category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	安装类型	包装/外壳	表面安装	引脚数	供应商器件包装	终端数量						厂商																								操作温度	包装	系列	尺寸/尺寸	容差	JESD-609代码	零件状态	连接器类型	端子表面处理	最高工作温度	最小工作温度	HTS代码	电容量	子类别	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	频率	基本部件号	JESD-30代码	输出的数量	资历状况	工作电源电压	电源	温度等级	电压	界面	内存大小	速度	内存大小	核心处理器	极数	周边设备	连接方式	数据率	建筑学	输出电流-最大值	输入数量	座位高度-最大	可编程逻辑类型	逻辑元件/单元数	核心架构	最高频率	逻辑块数(LABs)	速度等级	收发器数量	主要属性
5CSEBA4U23C6N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	672-FBGA	672-UBGA (23x23)		MCU - 181, FPGA - 145					0°C ~ 85°C (TJ)	Tray	Cyclone® V SE				活跃																								925MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA											FPGA - 40K Logic Elements			--
5CSEBA5U19I7SN	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-FBGA	YES	484-UBGA (19x19)	484	有	5CSEBA5U19I7SN	FBGA	SQUARE	Intel Corporation	活跃	INTEL CORP	1.13 V	5.55			MCU - 151, FPGA - 66	FBGA, BGA484,22X22,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA484,22X22,32		1.1 V	未说明	1.07 V	-40°C ~ 100°C (TJ)	Tray	Cyclone® V SE				活跃							现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	0.8 mm	compliant		5CSEBA5	S-PBGA-B484	66	不合格		1.1,1.2/3.3,2.5 V				800MHz	64KB	Single ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA		66	1.9 mm	现场可编程门阵列							FPGA - 85K Logic Elements	85000		--			19 mm	19 mm
5CSEMA4U23C8N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	672-FBGA	672-UBGA (23x23)		MCU - 181, FPGA - 145					0°C ~ 85°C (TJ)	Tray	Cyclone® V SE				活跃	PCB Terminal Blocks with Wire																							600MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	19	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA											FPGA - 40K Logic Elements		300V	--	17.5A
5CSEBA2U23C6N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	672-FBGA	672-UBGA (23x23)		MCU - 181, FPGA - 145					0°C ~ 85°C (TJ)	Tray	Cyclone® V SE				活跃	PCB Terminal Blocks with Wire																							925MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	28	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA											FPGA - 25K Logic Elements		300V	--	17.5A
5CSEBA4U23C7N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	672-FBGA	672-UBGA (23x23)		MCU - 181, FPGA - 145					0°C ~ 85°C (TJ)	Tray	Cyclone® V SE				活跃																								800MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA											FPGA - 40K Logic Elements			--
5CSEBA2U23I7SN	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	672-FBGA	672-UBGA (23x23)		MCU - 181, FPGA - 145					-40°C ~ 100°C (TJ)	Tray	Cyclone® V SE				活跃																								800MHz	64KB	Single ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA											FPGA - 25K Logic Elements			--
5CSEBA6U23C8SN	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	672-FBGA	YES	672-UBGA (23x23)	672	1.07 V	85 °C	有	5CSEBA6U23C8SN	FBGA	SQUARE	Intel Corporation	活跃	INTEL CORP	1.13 V	5.57			MCU - 181, FPGA - 145	FBGA, BGA672,28X28,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA672,28X28,32		1.1 V	未说明	0°C ~ 85°C (TJ)	Tray	Cyclone® V SE				活跃	Single Row and Tri-Barrier						现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	10mm	compliant		5CSEBA6	S-PBGA-B672	145	不合格		1.1,1.2/3.3,2.5 V	OTHER			600MHz	64KB	Single ARM® Cortex®-A9 MPCore™ with CoreSight™	06	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA		145	1.85 mm	现场可编程门阵列							FPGA - 110K Logic Elements	110000	250V	--	15A		23 mm	23 mm
