N/A

-

BGA-1152

1152-FCBGA (35x35)

微芯片技术

有

This product may require additional documentation to export from the United States.

16 kB, 4 x 32 kB

667 MHz, 667 MHz

254000 LE

372 I/O

+ 100 C

0 C

1

SMD/SMT

Microchip

Microchip Technology / Atmel

4 x 32 kB

-

Tray

活跃

0°C ~ 100°C

Tray

PolarFire™

SOC - Systems on a Chip

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

SoC FPGA

N/A

-

FCVG-784

784-FCBGA (23x23)

微芯片技术

667 MHz, 667 MHz

254000 LE

372 I/O

+ 100 C

0 C

1

SMD/SMT

Microchip

Microchip Technology / Atmel

4 x 32 kB

-

Tray

活跃

This product may require additional documentation to export from the United States.

16 kB, 4 x 32 kB

0°C ~ 100°C

Tray

PolarFire™

SOC - Systems on a Chip

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

SoC FPGA

N/A

-

FCG-1152

1152-FCBGA (35x35)

微芯片技术

有

This product may require additional documentation to export from the United States.

16 kB, 4 x 32 kB

667 MHz, 667 MHz

254000 LE

372 I/O

+ 100 C

0 C

1

SMD/SMT

Microchip

Microchip Technology / Atmel

4 x 32 kB

-

Tray

活跃

0°C ~ 100°C

Tray

PolarFire™

SOC - Systems on a Chip

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

SoC FPGA

N/A

-

4 x 32 kB

Microchip Technology / Atmel

Microchip

SMD/SMT

1

0 C

+ 100 C

468 I/O

461000 LE

667 MHz, 667 MHz

16 kB, 4 x 32 kB

This product may require additional documentation to export from the United States.

-

Tray

SOC - Systems on a Chip

-

5 Core

SoC FPGA

N/A

-

FCG-1152

1152-FCBGA (35x35)

微芯片技术

有

This product may require additional documentation to export from the United States.

16 kB, 4 x 32 kB

667 MHz, 667 MHz

254000 LE

372 I/O

+ 100 C

0 C

1

SMD/SMT

Microchip

Microchip Technology / Atmel

4 x 32 kB

-

Tray

活跃

-40°C ~ 100°C

Tray

PolarFire™

SOC - Systems on a Chip

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

SoC FPGA

N/A

-

672-FBGA

484

672-UBGA (23x23)

MCU - 181, FPGA - 145

Compliant

0°C ~ 85°C (TJ)

Tray

Cyclone® V SE

活跃

85 °C

0 °C

925 MHz

5CSEMA4

1.1 V

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

2.9 MB

925MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

40000

ARM

FPGA - 40K Logic Elements

--

N/A

-

1517-BBGA, FCBGA

YES

1517-FCBGA (40x40)

1517

PLASTIC/EPOXY

-40 °C

0.9 V

0.87 V

100 °C

10AS066N3F40I2SGES

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.66

588

BGA,

网格排列

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

Discontinued at Digi-Key

8542.39.00.01

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1517

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3.5 mm

现场可编程门阵列

FPGA - 660K Logic Elements

--

40 mm

40 mm

N/A

-

1152-BBGA, FCBGA

YES

1152-FBGA (35x35)

1152

MCU - 208, FPGA - 385

FBGA-1152

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

1.1 V

未说明

1.07 V

100 °C

有

5ASXBB3D4F35I5N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

1.13 V

5.28

-40°C ~ 100°C (TJ)

Tray

Arria V SX

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

BALL

未说明

1 mm

compliant

5ASXBB3

S-PBGA-B1152

385

INDUSTRIAL

800MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

385

13207 CLBS

2.7 mm

现场可编程门阵列

FPGA - 350K Logic Elements

13207

350000

--

35 mm

35 mm

N/A

-

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

464

Tray

XCZU7

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

N/A

-

AMD

478

Tray

活跃

Versal™ Prime

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1M Logic Cells

-

N/A

-

896-BGA

896

896-FBGA (31x31)

