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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	包装/外壳	供应商器件包装	材料	质量		厂商					操作温度	包装	系列	尺寸/尺寸	容差	零件状态	终止次数	温度系数	类型	电阻	组成	颜色	应用	功率(瓦特)	电压 - 供电	基本部件号	输出量	失败率	通道数量	界面	速度	内存大小	核心处理器	周边设备	连接方式	电流源	建筑学	输入	数据率（最大）	主要属性	延迟时间	闪光大小	电容-输入	信号调理	高度	长度	宽度
XCVM1302-1MSIVFVC1596	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA	1596-BGA (37.5x37.5)		532	AMD	Tray	活跃			-40°C ~ 100°C (TJ)		Versal™ Prime																		600MHz, 1.3GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA			Versal™ Prime FPGA, 70k Logic Cells		-
XCVM1402-2MSENSVF1369	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Obsolete (Last Updated: 2 years ago)	1369-BFBGA	1369-BGA (35x35)		5.800001 g	OBSOLETE (Last Updated: 2 years ago)	AMD	Compliant	424	Tray	活跃	0°C ~ 100°C (TJ)		Versal™ Prime																		600MHz, 1.4GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA			Versal™ Prime FPGA, 1.2M Logic Cells		-			8.382 mm	22.86 mm	21.082 mm
XCZU42DR-L2FFVE1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)		366	AMD	Tray	活跃			-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																	CAN/Serial I2C/SPI/U	533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA			Zynq®UltraScale+™ FPGA, 489K+ Logic Cells		-
XCZU1CG-2UBVA494E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	494-WFBGA, FCBGA	494-FCBGA (14x14)		82	AMD	Tray	活跃			0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC CG																		533MHz, 1.333GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	-		MPU, FPGA			Zynq®UltraScale+™ FPGA, 81K+ Logic Cells		-
XCVE1752-1LSINSVG1369	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8-TSSOP, 8-MSOP (0.118, 3.00mm Width)	8-TSSOP		500	AMD	Tray	活跃			-40°C ~ 85°C	Tape & Reel (TR)	--			Obsolete			Buffer, ReDriver				I²C - Hotswap		2.7 V ~ 5.5 V	PCA9510	2-Wire Bus		1		400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	6mA	MPU, FPGA	2-Wire Bus	400kHz	Versal™ AI Core FPGA, 1M Logic Cells	--	-	1.9pF		--
XCVM1802-1MLIVSVA2197	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)		770	AMD	Tray	活跃			-40°C ~ 100°C (TJ)		*			活跃															600MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA			Versal™ Prime FPGA, 1.9M Logic Cells		-
XCVM1302-2MLENSVF1369	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)		316	AMD	Tray	活跃			0°C ~ 100°C (TJ)		*			活跃															600MHz, 1.4GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA			Versal™ Prime FPGA, 70k Logic Cells		-
XCVE1752-2LLEVSVA2197	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Axial, Radial Bend	Panasert		608	AMD	Tray	活跃			-55°C ~ 155°C	Tape & Reel (TR)	CF	0.091 Dia x 0.236 L (2.30mm x 6.00mm)	±5%	活跃	2	0/ -400ppm/°C		100 Ohms	碳膜			0.25W, 1/4W				--			450MHz, 1.08GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA			Versal™ AI Core FPGA, 1M Logic Cells		-		Flame Retardant Coating, Safety		--
XCVM1302-1LLIVFVC1596	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Axial, Radial Bend	Panasert		532	AMD	Tray	活跃			-55°C ~ 155°C	Tape & Reel (TR)	CF	0.091 Dia x 0.236 L (2.30mm x 6.00mm)	±5%	活跃	2	0/ -400ppm/°C		16 Ohms	碳膜			0.25W, 1/4W				--			400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA			Versal™ Prime FPGA, 70k Logic Cells		-		Flame Retardant Coating, Safety		--
LS1046AMN3T1A-N2	Teledyne LeCroy	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Axial, Radial Bend	Axial					-55°C ~ 155°C	Tape & Reel (TR)	RNF	0.093 Dia x 0.250 L (2.35mm x 6.35mm)	±1%	活跃	2	±100ppm/°C		43.2 kOhms	Metal Film			0.25W, 1/4W				--																Flame Retardant Coating, Safety			--
XCVC1702-2LSENSVG1369	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)		500	AMD	Tray	活跃			0°C ~ 100°C (TJ)		Versal™ AI Core																		450MHz, 1.08GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA			Versal™ AI Core FPGA, 1M Logic Cells		-
