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产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	触点镀层	底架	包装/外壳	引脚数	供应商器件包装			操作温度	包装	已出版	系列	JESD-609代码	无铅代码	零件状态	湿度敏感性等级(MSL)	终止次数	ECCN 代码	端子表面处理	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	电源电压	端子间距	频率	时间@峰值回流温度-最大值(s)	基本部件号	JESD-30代码	输出的数量	资历状况	工作电源电压	电源电压-最大值(Vsup)	电源	界面	速度	内存大小	uPs/uCs/外围ICs类型	核心处理器	周边设备	时钟频率	连接方式	建筑学	数据总线宽度	输入数量	核心架构	边界扫描	内存(字)	主要属性	逻辑单元数	可擦除紫外线	座位高度(最大)	长度	宽度	RoHS状态
5CSEBA6U19I7N	Intel	数据表	2227 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks		484-FBGA	YES		MCU - 151, FPGA - 66		-40°C~100°C TJ	Tray	2018	Cyclone® V SE			活跃	3 (168 Hours)	484				8542.39.00.01	BOTTOM	BALL	未说明	1.1V	0.8mm		未说明	5CSEBA6	S-PBGA-B484	66	不合格		1.13V	1.11.2/3.32.5V	1.07V	800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		66	现场可编程门阵列			FPGA - 110K Logic Elements	110000		1.9mm	19mm	19mm	符合RoHS标准
XCZU4EG-2FBVB900E	Xilinx Inc.	数据表	950 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		900-BBGA, FCBGA			204		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		yes	活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明									533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 192K+ Logic Cells						ROHS3 Compliant
XCZU6EG-2FFVC900I	Xilinx Inc.	数据表	536 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		900-BBGA, FCBGA			204		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明									533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 469K+ Logic Cells						ROHS3 Compliant
XCZU7EG-2FFVC1156I	Xilinx Inc.	数据表	50 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		1156-BBGA, FCBGA			360		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明									533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 504K+ Logic Cells						ROHS3 Compliant
XCZU11EG-1FFVC1760E	Xilinx Inc.	数据表	697 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		1760-BBGA, FCBGA			512		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明									500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 653K+ Logic Cells						ROHS3 Compliant
XCZU3EG-L1SFVC784I	Xilinx Inc.	数据表	4 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA	YES		252		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	784			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明		R-PBGA-B784				0.742V		0.698V	500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 154K+ Logic Cells						ROHS3 Compliant
XCZU4EG-2SFVC784I	Xilinx Inc.	数据表	1800 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA			252		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明									533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 192K+ Logic Cells						ROHS3 Compliant
XCZU6EG-2FFVB1156I	Xilinx Inc.	数据表	2000 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		1156-BBGA, FCBGA			328		-40°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明									533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 469K+ Logic Cells						ROHS3 Compliant
XCZU5CG-1SFVC784E	Xilinx Inc.	数据表	972 In Stock	1: ¥10,488.700451 10: ¥10,143.810883 25: ¥10,073.297797 50: ¥10,003.274868 查看所有的价格 -	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA			252		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明									500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 256K+ Logic Cells						ROHS3 Compliant
XCZU4CG-2SFVC784I	Xilinx Inc.	数据表	968 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA	YES		252		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	784				8542.31.00.01	BOTTOM	BALL	未说明	0.85V			未说明		S-PBGA-B784							533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 192K+ Logic Cells						ROHS3 Compliant
10AS066H3F34I2LG	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8 Weeks		1152-BBGA, FCBGA	YES		492		-40°C~100°C TJ	Tray		Arria 10 SX			活跃	3 (168 Hours)					8542.39.00.01	BOTTOM	BALL	未说明	0.9V	1mm		未说明		S-PBGA-B1152	492	不合格		0.93V	0.9V	0.87V	1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		492	现场可编程门阵列			FPGA - 660K Logic Elements	660000		3.65mm	35mm	35mm	符合RoHS标准
XCZU3CG-1SBVA484I	Xilinx Inc.	数据表	867 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		484-BFBGA, FCBGA			82		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明									500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 154K+ Logic Cells						ROHS3 Compliant
XCZU6EG-L1FFVB1156I	Xilinx Inc.	数据表	173 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		1156-BBGA, FCBGA	YES		328		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明		R-PBGA-B1156				0.742V		0.698V	500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 469K+ Logic Cells						ROHS3 Compliant
