category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	安装类型	包装/外壳	表面安装	供应商器件包装	终端数量		Core													厂商																																操作温度	包装	系列	JESD-609代码	类型	端子表面处理	附加功能	HTS代码	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	频率	JESD-30代码	功能	输出的数量	资历状况	工作电源电压	电源	温度等级	速度	内存大小	核心处理器	周边设备	程序存储器类型	程序内存大小	连接方式	建筑学	数据总线宽度	输入数量	座位高度-最大	可编程逻辑类型	速度等级
M2S050-1FCS325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325-FCBGA (11x11)	325	ARM Cortex M3	Tray	微芯片技术	M2S050	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	30	1.14 V	85 °C	无	M2S050-1FCS325	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	176	200	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant		S-PBGA-B325		200	不合格		1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		200	1.01 mm	现场可编程门阵列				FPGA - 50K Logic Modules		56340	1 Core	256KB		11 mm	11 mm
M2S025T-VFG256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	256-LFBGA	YES	256-FPBGA (14x14)	256	ARM Cortex M3	0 C	+ 85 C	有	2308 LAB	微芯片技术	119	Tray	M2S025	活跃	VFBGA-256	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA256,16X16,32	1.2 V	40	1.14 V	85 °C	有	M2S025T-VFG256	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.77		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	138 I/O	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1		Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN		CMOS	BOTTOM	BALL	250	0.8 mm	compliant		S-PBGA-B256		138	不合格	1.2 V	1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		138	1.56 mm	现场可编程门阵列				FPGA - 25K Logic Modules		27696	1 Core	256KB		14 mm	14 mm
M2S025-1FGG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	64 kB	27696 LE	有	2308 LAB	60	267	Tray	M2S025	活跃					This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					1			FPGA - 25K Logic Modules			1 Core	256KB
M2S025TS-1FCSG325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FCBGA-325	325-FCBGA (11x11)	ARM Cortex M3	微芯片技术	有	2308 LAB	176	180	Tray	M2S025	活跃				This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	0°C ~ 85°C (TJ)	Tray	SmartFusion2																				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA								FPGA - 25K Logic Modules			1 Core	256KB
M2S025TS-1VF256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	VFPBGA-256	256-FPBGA (14x14)	ARM Cortex M3	微芯片技术	有	2308 LAB	119	138	Tray	M2S025	活跃				This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	0°C ~ 85°C (TJ)	Tray	SmartFusion2																				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA								FPGA - 25K Logic Modules			1 Core	256KB
M2S005S-1FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	60	209	Tray	微芯片技术	M2S005	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	30	1.14 V	85 °C	无	M2S005S-1FG484	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.87			This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	6060 LE	有	505 LAB	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant		S-PBGA-B484		209	不合格		1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR		128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		209	2.44 mm	现场可编程门阵列				FPGA - 5K Logic Modules		6060	1 Core	128KB		23 mm	23 mm
M2S060TS-1FGG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	YES	484-FPBGA (23x23)	484	ARM Cortex M3	60	SmartFusion2	0.418384 oz	1.2000 V	微芯片技术	活跃	M2S060	Tray	267	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	40	1.14 V	有	M2S060TS-1FGG484I	BGA	SQUARE	活跃	IC FPGA SOC 60K LUTS	MICROSEMI CORP	1.26 V	5.81		This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	-40 to 100 °C	Tray	SmartFusion2	e1		Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant		S-PBGA-B484		267	不合格		1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		267	2.44 mm	现场可编程门阵列	1			FPGA - 60K Logic Modules		56520	1 Core	256KB		23 mm	23 mm
