	JESD-30代码	输出的数量	资历状况	电源电压-最大值(Vsup)	电源	温度等级	速度	内存大小	核心处理器	周边设备	程序内存大小	连接方式	建筑学	输入数量	座位高度-最大	可编程逻辑类型	主要属性	逻辑单元数	核数量	闪光大小	长度	宽度
XCZU4CG-1SFVC784E	Xilinx Inc.	数据表	633 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA							252	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)					8542.31.00.01				未说明				未说明									500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 192K+ Logic Cells								ROHS3 Compliant
XCZU9EG-1FFVC900I	Xilinx Inc.	数据表	990 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA							204	-40°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01				未说明				未说明									500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 599K+ Logic Cells								ROHS3 Compliant
XAZU3EG-1SFVC784Q	Xilinx Inc.	数据表	2000 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	YES	128						-40°C~125°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	784				8542.31.00.01		BOTTOM	BALL	未说明	0.85V	0.8mm		未说明		S-PBGA-B784							500MHz, 1.2GHz	1.8MB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, I2C, SPI, UART/USART, USB	MPU, FPGA					Zynq®UltraScale+™ FPGA, 154K+ Logic Cells					3.32mm	23mm	23mm	ROHS3 Compliant
XCZU4CG-L2SFVC784E	Xilinx Inc.	数据表	333 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	YES	252						0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	784			IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)	8542.31.00.01		BOTTOM	BALL		0.72V					S-PBGA-B784							500MHz, 1.2GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 192K+ Logic Cells								ROHS3 Compliant
XCZU6CG-2FFVC900E	Xilinx Inc.	数据表	255 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA							204	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG		yes	活跃	4 (72 Hours)					8542.31.00.01				未说明				未说明									533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 469K+ Logic Cells								ROHS3 Compliant
M2S050TS-1FGG484M	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1		Production (Last Updated: 2 months ago)	FPBGA-484	YES	484-FPBGA (23x23)	484	This product may require additional documentation to export from the United States.	ARM Cortex M3	Details	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	微芯片技术	有	4695 LAB	60	267	Tray	M2S050	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	-55 °C	1.2 V	40	1.14 V	125 °C	有	M2S050TS-1FGG484M	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81	-55°C ~ 125°C (TJ)	Tray		SmartFusion2	e1				3A001.A.2.C	Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	CMOS	BOTTOM	BALL	250		1 mm	compliant	S-PBGA-B484	267	不合格		1.2 V	MILITARY	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	2.44 mm	现场可编程门阵列	FPGA - 50K Logic Modules	56340	1 Core	256KB	23 mm	23 mm
XCZU11EG-2FFVB1517I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA							488	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01				未说明				未说明									533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 653K+ Logic Cells								ROHS3 Compliant
XCZU9EG-1FFVB1156E	Xilinx Inc.	数据表	1470 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA							328	0°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01				未说明				未说明									500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 599K+ Logic Cells								ROHS3 Compliant
5CSEBA4U19I7N	Intel	数据表	13 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	484-FBGA	YES	MCU - 151, FPGA - 66						-40°C~100°C TJ	Tray	2018	Cyclone® V SE			活跃	3 (168 Hours)	484				8542.39.00.01		BOTTOM	BALL	未说明	1.1V	0.8mm		未说明	5CSEBA4	S-PBGA-B484	66	不合格	1.13V	1.11.2/3.32.5V		1.07V	800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	66	现场可编程门阵列			FPGA - 40K Logic Elements	40000				1.9mm	19mm	19mm	符合RoHS标准
5CSEBA5U23I7	Intel	数据表	2916 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES	MCU - 181, FPGA - 145						-40°C~100°C TJ	Tray	2018	Cyclone® V SE			活跃	3 (168 Hours)	672				8542.39.00.01		BOTTOM	BALL	未说明	1.1V	0.8mm		未说明		S-PBGA-B672	145	不合格	1.13V	1.11.2/3.32.5V		1.07V	800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	145	现场可编程门阵列			FPGA - 85K Logic Elements	85000				1.85mm	23mm	23mm	符合RoHS标准
XCZU4EG-2SFVC784E	Xilinx Inc.	数据表	752 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA							252	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		yes	活跃	4 (72 Hours)					8542.31.00.01				未说明				未说明									533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 192K+ Logic Cells								ROHS3 Compliant
XC7Z030-1SB485I	Xilinx Inc.	数据表	2473 In Stock	1: ¥2,961.388733 10: ¥2,793.762960 100: ¥2,635.625430 500: ¥2,486.439087 查看所有的价格 -	最小起订量: 1 最小包装量: 1	11 Weeks	484-FBGA, FCBGA	YES	130						-40°C~100°C TJ	Bulk	2009	Zynq®-7000		no	活跃	2A (4 Weeks)	485			GPIO WITH FOUR 32-BIT BANKS	8542.39.00.01		BOTTOM	BALL							S-PBGA-B485							667MHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	667MHz		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			YES	256000	Kintex™-7 FPGA, 125K Logic Cells			CAN, ETHERNET, I2C, PCI, SPI, UART, USB					ROHS3 Compliant
