category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	包装/外壳	表面安装	供应商器件包装	终端数量		Core											厂商																															操作温度	包装	系列	JESD-609代码	无铅代码	端子表面处理	附加功能	HTS代码	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	输出的数量	资历状况	工作电源电压	电源	温度等级	界面	速度	内存大小	核心处理器	周边设备	程序内存大小	连接方式	建筑学	输入数量	座位高度-最大	可编程逻辑类型	速度等级
M2S060-1FG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	有	4710 LAB	60	SmartFusion2	267	Tray	M2S060	活跃			This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					FPGA - 60K Logic Modules		1 Core	256KB
M2S150TS-FCS536I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	536-LFBGA, CSPBGA	YES	536-CSPBGA (16x16)	536	ARM Cortex M3	微芯片技术	293	Tray	M2S150	活跃	BGA,	网格排列	PLASTIC/EPOXY	1.2 V	30	1.14 V	无	M2S150TS-FCS536I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	90	1.2000 V	-40 to 100 °C	Tray	SmartFusion2	e0	无	Tin/Lead (Sn/Pb)		8542.39.00.01		BOTTOM	BALL	240		not_compliant		536	S-PBGA-B536							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA			现场可编程门阵列	STD	FPGA - 150K Logic Modules		1 Core	512KB
M2S090T-FCS325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	325-TFBGA, FCBGA	YES	325-FCBGA (11x13.5)	325	ARM Cortex M3	180	微芯片技术	Tray	M2S090	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	30	1.14 V	85 °C	无	M2S090T-FCS325	TFBGA	RECTANGULAR	活跃	MICROSEMI CORP	1.26 V	5.83		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	176	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant			R-PBGA-B325	180	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	180	1.16 mm	现场可编程门阵列		FPGA - 90K Logic Modules	86316	1 Core	512KB	13.5 mm	11 mm
M2S010-VFG400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	400-VFBGA (17x17)	ARM Cortex M3	微芯片技术	M2S010	活跃				This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	233 I/O	0 C	+ 85 C	有	1007 LAB	90	0.034371 oz	1.26 V	1.14 V	Tray	0°C ~ 85°C (TJ)	Tray	SmartFusion2																	1.2 V				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA				STD	FPGA - 10K Logic Modules		1 Core	256KB
M2S060TS-VF400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA	YES	400-VFBGA (17x17)	400	ARM Cortex M3	90	SmartFusion2	微芯片技术	207	Tray	M2S060	活跃	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	85 °C	5.87	1.26 V	MICROSEMI CORP	活跃	SQUARE	LFBGA	M2S060TS-VF400	无		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant			S-PBGA-B400	207	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	207	1.51 mm	现场可编程门阵列		FPGA - 60K Logic Modules	56520	1 Core	256KB	17 mm	17 mm
M2S025-1VFG256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	VFPBGA-256	256-FPBGA (17x17)	ARM Cortex M3	微芯片技术	27696 LE	有	2308 LAB	119	138	Tray	M2S025	活跃			This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	0°C ~ 85°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					FPGA - 25K Logic Modules		1 Core	256KB
M2S050TS-1VF400I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	YES	400-VFBGA (17x17)	400	ARM Cortex M3	微芯片技术	207	Tray	M2S050	活跃	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	1.2 V	30	1.14 V	无	M2S050TS-1VF400I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84		90	4695 LAB	有	56340 LE	64 kB	-	-	166 MHz	SMD/SMT	N	This product may require additional documentation to export from the United States.	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)		8542.39.00.01		BOTTOM	BALL	240	0.8 mm	not_compliant			S-PBGA-B400							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		1.51 mm	现场可编程门阵列	1	FPGA - 50K Logic Modules		1 Core	256KB	17 mm	17 mm
M2S090T-FG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	7193 LAB	60	微芯片技术	267	Tray	M2S090	活跃	BGA, BGA484,22X22,40	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	30	1.14 V	无	M2S090T-FG484I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.83		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant			S-PBGA-B484	267	不合格		1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	2.44 mm	现场可编程门阵列		FPGA - 90K Logic Modules	86316	1 Core	512KB	23 mm	23 mm