M2S060T-1VF400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	400-LFBGA	YES	400-VFBGA (17x17)	400	ARM Cortex M3	Tray	微芯片技术	M2S060	活跃	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	GRID ARRAY, LOW PROFILE, FINE PITCH	VFBGA-400	5.88	1.26 V	MICROSEMI CORP	活跃	SQUARE	LFBGA	M2S060T-1VF400	无	85 °C	1.14 V		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	90	SmartFusion2	207	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant		S-PBGA-B400		207	不合格		1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		207	1.51 mm	现场可编程门阵列				FPGA - 60K Logic Modules		56520	1 Core	256KB		17 mm	17 mm
M2S090T-FGG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BGA	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	7193 LAB	60	267	Tray	M2S090	活跃					This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	86316 LE	有	0°C ~ 85°C (TJ)	Tray	SmartFusion2																				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					STD			FPGA - 90K Logic Modules			1 Core	512KB
M2S150TS-1FCV484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA	484-FBGA (19x19)	ARM Cortex M3	微芯片技术	12177 LAB	84	273	Tray	M2S150	活跃					This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	146124 LE	有	0°C ~ 85°C (TJ)	Tray	SmartFusion2																				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA								FPGA - 150K Logic Modules			1 Core	512KB
M2S050T-1FG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	60	1.2000 V	1.14 V	1.26 V	267	Tray	M2S050	活跃					-40 to 100 °C	Tray	SmartFusion2																				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					1			FPGA - 50K Logic Modules			1 Core	256KB
M2S090T-1FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	64 kB	86316 LE	有	7193 LAB	60	267	Tray	M2S090	活跃					This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2																				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					1			FPGA - 90K Logic Modules			1 Core	512KB
M2S090-FGG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	Details	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	273 I/O	- 40 C	+ 100 C	有	7193 LAB	60	0.766018 oz	1.2000 V	Tray	M2S090	活跃					-40 to 100 °C	Tray	SmartFusion2																	1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					STD			FPGA - 90K Logic Modules			1 Core	512KB
M2S060-1FG676	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	676-BGA	YES	676-FBGA (27x27)	676	ARM Cortex M3	活跃	M2S060	微芯片技术	Tray	387	FBGA-676	网格排列	3	PLASTIC/EPOXY	BGA676,26X26,40	1.2 V	30	1.14 V	85 °C	无	M2S060-1FG676	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.88		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	40	SmartFusion2	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant		S-PBGA-B676		387	不合格		1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		387	2.44 mm	现场可编程门阵列				FPGA - 60K Logic Modules		56520	1 Core	256KB		27 mm	27 mm
ST4SI2S0009AKI8T	STMicroelectronics	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	-	STMicroelectronics				不适用		1.8 V, 3 V, 5 V	- 25 C	+ 80 C	SMD/SMT	15000	RISC	Microcontroller	Bulk	ST4SI2	活跃	1.8 V, 3 V, 5 V		Bulk	ST4SIM-200S		LTE-M										-		偏差网络										Flash				32 bit						2G, 3G, 4G, CDMA, LTE		SIM卡和智能卡接口				ARM SC300
XCZU4CG-L1FBVB900I4560	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-900	ARM Cortex A53, ARM Cortex R5	2 x 32 kB, 2 x 32 kB	2 x 32 kB, 2 x 32 kB	-	192150 LE	204 I/O	- 40 C	+ 100 C	2.6 Mbit	4.5 Mbit	10980 LAB		1	Zynq UltraScale+						This product may require additional documentation to export from the United States.	SMD/SMT	600 MHz, 1.5 GHz			XCZU4CG																	720 mV/850 mV								-								16 Transceiver					4 Core
XCZU6CG-L1FFVB1156I4560	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-1156	ARM Cortex A53, ARM Cortex R5	2 x 32 kB, 2 x 32 kB	2 x 32 kB, 2 x 32 kB	-	469446 LE	328 I/O	- 40 C	+ 100 C	6.9 Mbit	25.1 Mbit	26825.5 LAB		1	Zynq UltraScale+						This product may require additional documentation to export from the United States.	SMD/SMT	600 MHz, 1.5 GHz			XCZU6CG																	720 mV/850 mV								-								24 Transceiver					4 Core
