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产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	包装/外壳	表面安装		操作温度	包装	已出版	系列	JESD-609代码	无铅代码	零件状态	湿度敏感性等级(MSL)	终止次数	端子表面处理	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	电源电压	端子间距	频率	时间@峰值回流温度-最大值(s)	基本部件号	JESD-30代码	输出的数量	资历状况	电源电压-最大值(Vsup)	电源	电源电压-最小值(Vsup)	界面	速度	内存大小	uPs/uCs/外围ICs类型	核心处理器	周边设备	连接方式	建筑学	输入数量	可编程逻辑类型	核心架构	边界扫描	内存(字)	主要属性	逻辑单元数	总线兼容性	座位高度(最大)	长度	宽度	RoHS状态
XCZU2CG-2SFVC784I	Xilinx Inc.	数据表	725 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	YES	252	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	784			8542.31.00.01	BOTTOM	BALL	未说明	0.85V			未说明		S-PBGA-B784							533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 103K+ Logic Cells						ROHS3 Compliant
5CSXFC2C6U23C8N	Intel	数据表	13 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES	MCU - 181, FPGA - 145	0°C~85°C TJ	Tray	2018	Cyclone® V SX			活跃	3 (168 Hours)	672			8542.39.00.01	BOTTOM	BALL	未说明	1.1V	0.8mm		未说明	5CSXFC2	S-PBGA-B672	145	不合格	1.13V	1.11.2/3.32.5V	1.07V		600MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	145	现场可编程门阵列				FPGA - 25K Logic Elements	25000		1.85mm	23mm	23mm	符合RoHS标准
XC7Z045-2FF900E	Xilinx Inc.	数据表	677 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	900-BBGA, FCBGA	YES	130	0°C~100°C TJ	Tray	2010	Zynq®-7000		no	活跃	4 (72 Hours)	900		GPIO WITH FOUR 32-BIT BANKS	8542.39.00.01	BOTTOM	BALL				800MHz			S-PBGA-B900						CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			ARM	YES	256000	Kintex™-7 FPGA, 350K Logic Cells		CAN, ETHERNET, I2C, PCI, SPI, UART, USB				Non-RoHS Compliant
XCZU9EG-1FFVC900E	Xilinx Inc.	数据表	630 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA		204	0°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)																				500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 599K+ Logic Cells						ROHS3 Compliant
XCZU15EG-L2FFVB1156E	Xilinx Inc.	数据表	5180 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA	YES	328	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明		R-PBGA-B1156			0.742V		0.698V		533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 747K+ Logic Cells						ROHS3 Compliant
XCZU7EV-L2FBVB900E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES	204	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)	900		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明		R-PBGA-B900			0.742V		0.698V		533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 504K+ Logic Cells						ROHS3 Compliant
XCZU3CG-2SFVA625I	Xilinx Inc.	数据表	680 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA	YES	180	-40°C~100°C TJ	Bulk	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	625			8542.31.00.01	BOTTOM	BALL	未说明	0.85V			未说明		R-PBGA-B625			0.876V		0.825V		533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 154K+ Logic Cells						ROHS3 Compliant
10AS027E3F29I2SG	Intel	数据表	3000 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	780-BBGA, FCBGA	YES	360	-40°C~100°C TJ	Tray		Arria 10 SX			活跃	3 (168 Hours)	780			8542.39.00.01	BOTTOM	BALL	未说明	0.9V	1mm		未说明		S-PBGA-B780	360	不合格	0.93V	0.9V	0.87V		1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	360	现场可编程门阵列				FPGA - 270K Logic Elements	270000		3.35mm	29mm	29mm	符合RoHS标准
XCZU7CG-2FFVC1156E	Xilinx Inc.	数据表	40 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA		360	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG		yes	活跃	4 (72 Hours)				8542.31.00.01			未说明				未说明									533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 504K+ Logic Cells						ROHS3 Compliant
5CSEBA5U23A7N	Intel	数据表	1200 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES	MCU - 181, FPGA - 145	-40°C~125°C TJ	Tray	2018	Automotive, AEC-Q100, Cyclone® V SE			活跃	3 (168 Hours)	672			8542.39.00.01	BOTTOM	BALL	未说明	1.1V	0.8mm		未说明	5CSEBA5	S-PBGA-B672	145	不合格	1.13V	1.11.2/3.32.5V	1.07V		700MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	145	现场可编程门阵列				FPGA - 85K Logic Elements	85000		1.85mm	23mm	23mm	符合RoHS标准
5CSEMA5F31A7N	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8 Weeks	896-BGA	YES	MCU - 181, FPGA - 288	-40°C~125°C TJ	Tray	2018	Automotive, AEC-Q100, Cyclone® V SE	e1		活跃	3 (168 Hours)	896	锡银铜			BOTTOM	BALL	未说明	1.1V	1mm		未说明	5CSEMA5	S-PBGA-B896	288	不合格	1.13V	1.11.2/3.32.5V	1.07V		700MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	288	现场可编程门阵列				FPGA - 85K Logic Elements	85000		2mm	31mm	31mm	符合RoHS标准
5CSEBA5U19C7N	Intel	数据表	1172 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	484-FBGA	YES	MCU - 151, FPGA - 66	0°C~85°C TJ	Tray	2018	Cyclone® V SE			活跃	3 (168 Hours)	484				BOTTOM	BALL	未说明	1.1V	0.8mm		未说明	5CSEBA5	S-PBGA-B484	66	不合格	1.13V	1.11.2/3.32.5V	1.07V		800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	66	现场可编程门阵列				FPGA - 85K Logic Elements	85000		1.9mm	19mm	19mm	符合RoHS标准
