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类别是'category.片上系统（SoC）' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 包装/外壳 | 供应商器件包装 | 厂商 | 操作温度 | 包装 | 系列 | 子类别 | 工作电源电压 | 界面 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 建筑学 | 数据总线宽度 | 产品类别 | 收发器数量 | 主要属性 | 核数量 | 闪光大小 | 产品类别 | 设备核心 | |||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | MAX32680GLR | Analog Devices | 数据表 | 577 In Stock | - | 最小起订量: 1 最小包装量: 1 | 88-VFLGA Exposed Pad | 88-LGA (10x10) | Analog Devices Inc./Maxim Integrated | 128 kB | MSL 3 - 168 hours | 36 | Tray | 活跃 | 100 MHz | + 85 C | 3.6 V | - 40 C | 2 V | SMD/SMT | I2C, SPI, UART | -40°C ~ 85°C (TA) | - | I2C, I2S, SPI, UART | 100MHz | 128kB | ARM® Cortex®-M4F | DMA, I²S, PWM, WDT | 512KB | Bluetooth, I²C, SPI, UART | MCU | 32bit | - | 512kB | ARM Cortex-M4F | ||||||||||||||||||||
| XCVC1802-1MSIVIVA1596 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD 赛灵思 | - 40 C | 500 | 活跃 | + 110 C | -40°C ~ 100°C (TJ) | 800 mV | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | ||||||||||||||||||||||||||||||||
| XCVM1802-2MSIVSVA2197 | Xilinx | 数据表 | 720 In Stock | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD 赛灵思 | 活跃 | 770 | Tray | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||
| XCVM1802-2MSIVSVD1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD 赛灵思 | 活跃 | 726 | -40°C ~ 100°C (TJ) | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||
| XCVM1802-1MSIVSVD1760 | Xilinx | 数据表 | 3000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD 赛灵思 | 活跃 | 726 | Tray | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||
| XCVM1802-2MLIVSVD1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD 赛灵思 | 活跃 | 726 | -40°C ~ 100°C (TJ) | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||
| XCVC1902-1MSEVIVA1596 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD 赛灵思 | 0 C | 500 | 活跃 | + 100 C | 0°C ~ 100°C (TJ) | 800 mV | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||
| XCVC1802-1MLIVSVA2197 | Xilinx | 数据表 | 3000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD 赛灵思 | 活跃 | 770 | Tray | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||||||||||||||||||||
| XCVM1802-2MLEVSVD1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD 赛灵思 | 活跃 | 726 | Tray | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||
| XCVC1802-2MSEVSVA2197 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD 赛灵思 | 活跃 | 770 | Tray | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||||||||||||||||||||
| 1SX280LN3F43I3VGAS | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-1760 | 1 | SMD/SMT | 350000 LAB | 999G6X | Intel | Intel / Altera | Stratix | Details | 4 x 32 kB | - | 4 x 32 kB | 1 GHz | 2800000 LE | 688 I/O | + 100 C | - 40 C | Tray | Stratix 10 SX | SOC - Systems on a Chip | 0.85 V | - | SoC FPGA | 48 Transceiver | 4 Core | SoC FPGA | |||||||||||||||||||||||
| XCVP1202-3HSEVSVA2785 | AMD | 数据表 | 926 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 2785-BFBGA, FCBGA | 2785-FCBGA (50x50) | AMD | 活跃 | 780 | Tray | 0°C ~ 100°C (TJ) | Versal® Premium | 800MHz, 1.7GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Premium FPGA, 2M Logic Cells | - | |||||||||||||||||||||||||||||||||
| XCZU11EG-2FFVC1760E | AMD | 数据表 | 897 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | 活跃 | 512 | Tray | XCZU11 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | ||||||||||||||||||||||||||||||||
| XA7Z030-1FBV484Q | AMD | 数据表 | 2369 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BBGA, FCBGA | 484-FCBGA (23x23) | AMD | 活跃 | 130 | Tray | XA7Z030 | -40°C ~ 125°C (TJ) | Automotive, AEC-Q100, Zynq®-7000 XA | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | - | ||||||||||||||||||||||||||||||||
| 1SX065HH2F35E2LG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 活跃 | 392 | Tray | 0°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 650K Logic Elements | - | |||||||||||||||||||||||||||||||||