5CSEBA4U19C8SN	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-FBGA	YES	484-UBGA (19x19)	484	未说明	1.07 V	85 °C	有	5CSEBA4U19C8SN	FBGA	SQUARE	Intel Corporation	活跃	FPGA - Field Programmable Gate Array CycloneV SoC SE dual -core ARM Cortex-A9	INTEL CORP	1.13 V	2.06			MCU - 151, FPGA - 66	FBGA, BGA484,22X22,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA484,22X22,32		1.1 V	0°C ~ 85°C (TJ)	Tray	Cyclone® V SE				活跃							现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	0.8 mm	compliant			S-PBGA-B484	66	不合格		1.1,1.2/3.3,2.5 V	OTHER			600MHz	64KB	Single ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA		66	1.9 mm	现场可编程门阵列							FPGA - 40K Logic Elements	40000		--			19 mm	19 mm
5CSXFC2C6U23C7N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	672-FBGA	YES	672-UBGA (23x23)	672	1.07 V	85 °C	有	5CSXFC2C6U23C7N	FBGA	SQUARE	Intel Corporation	活跃	INTEL CORP	1.13 V	5.59			MCU - 181, FPGA - 145	FBGA, BGA672,28X28,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA672,28X28,32		1.1 V	未说明	0°C ~ 85°C (TJ)	Tray	Cyclone® V SX				活跃							现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	0.8 mm	compliant			S-PBGA-B672	145	不合格		1.1,1.2/3.3,2.5 V	OTHER			800MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA		145	1.85 mm	现场可编程门阵列							FPGA - 25K Logic Elements	25000		--			23 mm	23 mm
5CSEBA2U19C7SN	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-FBGA	YES	484-UBGA (19x19)	484	1.07 V	85 °C	有	5CSEBA2U19C7SN	FBGA	SQUARE	Intel Corporation	活跃	INTEL CORP	1.13 V	5.57			MCU - 151, FPGA - 66	FBGA, BGA484,22X22,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA484,22X22,32		1.1 V	未说明	0°C ~ 85°C (TJ)	Tray	Cyclone® V SE				活跃							现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	0.8 mm	compliant			S-PBGA-B484	66	不合格		1.1,1.2/3.3,2.5 V	OTHER			800MHz	64KB	Single ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA		66	1.9 mm	现场可编程门阵列							FPGA - 25K Logic Elements	25000		--			19 mm	19 mm
5CSEBA5U19C8N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-FBGA	YES	484	484-UBGA (19x19)	484	1.1 V	未说明	1.07 V	85 °C	有	5CSEBA5U19C8N	FBGA	SQUARE	Intel Corporation	活跃	FPGA - Field Programmable Gate Array Cyclone V SE dual -core ARM Cortex-A9	INTEL CORP	1.13 V	2.03		MCU - 151, FPGA - 66	Compliant	FBGA, BGA484,22X22,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY		BGA484,22X22,32	0°C ~ 85°C (TJ)	Tray	Cyclone® V SE				活跃			85 °C	0 °C			现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	0.8 mm	compliant		5CSEBA5	S-PBGA-B484	66	不合格	1.13 V	1.1,1.2/3.3,2.5 V	OTHER			556.3 kB	600MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA		66	1.9 mm	现场可编程门阵列	85000		800 MHz	32075	8		FPGA - 85K Logic Elements	85000		--			19 mm	19 mm
5CSEBA4U19C8N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-FBGA	YES	484-UBGA (19x19)	484	1.07 V	85 °C	有	5CSEBA4U19C8N	FBGA	SQUARE	Intel Corporation	活跃	INTEL CORP	1.13 V	5.57			MCU - 151, FPGA - 66	FBGA, BGA484,22X22,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA484,22X22,32		1.1 V	未说明	0°C ~ 85°C (TJ)	Tray	Cyclone® V SE				活跃							现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	0.8 mm	compliant			S-PBGA-B484	66	不合格		1.1,1.2/3.3,2.5 V	OTHER			600MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA		66	1.9 mm	现场可编程门阵列							FPGA - 40K Logic Elements	40000		--			19 mm	19 mm
