category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

类别是'category.片上系统（SoC）' (7695)

所有品牌

产品型号	品牌	数据表	库存	价格(含增值税)	数量	包装/外壳	表面安装	供应商器件包装	终端数量													厂商																														操作温度	包装	系列	JESD-609代码	零件状态	端子表面处理	HTS代码	子类别	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	JESD-30代码	输出的数量	资历状况	工作电源电压	电源	温度等级	速度	内存大小	核心处理器	周边设备	程序内存大小	连接方式	建筑学	输入数量	座位高度-最大
XAZU4EV-L1SFVC784I	AMD	数据表	86 In Stock	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD	XAZU4	活跃			0.7200 V	0.698 V	0.742 V	252	Tray	-40 to 100 °C		Zynq® UltraScale+™ MPSoC EV																			500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					1L	Zynq®UltraScale+™ FPGA, 192K+ Logic Cells			-
M2S010T-1FG484	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BGA	YES	484-FPBGA (23x23)	484	SMD/SMT	-	微芯片技术	64 kB	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	30	1.14 V	85 °C	无	M2S010T-1FG484	BGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.3	1.2000 V	1.14 V	1.26 V	233	Tray	M2S010	活跃	-	166 MHz	12084 LE	0 to 85 °C		SmartFusion®2	e0		Tin/Lead (Sn/Pb)	8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	240	1 mm	not_compliant		S-PBGA-B484	233	不合格		1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	233	2.44 mm	现场可编程门阵列		1	FPGA - 10K Logic Modules	9744	1 Core	256KB		23 mm	23 mm
M2S150T-1FCV484I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA	484-FBGA (19x19)	微芯片技术		1.2000 V	1.14 V	1.26 V	273	Tray	M2S150	活跃	-	166 MHz	146124 LE	-	64 kB		-40 to 100 °C		SmartFusion®2																			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					1	FPGA - 150K Logic Modules		1 Core	512KB
M2S010T-1VF400I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA	YES	400-VFBGA (17x17)	400	微芯片技术	30	1.14 V	无	M2S010T-1VF400I	LFBGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.3	-	166 MHz	12084 LE	SMD/SMT	-	64 kB	1.2000 V	1.14 V	1.26 V	195	Tray	M2S010	活跃	LFBGA, BGA400,20X20,32	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	-40 to 100 °C		SmartFusion®2	e0		Tin/Lead (Sn/Pb)	8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant		S-PBGA-B400	160	不合格		1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	160	1.51 mm	现场可编程门阵列		1	FPGA - 10K Logic Modules	9744	1 Core	256KB		17 mm	17 mm
XCZU7EG-1FFVC1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD	0.892 V	360	Tray	XCZU7	活跃			0.808 V	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																			500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					1	Zynq®UltraScale+™ FPGA, 504K+ Logic Cells			-
M2S090T-1FGG676I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	676-BGA	YES	676-FBGA (27x27)	676	微芯片技术	5.78	1.2000 V	425	Tray	M2S090	活跃	FBGA-676	网格排列	3	PLASTIC/EPOXY	BGA676,26X26,40	1.2 V	1.14 V	有	M2S090T-1FGG676I	BGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	-40 to 100 °C		SmartFusion®2	e1		Tin/Silver/Copper (Sn/Ag/Cu)	8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	250	1 mm	compliant	40	S-PBGA-B676	425	不合格		1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	425	2.44 mm	现场可编程门阵列		1	FPGA - 90K Logic Modules	86316		512KB		27 mm	27 mm
M2S150-1FCG1152I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	1152-FCBGA (35x35)	微芯片技术	Tray	M2S150	活跃	-	166 MHz	146124 LE	SMD/SMT	-	64 kB			1.2000 V	574	-40 to 100 °C		SmartFusion®2																			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					1	FPGA - 150K Logic Modules		1 Core	512KB
BCM33843MVFSBGB0T	Broadcom	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Broadcom Limited	Cutler Hammer, Div of Eaton Co	-	Tray	BCM33843	Obsolete			E22VB51	-		-																			2.4GHz, 5GHz	-	-	-		-	-						-			-
10AS066H1F34E1HG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	1152-FBGA (35x35)	Arria 10 SoC	Details	2 x 32 kB	-	有	活跃	INTEL CORP	5.66			96000	Cully-Minerallac	492	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	660000 LE	+ 100 C	0 C	24	SMD/SMT		82500 LAB	966266	Intel / Altera	0°C ~ 100°C (TJ)	Tray	Arria 10 SX		活跃			SOC - Systems on a Chip						unknown					950 mV			1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				SoC FPGA		FPGA - 660K Logic Elements		2 Core	--	SoC FPGA