XAZU2EG-L1SFVA625I	Xilinx Inc.	数据表	746 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA	YES	128	-40°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG			活跃	3 (168 Hours)	625			8542.31.00.01	BOTTOM	BALL	未说明	0.72V	0.8mm		未说明		S-PBGA-B625							500MHz, 1.2GHz	1.2MB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, I2C, SPI, UART/USART, USB	MPU, FPGA						Zynq®UltraScale+™ FPGA, 103K+ Logic Cells			3.43mm	21mm	21mm	ROHS3 Compliant
XCZU2CG-2SFVA625I	Xilinx Inc.	数据表	625 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA	YES	180	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG	e1		活跃	4 (72 Hours)	625	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		8542.31.00.01	BOTTOM	BALL	未说明	0.85V			未说明		R-PBGA-B625			0.876V		0.825V		533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 103K+ Logic Cells						ROHS3 Compliant
XCZU5EG-1FBVB900I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA		204	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				8542.31.00.01			未说明				未说明									500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 256K+ Logic Cells						ROHS3 Compliant
XCZU4EV-2FBVB900I	Xilinx Inc.	数据表	2000 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA		204	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)				8542.31.00.01			未说明				未说明									533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 192K+ Logic Cells						ROHS3 Compliant
XCZU7EG-1FFVC1156I	Xilinx Inc.	数据表	58 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA		360	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				8542.31.00.01			未说明				未说明									500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 504K+ Logic Cells						ROHS3 Compliant
XAZU2EG-1SFVC784I	Xilinx Inc.	数据表	2684 In Stock	1: ¥2,823.443496 10: ¥2,663.625939 100: ¥2,512.854661 500: ¥2,370.617602 查看所有的价格 -	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	YES	128	-40°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG			活跃	3 (168 Hours)	784			8542.31.00.01	BOTTOM	BALL	未说明	0.85V	0.8mm		未说明		S-PBGA-B784							500MHz, 1.2GHz	1.2MB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, I2C, SPI, UART/USART, USB	MPU, FPGA						Zynq®UltraScale+™ FPGA, 103K+ Logic Cells			3.32mm	23mm	23mm	ROHS3 Compliant
10AS066H2F34E2SG	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8 Weeks	1152-BBGA, FCBGA	YES	492	0°C~100°C TJ	Tray		Arria 10 SX			活跃	3 (168 Hours)				8542.39.00.01	BOTTOM	BALL	未说明	0.9V	1mm		未说明		S-PBGA-B1152	492	不合格	0.93V	0.9V	0.87V		1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	492	现场可编程门阵列				FPGA - 660K Logic Elements	660000		3.65mm	35mm	35mm	符合RoHS标准
XCZU2CG-L1SFVC784I	Xilinx Inc.	数据表	2434 In Stock	1: ¥2,872.283553 10: ¥2,709.701465 100: ¥2,556.322136 500: ¥2,411.624661 查看所有的价格 -	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	YES	252	-40°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	784		IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明		S-PBGA-B784							500MHz, 1.2GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 103K+ Logic Cells						ROHS3 Compliant
XCZU2CG-L1SFVA625I	Xilinx Inc.	数据表	174 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA	YES	180	-40°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	625		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明		R-PBGA-B625			0.742V		0.698V		500MHz, 1.2GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 103K+ Logic Cells						ROHS3 Compliant
XCZU9CG-L1FFVB1156I	Xilinx Inc.	数据表	2398 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA	YES	328	-40°C~100°C TJ	Bulk	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明		R-PBGA-B1156			0.742V		0.698V		500MHz, 1.2GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 599K+ Logic Cells						ROHS3 Compliant
XCZU5EV-1FBVB900I	Xilinx Inc.	数据表	500 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA		204	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)				8542.31.00.01			未说明				未说明									500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 256K+ Logic Cells						ROHS3 Compliant
XCZU4CG-2FBVB900I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES	204	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	900			8542.31.00.01	BOTTOM	BALL	未说明	0.85V			未说明		R-PBGA-B900			0.876V		0.825V		533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 192K+ Logic Cells						ROHS3 Compliant
XAZU3EG-1SFVA625Q	Xilinx Inc.	数据表	3000 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA	YES	128	-40°C~125°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	625			8542.31.00.01	BOTTOM	BALL	未说明	0.85V	0.8mm		未说明		S-PBGA-B625							500MHz, 1.2GHz	1.8MB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, I2C, SPI, UART/USART, USB	MPU, FPGA						Zynq®UltraScale+™ FPGA, 154K+ Logic Cells			3.43mm	21mm	21mm	ROHS3 Compliant