5CSEBA5U19C8N	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8 Weeks	484-FBGA	YES	MCU - 151, FPGA - 66						0°C~85°C TJ	Tray	2018	Cyclone® V SE			活跃	3 (168 Hours)	484						BOTTOM	BALL	未说明	1.1V	0.8mm		未说明	5CSEBA5	S-PBGA-B484	66	不合格	1.13V	1.11.2/3.32.5V		1.07V	600MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	66	现场可编程门阵列			FPGA - 85K Logic Elements	85000				1.9mm	19mm	19mm	符合RoHS标准
XCZU7EV-L2FFVF1517E	Xilinx Inc.	数据表	110 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA	YES	464						0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01		BOTTOM	BALL	未说明	0.72V			未说明		R-PBGA-B1517			0.742V			0.698V	533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 504K+ Logic Cells								ROHS3 Compliant
10AS048H4F34E3SG	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1152-BBGA, FCBGA	YES	492						0°C~100°C TJ	Tray		Arria 10 SX			活跃	3 (168 Hours)					8542.39.00.01		BOTTOM	BALL	未说明	0.9V	1mm		未说明		S-PBGA-B1152	492	不合格	0.93V	0.9V		0.87V	1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	125MHz		EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	492	现场可编程门阵列			FPGA - 480K Logic Elements	480000				3.65mm	35mm	35mm	符合RoHS标准
10AS016C4U19I3SG	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8 Weeks	484-BFBGA	YES	192						-40°C~100°C TJ	Tray		Arria 10 SX			活跃	3 (168 Hours)	484				8542.39.00.01		BOTTOM	BALL	未说明	0.9V	0.8mm		未说明		S-PBGA-B484	192	不合格	0.93V	0.9V		0.87V	1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	192	现场可编程门阵列			FPGA - 160K Logic Elements	160000				3.25mm	19mm	19mm	符合RoHS标准
5CSEMA2U23C8N	Intel	数据表	3000 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES	MCU - 181, FPGA - 145						0°C~85°C TJ	Tray	2018	Cyclone® V SE			活跃	3 (168 Hours)	672						BOTTOM	BALL	未说明	1.1V	0.8mm		未说明		S-PBGA-B672	145	不合格	1.13V	1.11.2/3.32.5V		1.07V	600MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	145	现场可编程门阵列			FPGA - 25K Logic Elements	25000				1.85mm	23mm	23mm	符合RoHS标准
10AS027H3F34I2LG	Intel	数据表	3000 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	1152-BBGA, FCBGA	YES	384						-40°C~100°C TJ	Tray		Arria 10 SX			活跃	3 (168 Hours)					8542.39.00.01		BOTTOM	BALL	未说明	0.9V	1mm		未说明		S-PBGA-B1152	384	不合格	0.93V	0.9V		0.87V	1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	384	现场可编程门阵列			FPGA - 270K Logic Elements	270000				3.65mm	35mm	35mm	符合RoHS标准
XCZU7EG-1FBVB900I	Xilinx Inc.	数据表	1452 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA							204	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01				未说明				未说明									500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 504K+ Logic Cells								ROHS3 Compliant
XC7Z014S-1CLG484C	Xilinx Inc.	数据表	2533 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	484-LFBGA, CSPBGA	YES	200						0°C~85°C TJ	Tray	2016	Zynq®-7000	e3	yes	活跃	3 (168 Hours)	484		Matte Tin (Sn)		8542.31.00.01		BOTTOM	BALL	未说明	1V	0.8mm		未说明		S-PBGA-B484			1.05V			0.95V	667MHz	256KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	667MHz		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			YES	256000	Artix™-7 FPGA, 65K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		1.6mm	19mm	19mm	ROHS3 Compliant
XCZU6CG-1FFVB1156E	Xilinx Inc.	数据表	522 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA							328	0°C~100°C TJ	Bulk	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)					8542.31.00.01				未说明				未说明									500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 469K+ Logic Cells								ROHS3 Compliant
M2S025T-1FGG484M	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术				This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	60	267	Tray	M2S025	活跃	-55°C ~ 125°C (TJ)	Tray		SmartFusion2																									166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA				FPGA - 25K Logic Modules		1 Core	256KB
5CSEBA4U23C6N	Intel	数据表	13 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES	MCU - 181, FPGA - 145						0°C~85°C TJ	Tray	2018	Cyclone® V SE			活跃	3 (168 Hours)	672				8542.39.00.01		BOTTOM	BALL	未说明	1.1V	0.8mm		未说明		S-PBGA-B672	145	不合格	1.13V	1.11.2/3.32.5V		1.07V	925MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	145	现场可编程门阵列			FPGA - 40K Logic Elements	40000				1.85mm	23mm	23mm	符合RoHS标准
XCZU6EG-2FFVC900E	Xilinx Inc.	数据表	1000 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA							204	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		yes	活跃	4 (72 Hours)					8542.31.00.01				未说明				未说明									533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 469K+ Logic Cells								ROHS3 Compliant
XCZU7EG-3FBVB900E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA							204	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01				未说明				未说明									600MHz, 667MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 504K+ Logic Cells								ROHS3 Compliant