XCZU4EV-L1FBVB900I4560	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-900	ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2	204 I/O	2.6 Mbit	4.5 Mbit	10980 LAB	1	Zynq UltraScale+							This product may require additional documentation to export from the United States.	SMD/SMT	600 MHz, 667 MHz, 1.5 GHz	2 x 32 kB, 4 x 32 kB	2 x 32 kB, 4 x 32 kB	-	192150 LE			XCZU4EV																									-								16 Transceiver					7 Core
XCZU5EG-L1SFVC784I4560	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-784	ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2	2 x 32 kB, 4 x 32 kB	2 x 32 kB, 4 x 32 kB	-	256200 LE	252 I/O	- 40 C	+ 100 C	3.5 Mbit	5.1 Mbit	14640 LAB		1	Zynq UltraScale+						This product may require additional documentation to export from the United States.	SMD/SMT	600 MHz, 667 MHz, 1.5 GHz			XCZU5EG																	720 mV/850 mV								-								4 Transceiver					7 Core
XCZU15EG-L1FFVB1156I4560	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-1156	ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2	2 x 32 kB, 4 x 32 kB	2 x 32 kB, 4 x 32 kB	-	746550 LE	328 I/O	- 40 C	+ 100 C	11.3 Mbit	26.2 Mbit	42660 LAB		1	Zynq UltraScale+						This product may require additional documentation to export from the United States.	SMD/SMT	600 MHz, 667 MHz, 1.5 GHz			XCZU15EG																	720 mV/850 mV								-								24 Transceiver					7 Core
XCZU7EG-L1FFVC1156I4560	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-1156	ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2	2 x 32 kB, 4 x 32 kB	2 x 32 kB, 4 x 32 kB	-	504000 LE	360 I/O	- 40 C	+ 100 C	6.2 Mbit	11 Mbit	28800 LAB		1	Zynq UltraScale+						This product may require additional documentation to export from the United States.	SMD/SMT	600 MHz, 667 MHz, 1.5 GHz			XCZU7EG																	720 mV/850 mV								-								20 Transceiver					7 Core
XCZU11EG-L1FFVF1517I4560	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-1517	ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2	2 x 32 kB, 4 x 32 kB	2 x 32 kB, 4 x 32 kB	-	653100 LE	464 I/O	Zynq UltraScale+	1	37320 LAB	21.1 Mbit	9.1 Mbit		+ 100 C	- 40 C						This product may require additional documentation to export from the United States.	SMD/SMT	600 MHz, 667 MHz, 1.5 GHz			XCZU11EG																	720 mV/850 mV								-								32 Transceiver					7 Core
XCZU7EV-L1FBVB900I4560	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-900	ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2	2 x 32 kB, 4 x 32 kB	2 x 32 kB, 4 x 32 kB	-	504000 LE	204 I/O	- 40 C	+ 100 C	6.2 Mbit	11 Mbit	28800 LAB		1	Zynq UltraScale+						This product may require additional documentation to export from the United States.	SMD/SMT	600 MHz, 667 MHz, 1.5 GHz			XCZU7EV																	720 mV/850 mV								-								16 Transceiver					7 Core
XCZU11EG-L1FFVC1156I4560	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-1156	ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2	2 x 32 kB, 4 x 32 kB	2 x 32 kB, 4 x 32 kB	-	653100 LE	360 I/O	- 40 C	+ 100 C	9.1 Mbit	21.1 Mbit	37320 LAB		1	Zynq UltraScale+						This product may require additional documentation to export from the United States.	SMD/SMT	600 MHz, 667 MHz, 1.5 GHz			XCZU11EG																	720 mV/850 mV								-								20 Transceiver					7 Core
XAZU11EG-1FFVF1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-1517	1517-FCBGA (40x40)	ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2	AMD 赛灵思	SMD/SMT	500 MHz, 600 MHz, 1.2 GHz	2 x 32 kB, 4 x 32 kB	2 x 32 kB, 4 x 32 kB	-	653100 LE	464 I/O	- 40 C	+ 100 C	9.1 Mbit	21.1 Mbit	37320 LAB	1	Zynq UltraScale+	活跃					This product may require additional documentation to export from the United States.	Details	-40°C ~ 100°C (TJ)		XAZU11EG																	0.85 V			500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		-	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						32 Transceiver		Zynq®UltraScale+™ FPGA, 192K+ Logic Cells			7 Core	-