| AGFB008R24C2I3E | Intel | 数据表 | 598 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 576 | Tray | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | |||||||||||||||||||||||||||||||||
| AGFB012R24B2E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 768 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | |||||||||||||||||||||||||||||||||
| XCVC1802-2LLEVIVA1596 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD 赛灵思 | 活跃 | 500 | Tray | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||||||||||||||||||||
| AGFC023R25A3I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 480 | Tray | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | |||||||||||||||||||||||||||||||||
| XC7Z035-L2FFG900I | AMD | 数据表 | 934 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 活跃 | 130 | Tray | XC7Z035 | -40°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 275K Logic Cells | - | ||||||||||||||||||||||||||||||||
| XCVC1802-2LLEVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 活跃 | 692 | Tray | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||||||||||||||||||||
| XC7Z045-2FF676I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | AMD | 活跃 | 130 | Tray | XC7Z045 | -40°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 350K Logic Cells | - | ||||||||||||||||||||||||||||||||
| XCVE1752-1MLIVSVA2197 | AMD | 数据表 | 618 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 活跃 | 608 | Tray | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | - | |||||||||||||||||||||||||||||||||||
| MPFS460TS-FCG1152IPP | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 微芯片技术 | 活跃 | MCU - 136, FPGA - 468 | Tray | -40°C ~ 100°C | PolarFire™ | - | 3.95MB | RISC-V | DMA, PCI, PWM | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 461K Logic Modules | 128kB | |||||||||||||||||||||||||||||||||
| MPFS460T-1FCG1152EPP | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 微芯片技术 | 活跃 | MCU - 136, FPGA - 468 | Tray | 0°C ~ 100°C | PolarFire™ | - | 3.95MB | RISC-V | DMA, PCI, PWM | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 461K Logic Modules | 128kB |
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MAX32680GLR
Analog Devices
分类:Embedded - System On Chip (SoC)
-
XCVC1802-1MSIVIVA1596
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCVM1802-2MSIVSVA2197
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCVM1802-2MSIVSVD1760
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCVM1802-1MSIVSVD1760
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCVM1802-2MLIVSVD1760
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCVC1902-1MSEVIVA1596
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCVC1802-1MLIVSVA2197
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCVM1802-2MLEVSVD1760
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCVC1802-2MSEVSVA2197
Xilinx
分类:Embedded - System On Chip (SoC)
-
1SX280LN3F43I3VGAS
ALTERA
分类:Embedded - System On Chip (SoC)
-
XCVP1202-3HSEVSVA2785
AMD
分类:Embedded - System On Chip (SoC)
153,365.580194
-
XCZU11EG-2FFVC1760E
AMD
分类:Embedded - System On Chip (SoC)
45,434.061869
-
XA7Z030-1FBV484Q
AMD
分类:Embedded - System On Chip (SoC)
2,831.526378
-
1SX065HH2F35E2LG
Intel
分类:Embedded - System On Chip (SoC)
-
AGFB008R24C2I3E
Intel
分类:Embedded - System On Chip (SoC)
83,757.581285
-
AGFB012R24B2E3E
Intel
分类:Embedded - System On Chip (SoC)
-
XCVC1802-2LLEVIVA1596
Xilinx
分类:Embedded - System On Chip (SoC)
-
AGFC023R25A3I3E
Intel
分类:Embedded - System On Chip (SoC)
-
XC7Z035-L2FFG900I
AMD
分类:Embedded - System On Chip (SoC)
17,825.023925
-
XCVC1802-2LLEVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
-
XC7Z045-2FF676I
AMD
分类:Embedded - System On Chip (SoC)
-
XCVE1752-1MLIVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
161,239.607935
-
MPFS460TS-FCG1152IPP
Microchip
分类:Embedded - System On Chip (SoC)
-
MPFS460T-1FCG1152EPP
Microchip
分类:Embedded - System On Chip (SoC)