XCZU2EG-L1SBVA484I	Xilinx Inc.	数据表	2674 In Stock	1: ¥3,032.149138 10: ¥2,860.518055 100: ¥2,698.601941 500: ¥2,545.850885 查看所有的价格 -	最小起订量: 1 最小包装量: 1	11 Weeks		484-BFBGA, FCBGA	YES		82		-40°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	484			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明		R-PBGA-B484				0.742V		0.698V	500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 103K+ Logic Cells						ROHS3 Compliant
XCZU4CG-2FBVB900E	Xilinx Inc.	数据表	1000 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		900-BBGA, FCBGA			204		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG		yes	活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明									533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 192K+ Logic Cells						ROHS3 Compliant
XCZU5CG-2SFVC784I	Xilinx Inc.	数据表	990 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA	YES		252		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	784				8542.31.00.01	BOTTOM	BALL	未说明	0.85V			未说明		S-PBGA-B784							533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 256K+ Logic Cells						ROHS3 Compliant
XCZU7EV-3FBVB900E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks		900-BBGA, FCBGA			204		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明									600MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 504K+ Logic Cells						ROHS3 Compliant
XC7Z045-2FF900I	Xilinx Inc.	数据表	581 In Stock	1: ¥12,659.372752 10: ¥12,243.107113 25: ¥12,158.001101 50: ¥12,073.486693 查看所有的价格 -	最小起订量: 1 最小包装量: 1	10 Weeks		900-BBGA, FCBGA	YES		130		-40°C~100°C TJ	Tray	2016	Zynq®-7000			活跃	4 (72 Hours)	900			GPIO WITH FOUR 32-BIT BANKS	8542.39.00.01	BOTTOM	BALL				compliant			S-PBGA-B900							800MHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	800MHz	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				YES	256000	Kintex™-7 FPGA, 350K Logic Cells		CAN, ETHERNET, I2C, PCI, SPI, UART, USB				Non-RoHS Compliant
XCZU5EV-2SFVC784I	Xilinx Inc.	数据表	872 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA			252		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明									533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 256K+ Logic Cells						ROHS3 Compliant
XCZU7EV-3FFVC1156E	Xilinx Inc.	数据表	4500 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		1156-BBGA, FCBGA			360		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明									600MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 504K+ Logic Cells						ROHS3 Compliant
XA7Z010-1CLG225Q	Xilinx Inc.	数据表	1600 In Stock	1: ¥714.240866 10: ¥673.812141 100: ¥635.671825 500: ¥599.690400 查看所有的价格 -	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	225-LFBGA, CSPBGA	225		86	Automotive grade	-40°C~125°C TJ	Tray	2010	Automotive, AEC-Q100, Zynq®-7000 XA	e1		活跃	3 (168 Hours)	225	EAR99	锡银铜		8542.39.00.01	BOTTOM	BALL	未说明		0.8mm	667MHz	未说明				不合格	1V		11.8V	CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB		256KB	微处理器电路	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b		ARM			Artix™-7 FPGA, 28K Logic Cells		N	1.5mm	13mm		ROHS3 Compliant
XCZU3EG-L2SFVC784E	Xilinx Inc.	数据表	512 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA	YES		252		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	784			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明		R-PBGA-B784				0.742V		0.698V	533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 154K+ Logic Cells						ROHS3 Compliant
XCZU4EG-3SFVC784E	Xilinx Inc.	数据表	155 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA			252		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明									600MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 192K+ Logic Cells						ROHS3 Compliant
XCZU3EG-2SBVA484I	Xilinx Inc.	数据表	500 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		484-BFBGA, FCBGA		484-FCBGA (19x19)	82		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)																					533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 154K+ Logic Cells						ROHS3 Compliant
XCZU9CG-2FFVC900E	Xilinx Inc.	数据表	897 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		900-BBGA, FCBGA			204		0°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC CG		yes	活跃	4 (72 Hours)					8542.31.00.01			未说明				未说明									533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 599K+ Logic Cells						ROHS3 Compliant