5CSEBA5U23C8SN	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	672-FBGA	NO	672-UBGA (23x23)	10	85		9	DIP	RECTANGULAR	4.5	9	MCU - 181, FPGA - 145	FBGA, BGA672,28X28,32	1.1 V	未说明	1.07 V	有	5CSEBA5U23C8SN	Intel Corporation	活跃	INTEL CORP	1.13 V	5.55			IN-LINE	PLASTIC/EPOXY	DIP10/24,.6	-40	0°C ~ 85°C (TJ)	Tray	Cyclone® V SE				活跃					8542.39.00.01		现场可编程门阵列	CMOS	DUAL	THROUGH-HOLE	未说明	2.54	compliant		5CSEBA5	R-PDIP-T10	145	不合格		1.1,1.2/3.3,2.5 V	INDUSTRIAL			600MHz	64KB	Single ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	.333	145	1.85 mm	现场可编程门阵列							FPGA - 85K Logic Elements	85000		--			23 mm	23 mm
5CSEBA4U23C8SN	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	672-FBGA	484	672-UBGA (23x23)		MCU - 181, FPGA - 145	Compliant				0°C ~ 85°C (TJ)	Tray	Cyclone® V SE				活跃			85 °C	0 °C										600 MHz					1.1 V				CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	2.9 MB	600MHz	64KB	Single ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA					40000	ARM					FPGA - 40K Logic Elements			--
5CSXFC6C6U23I7N	ALTERA	数据表	91 In Stock	-	最小起订量: 1 最小包装量: 1	672-FBGA	672	672-UBGA (23x23)	8542390000	Compliant					MCU - 181, FPGA - 145	-40°C ~ 100°C (TJ)	Tray	Cyclone® V SX				活跃	PCB Terminal Blocks with Wire		100 °C	-40 °C										800 MHz	5CSXFC6				1.13 V				CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	773.9 kB	800MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	09	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	3.125 Gbps	MCU, FPGA					110000	ARM	800 MHz	41509	7	6	FPGA - 110K Logic Elements		300V	--	13.5A				无铅
5CSTFD6D5F31I7N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	896-BGA	YES	896	896-FBGA (31x31)	896	BGA896,30X30,40	1.1 V	未说明	1.07 V	有	5CSTFD6D5F31I7N	BGA	SQUARE	Intel Corporation	活跃	FPGA - Field Programmable Gate Array Cyclone V ST dual -core ARM Cortex-A9	INTEL CORP	1.13 V	2.03		MCU - 181, FPGA - 288	Compliant	BGA, BGA896,30X30,40	网格排列	3		PLASTIC/EPOXY	-40°C ~ 100°C (TJ)	Tray	Cyclone® V ST			e1	活跃		Tin/Silver/Copper (Sn/Ag/Cu)	100 °C	-40 °C	8542.39.00.01		现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	1 mm	compliant		5CSTFD6	S-PBGA-B896	288	不合格	1.13 V	1.1,1.2/3.3,2.5 V				773.9 kB	800MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	5 Gbps	MCU, FPGA		288	2 mm	现场可编程门阵列	110000		800 MHz	41509	7	9	FPGA - 110K Logic Elements	110000		--			31 mm	31 mm	无铅
5CSXFC6D6F31I7N	ALTERA	数据表	672 In Stock	-	最小起订量: 1 最小包装量: 1	896-BGA	896	896-FBGA (31x31)		MCU - 181, FPGA - 288	Compliant				-40°C ~ 100°C (TJ)	Tray	Cyclone® V SX				活跃			100 °C	-40 °C										800 MHz	5CSXFC6				1.13 V				CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	773.9 kB	800MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	3.125 Gbps	MCU, FPGA					110000	ARM	800 MHz	41509	7	9	FPGA - 110K Logic Elements			--					无铅
5CSXFC4C6U23C8N	ALTERA	数据表	207 In Stock	-	最小起订量: 1 最小包装量: 1	672-FBGA	672-UBGA (23x23)		MCU - 181, FPGA - 145					0°C ~ 85°C (TJ)	Tray	Cyclone® V SX				活跃															5CSXFC4									600MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA											FPGA - 40K Logic Elements			--