M2S150-FC1152	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	YES	1152-FCBGA (35x35)	1152	ARM Cortex M3	24	1.2000 V	微芯片技术	574	Tray	M2S150	活跃	FBGA-1152	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	1.2 V	30	1.14 V	85 °C	无	M2S150-FC1152	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	0 to 85 °C	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant			S-PBGA-B1152	574	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	574	2.9 mm	现场可编程门阵列	STD	FPGA - 150K Logic Modules	146124	1 Core	512KB	35 mm	35 mm
M2S090TS-FCSG325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-325	YES	325-FCBGA (11x13.5)	325	ARM Cortex M3	有	7193 LAB	176	微芯片技术	1.2, 1.5, 1.8, 2.5, 3.3 V	180	Tray	M2S090	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	40	1.14 V	有	M2S090TS-FCSG325I	TFBGA	RECTANGULAR	活跃	MICROSEMI CORP	1.26 V	5.8		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1		Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant			R-PBGA-B325	180	不合格		1.2 V		CAN/Ethernet/Serial	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	180	1.16 mm	现场可编程门阵列		FPGA - 90K Logic Modules	86316	1 Core	512KB	13.5 mm	11 mm
M2S060T-FG676I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	676-BGA	676-FBGA (27x27)	ARM Cortex M3	微芯片技术	有	4710 LAB	40	SmartFusion2	387	Tray	M2S060	活跃			This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					FPGA - 60K Logic Modules		1 Core	256KB
M2S050TS-1VFG400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	VFPBGA-400	400-VFBGA (17x17)	ARM Cortex M3	微芯片技术	56340 LE	有	4695 LAB	90	207	Tray	M2S050	活跃			This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	0°C ~ 85°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					FPGA - 50K Logic Modules		1 Core	256KB
M2S060-1FGG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	有	4710 LAB	60	SmartFusion2	267	Tray	M2S060	活跃			This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	56520 LE	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					FPGA - 60K Logic Modules		1 Core	256KB
M2S025T-1VF400I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	YES	400-VFBGA (17x17)	400	ARM Cortex M3	27696 LE	有	2308 LAB	90	微芯片技术	1.2000 V	1.14 V	1.26 V	207	Tray	M2S025	活跃	LFBGA, BGA400,20X20,32	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	无	M2S025T-1VF400I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.87		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	-40 to 100 °C	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant			S-PBGA-B400	160	不合格		1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	160	1.51 mm	现场可编程门阵列	1	FPGA - 25K Logic Modules	23988	1 Core	256KB	17 mm	17 mm
M2S060T-1VFG400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	400-LFBGA	YES	400-VFBGA (17x17)	400	ARM Cortex M3	SmartFusion2	微芯片技术	207	Tray	M2S060	活跃	LFBGA, BGA400,20X20,32	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	1.14 V	85 °C	有	M2S060T-1VFG400	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.8	This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	90	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1		Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant	40		S-PBGA-B400	207	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	207	1.51 mm	现场可编程门阵列		FPGA - 60K Logic Modules	56520	1 Core	256KB	17 mm	17 mm
M2S090-FCSG325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	325-TFBGA, FCBGA	YES	325-FCBGA (11x13.5)	325	ARM Cortex M3	7193 LAB	176	180	微芯片技术	Tray	M2S090	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	40	1.14 V	85 °C	有	M2S090-FCSG325	TFBGA	RECTANGULAR	活跃	FPGA - Field Programmable Gate Array SmartFusion2	MICROSEMI CORP	1.26 V	5.78		This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	86316 LE	有	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1		Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant			R-PBGA-B325	180	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	180	1.16 mm	现场可编程门阵列		FPGA - 90K Logic Modules	86316	1 Core	512KB	13.5 mm	11 mm
M2S010-1VFG256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-256	YES	256-FPBGA (17x17)	256	ARM Cortex M3	12084 LE	有	1007 LAB	119	微芯片技术	1.2000 V	138	Tray	M2S010	活跃	VFBGA-256	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA256,16X16,32	1.2 V	40	1.14 V	85 °C	有	M2S010-1VFG256	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.77		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	0 to 85 °C	Tray	SmartFusion2	e1		Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant			S-PBGA-B256	138	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	138	1.56 mm	现场可编程门阵列	1	FPGA - 10K Logic Modules	12084	1 Core	256KB	14 mm	14 mm