MCU - 181, FPGA - 288

Compliant

0°C ~ 85°C (TJ)

Tray

Cyclone® V SE

活跃

85 °C

0 °C

5CSEMA5

1.13 V

556.3 kB

925MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

85000

800 MHz

32075

6

FPGA - 85K Logic Elements

--

无铅

N/A

-

-

-

Intel

480

Tray

活跃

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

N/A

-

256-LBGA

256

256-FPBGA (17x17)

微芯片技术

Non-Compliant

MCU - 25, FPGA - 66

Tray

A2F500

活跃

无

A2F500M3G-1FG256M

Microsemi Corporation

活跃

MICROSEMI CORP

2.54

-55°C ~ 125°C (TJ)

SmartFusion®

125 °C

-55 °C

8542.39.00.01

unknown

100 MHz

EBI/EMI, Ethernet, I2C, SPI, UART, USART

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

ARM

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

512KB

N/A

-

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

608

Tray

活跃

Versal™ Prime

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1M Logic Cells

-

N/A

-

-

-

Intel

720

Tray

活跃

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

-

N/A

-

-

-

Intel

活跃

Tray

480

0°C ~ 100°C (TJ)

Agilex I

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

N/A

-

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

130

Tray

XC7Z035

活跃

-40°C ~ 100°C (TJ)

Zynq®-7000

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 275K Logic Cells

-

N/A

-

-

-

Intel

744

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

N/A

-

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

204

Tray

XCZU7

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

N/A

-

81-LFBGA

81-CTBGA (8x8)

Analog Devices Inc./Maxim Integrated

+ 105 C

1.89 V

- 40 C

1.71 V

SMD/SMT

GPIO, I2C, PWM, SPI, UART, USB

128 kB

MSL 3 - 168 hours

52

Strip

MAX32655

活跃

100 MHz

-40°C ~ 105°C

-

I2C, I2S, SPI, UART

100MHz

128KB

ARM® Cortex®-M4

I²S, PWM, WDT

512KB

1-Wire, Bluetooth, I²C, SPI, UART/USART

MCU

32bit

-

512KB

ARM Cortex-M4F

N/A

-

表面贴装

8-TSSOP, 8-MSOP (0.118, 3.00mm Width)

8-uMAX/uSOP

Analog Devices Inc./Maxim Integrated

Tube

DS1100

Obsolete

480

-40°C ~ 85°C

-

4.75V ~ 5.25V

Nonprogrammable

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

5

1

100ns

500ns

100 ns

N/A

-

0402 (1005 Metric)

0402

KOA Speer Electronics, Inc.

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

RN73H1E

活跃

480

-55°C ~ 155°C

RN73H

0.039 L x 0.020 W (1.00mm x 0.50mm)

±0.5%

2

±50ppm/°C

10.1 Ohms

Metal Film

0.063W, 1/16W

-

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

Automotive AEC-Q200, Moisture Resistant

0.016 (0.40mm)

AEC-Q200

N/A

-

-

-

Free Hanging (In-Line)

Free Hanging (In-Line)

Hirose Electric Co Ltd

Female

Bulk

50 Ohms

UFL-2HF

-

活跃

Female

6 GHz

-

1.13mm OD Coaxial Cable

720

-40°C ~ 90°C

U.FL

Gray

-

U.FL (UMCC) to U.FL (UMCC)

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

U.FL (UMCC) Plug, Right Angle

U.FL (UMCC) Plug, Right Angle

FPGA - 2.7M Logic Elements

-

-

2.756 (70.00mm)

N/A

-

625-BFBGA, FCBGA

625-FCBGA (21x21)

霍尼韦尔传感与生产力解决方案

Bulk

Obsolete

180

XCZU3

0°C ~ 100°C (TJ)

-

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

N/A

-

625-BFBGA, FCBGA

625-FCBGA (21x21)

恩智浦半导体

Bulk

74AHC30

活跃

180

-40°C ~ 100°C (TJ)

*

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-