5CSEBA6U19I7N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-FBGA	YES	484	484-UBGA (19x19)	484	1.07 V	有	5CSEBA6U19I7N	FBGA	SQUARE	Intel Corporation	活跃	INTEL CORP	1.13 V	2.04		MCU - 151, FPGA - 66	Compliant	FBGA, BGA484,22X22,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY		BGA484,22X22,32	1.1 V	未说明	-40°C ~ 100°C (TJ)	Tray	Cyclone® V SE				活跃			100 °C	-40 °C	8542.39.00.01		现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	0.8 mm	compliant	800 MHz	5CSEBA6	S-PBGA-B484	66	不合格	1.13 V	1.1,1.2/3.3,2.5 V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	773.9 kB	800MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA		66	1.9 mm	现场可编程门阵列	110000	ARM	800 MHz	41509	7		FPGA - 110K Logic Elements	110000		--			19 mm	19 mm
5CSEMA5F31I7N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	896-BGA	YES	896	896-FBGA (31x31)	896	1.1 V	未说明	1.07 V	有	5CSEMA5F31I7N	BGA	SQUARE	Intel Corporation	活跃	INTEL CORP	1.13 V	2.02		MCU - 181, FPGA - 288	Compliant	BGA, BGA896,30X30,40	网格排列	3		PLASTIC/EPOXY	BGA896,30X30,40	-40°C ~ 100°C (TJ)	Tray	Cyclone® V SE			e1	活跃		Tin/Silver/Copper (Sn/Ag/Cu)	100 °C	-40 °C	8542.39.00.01		现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	1 mm	compliant	800 MHz	5CSEMA5	S-PBGA-B896	288	不合格	1.13 V	1.1,1.2/3.3,2.5 V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	556.3 kB	800MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA		288	2 mm	现场可编程门阵列	85000	ARM	800 MHz	32075	7		FPGA - 85K Logic Elements	85000		--			31 mm	31 mm
XCZU47DR-L1FFVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Terminal: ¼in Triple Quick-Connect, Ground Lug	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD 赛灵思	活跃				BARKER MICROFARADS INC	Y	561	Tray	-40°C ~ 100°C (TJ)	2.156in x 1.312in Oval Case	Zynq® UltraScale+™ RFSoC		±3%								405uF																370VAC		500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA											Zynq®UltraScale+™ FPGA, 930K+ Logic Cells			-
XCZU47DR-1FSVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	SMD	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD 赛灵思	活跃				ECE/EXCEL CELL ELECTRONIC CORP	Y	561	Tray	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC	101.5mm (3.996 x 14.5mm (0.571in) W																									10 Amp, 300 VAC		500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA											Zynq®UltraScale+™ FPGA, 930K+ Logic Cells			-		16mm (0.630in)
XCZU47DR-L1FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Terminal: ¼in Triple Quick-Connect, w/Resistor	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思	活跃				BARKER MICROFARADS INC	Y	366	Tray	-40°C ~ 100°C (TJ)	2.156in x 1.312in Oval Case	Zynq® UltraScale+™ RFSoC		±3%								405uF																370VAC		500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA											Zynq®UltraScale+™ FPGA, 930K+ Logic Cells			-
XCZU48DR-L2FSVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	SMD	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD 赛灵思	活跃				Y	ECE/EXCEL CELL ELECTRONIC CORP	561	Tray	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC	106.5mm (4.193 x 14.5mm (0.571in) W																									10 Amp, 300 VAC		533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA											Zynq®UltraScale+™ FPGA, 930K+ Logic Cells			-		16mm (0.630in)
XCZU48DR-1FSVE1156E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Terminal: ¼in Triple Quick-Connect, w/Bracket	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思	活跃				Y	BARKER MICROFARADS INC	366	Tray	0°C ~ 100°C (TJ)	2.156in x 1.312in Oval Case	Zynq® UltraScale+™ RFSoC		±3%								405uF																370VAC		500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA											Zynq®UltraScale+™ FPGA, 930K+ Logic Cells			-