M2S150TS-1FCG1152I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-1152	1152-FCBGA (35x35)	ARM Cortex M3	微芯片技术	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	24	1.2000 V	574	Tray	M2S150	活跃				This product may require additional documentation to export from the United States.	Details	SMD/SMT	-40 to 100 °C	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA				1	FPGA - 150K Logic Modules		1 Core	512KB
M2S090TS-FCS325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	325-TFBGA, FCBGA	YES	325-FCBGA (11x13.5)	325	ARM Cortex M3	176	1.2000 V	微芯片技术	180	Tray	M2S090	活跃	TFBGA, BGA325,21X21,20	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	30	1.14 V	85 °C	无	M2S090TS-FCS325	TFBGA	RECTANGULAR	活跃	MICROSEMI CORP	1.26 V	5.83		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	0 to 85 °C	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant			R-PBGA-B325	180	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	180	1.16 mm	现场可编程门阵列	STD	FPGA - 90K Logic Modules	86316	1 Core	512KB	13.5 mm	11 mm
M2S005S-FGG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BGA	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	有	505 LAB	60	209	Tray	M2S005	活跃				This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	6060 LE	0°C ~ 85°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					FPGA - 5K Logic Modules		1 Core	128KB
M2S025T-1VF256I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	256-LFBGA	256-FPBGA (14x14)	ARM Cortex M3	微芯片技术	27696 LE	有	2308 LAB	119	138	Tray	M2S025	活跃			This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					FPGA - 25K Logic Modules		1 Core	256KB
M2S050-1VF400I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	YES	400-VFBGA (17x17)	400	ARM Cortex M3	56340 LE	有	4695 LAB	90	微芯片技术	1.2000 V	1.14 V	1.26 V	207	Tray	M2S050	活跃	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	无	M2S050-1VF400I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.77		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	-40 to 100 °C	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant			S-PBGA-B400	160	不合格		1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	160	1.51 mm	现场可编程门阵列	1	FPGA - 50K Logic Modules	48672	1 Core	256KB	17 mm	17 mm
M2S060-FGG676I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	676-BGA	YES	676-FBGA (27x27)	676	ARM Cortex M3	56520 LE	有	4710 LAB	40	SmartFusion2	微芯片技术	1.2000 V	1.14 V	1.26 V	387	Tray	M2S060	活跃	FBGA-676	网格排列	3	PLASTIC/EPOXY	BGA676,26X26,40	1.2 V	40	1.14 V	有	M2S060-FGG676I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.8		This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	-40 to 100 °C	Tray	SmartFusion2	e1		Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant			S-PBGA-B676	387	不合格		1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	387	2.44 mm	现场可编程门阵列	STD	FPGA - 60K Logic Modules	56520	1 Core	256KB	27 mm	27 mm
M2S060-FCSG325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	ARM Cortex M3	56520 LE	有	4710 LAB	176	SmartFusion2	微芯片技术	1.2000 V	1.14 V	1.26 V	200	Tray	M2S060	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	40	1.14 V	85 °C	有	M2S060-FCSG325	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81	This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	0 to 85 °C	Tray	SmartFusion2	e1		Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant			S-PBGA-B325	200	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200	1.01 mm	现场可编程门阵列	STD	FPGA - 60K Logic Modules	56520	1 Core	256KB	11 mm	11 mm
M2S050T-FCS325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325-FCBGA (11x11)	325	ARM Cortex M3	微芯片技术	200	Tray	M2S050	活跃	TFBGA, BGA325,21X21,20	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	30	1.14 V	无	M2S050T-FCS325I	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81	This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	176	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant			S-PBGA-B325	200	不合格		1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200	1.01 mm	现场可编程门阵列		FPGA - 50K Logic Modules	56340	1 Core	256KB	11 mm	11 mm