XCVM1302-2MLINBVB1024	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1024-BFBGA	1024-BGA (31x31)	AMD	Tray	活跃			316	-40°C ~ 100°C (TJ)		Versal™ Prime																			600MHz, 1.4GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Prime FPGA, 70k Logic Cells			-
XCVM1402-2MLIVFVC1596	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA	1596-BGA (37.5x37.5)	AMD	Tray	活跃			748	-40°C ~ 100°C (TJ)		Versal™ Prime																			600MHz, 1.4GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Prime FPGA, 1.2M Logic Cells			-
XCZU57DR-1FSVE1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD	Tray	活跃			-	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC DR																			500MHz, 1.2GHz	-	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Zynq® UltraScale+™ RFSoC			-
XCVM1302-1MSIVFVC1596	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA	1596-BGA (37.5x37.5)	AMD	Tray	活跃			532	-40°C ~ 100°C (TJ)		Versal™ Prime																			600MHz, 1.3GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Prime FPGA, 70k Logic Cells			-
XCVM1402-2MSENBVB1024	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1024-BFBGA	1024-BGA (31x31)	AMD	Tray	活跃			424	0°C ~ 100°C (TJ)		Versal™ Prime																			600MHz, 1.4GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Prime FPGA, 1.2M Logic Cells			-
XCVM1802-1LLIVSVA2197	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD	Tray	活跃			770	-40°C ~ 100°C (TJ)		Versal™ Prime																			400MHz, 1GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Prime FPGA, 1.9M Logic Cells			-
XCVC1802-1MSEVSVD1760	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD	Tray	活跃			692	0°C ~ 100°C (TJ)		Versal™ AI Core																			600MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ AI Core FPGA, 1.5M Logic Cells			-
XCVM1402-1MLIVSVD1760	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD	Tray	活跃			726	-40°C ~ 100°C (TJ)		Versal™ Prime																			600MHz, 1.3GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Prime FPGA, 1.2M Logic Cells			-
XCVC1902-1MSEVIVA1596	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA, FCBGA	1596-FCBGA (40x40)	AMD	Tray	活跃			500	0°C ~ 100°C (TJ)		Versal™ AI Core																			600MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ AI Core FPGA, 1.9M Logic Cells			-
XCZU57DR-L1FFVE1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD	Tray	活跃			-	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC DR																			500MHz, 1.2GHz	-	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Zynq® UltraScale+™ RFSoC			-
XCZU55DR-L2FSVE1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD	Tray	活跃			-	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC DR																			533MHz, 1.3GHz	-	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Zynq® UltraScale+™ RFSoC			-
XCVM1302-1MLIVFVC1596	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA	1596-BGA (37.5x37.5)	AMD	Tray	活跃			532	-40°C ~ 100°C (TJ)		Versal™ Prime																			600MHz, 1.3GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Prime FPGA, 70k Logic Cells			-
XCVE1752-1LLINSVG1369	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD	Tray	活跃			500	-40°C ~ 100°C (TJ)		Versal™ AI Core																			400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ AI Core FPGA, 1M Logic Cells			-
XCVC1802-1LSIVSVA2197	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD	Tray	活跃			770	-40°C ~ 100°C (TJ)		Versal™ AI Core																			400MHz, 1GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ AI Core FPGA, 1.5M Logic Cells			-
XCVC1802-1MSEVIVA1596	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA, FCBGA	1596-FCBGA (40x40)	AMD	Tray	活跃			500	0°C ~ 100°C (TJ)		Versal™ AI Core																			600MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ AI Core FPGA, 1.5M Logic Cells			-
XCVM1302-2MLIVFVC1596	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA	1596-BGA (37.5x37.5)	AMD	Tray	活跃			532	-40°C ~ 100°C (TJ)		Versal™ Prime																			600MHz, 1.4GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Prime FPGA, 70k Logic Cells			-