XCVM1402-1LSINSVF1369	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)		424	AMD	Tray	活跃			-40°C ~ 100°C (TJ)		Versal™ Prime																		400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA			Versal™ Prime FPGA, 1.2M Logic Cells		-
XCVM1802-1MLIVSVD1760	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)		726	AMD	Tray	活跃			-40°C ~ 100°C (TJ)		Versal™ Prime																		600MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA			Versal™ Prime FPGA, 1.9M Logic Cells		-
XCVC1902-2MSIVSVD1760	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)		692	AMD	Tray	活跃			-40°C ~ 100°C (TJ)		Versal™ AI Core																		600MHz, 1.4GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA			Versal™ AI Core FPGA, 1.9M Logic Cells		-
XCVC1902-1MSIVSVA2197	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	Metal, Steel	770	AMD	Tray	活跃			-40°C ~ 100°C (TJ)		Versal™ AI Core									Grey									600MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA			Versal™ AI Core FPGA, 1.9M Logic Cells		-
XCVC1702-2LLENSVG1369	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)		500	AMD	Tray	活跃			0°C ~ 100°C (TJ)		Versal™ AI Core																		450MHz, 1.08GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA			Versal™ AI Core FPGA, 1M Logic Cells		-
XCZU1EG-2SFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)			Non-Compliant	AMD	-	Tray	活跃		-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																	CAN/Serial I2C/SPI/U	533MHz, 600MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	-		MPU, FPGA			-		-
XCVM1402-2MSENBVB1024	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1024-BFBGA	1024-BGA (31x31)		424	AMD	Tray	活跃			0°C ~ 100°C (TJ)		Versal™ Prime																		600MHz, 1.4GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA			Versal™ Prime FPGA, 1.2M Logic Cells		-
XCVM1802-1LLIVSVA2197	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)		770	AMD	Tray	活跃			-40°C ~ 100°C (TJ)		Versal™ Prime																		400MHz, 1GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA			Versal™ Prime FPGA, 1.9M Logic Cells		-
XCVC1802-1MSEVSVD1760	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)		692	AMD	Tray	活跃			0°C ~ 100°C (TJ)		Versal™ AI Core																		600MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA			Versal™ AI Core FPGA, 1.5M Logic Cells		-
XCVM1402-1MLIVSVD1760	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)		726	AMD	Tray	活跃			-40°C ~ 100°C (TJ)		Versal™ Prime																		600MHz, 1.3GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA			Versal™ Prime FPGA, 1.2M Logic Cells		-
XCVC1902-1MSEVIVA1596	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA, FCBGA	1596-FCBGA (40x40)		500	AMD	Tray	活跃			0°C ~ 100°C (TJ)		Versal™ AI Core																		600MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA			Versal™ AI Core FPGA, 1.9M Logic Cells		-
XCZU57DR-L1FFVE1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)		-	AMD	Tray	活跃			-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC DR																		500MHz, 1.2GHz	-	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA			Zynq® UltraScale+™ RFSoC		-
XCZU55DR-L2FSVE1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)		-	AMD	Tray	活跃			-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC DR																		533MHz, 1.3GHz	-	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA			Zynq® UltraScale+™ RFSoC		-
XCZU2CG-L1UBVA530I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	530-WFBGA, FCBGA	530-FCBGA (16x9.5)		82	AMD	Tray	活跃			-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC CG																		500MHz, 1.2GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA			Zynq®UltraScale+™ FPGA, 103K+ Logic Cells		-