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产品型号	品牌	数据表	库存	价格(含增值税)	数量	包装/外壳	表面安装	供应商器件包装	终端数量												厂商																													操作温度	包装	系列	JESD-609代码	零件状态	端子表面处理	HTS代码	子类别	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	JESD-30代码	输出的数量	资历状况	工作电源电压	电源	温度等级	速度	内存大小	核心处理器	周边设备	程序内存大小	连接方式	建筑学	输入数量	座位高度-最大	可编程逻辑类型	产品类别	速度等级	收发器数量	主要属性
XCVC1702-1LSEVSVA1596	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA	1596-BGA (37.5x37.5)	AMD		500	Tray	活跃		0°C ~ 100°C (TJ)		Versal™ AI Core																		400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							Versal™ AI Core FPGA, 1M Logic Cells			-
M2S025-1VF400I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA	YES	400-VFBGA (17x17)	400	微芯片技术	LFBGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.3	-	166 MHz	27696 LE	SMD/SMT	-	64 kB	207	Tray	M2S025	活跃	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	无	M2S025-1VF400I	-40°C ~ 100°C (TJ)		SmartFusion®2	e0		Tin/Lead (Sn/Pb)	8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant	S-PBGA-B400	160	不合格		1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	160	1.51 mm	现场可编程门阵列		1		FPGA - 25K Logic Modules	23988	1 Core	256KB		17 mm	17 mm
10AS027E2F27E1SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	672-BBGA, FCBGA	YES	672-FBGA (27x27)	672	240	Non-Compliant	27 X 27 MM, ROHS COMPLIANT, FBGA-672	网格排列	PLASTIC/EPOXY	BGA672,26X26,40	0.9 V	未说明	0.87 V	100 °C	有		10AS027E2F27E1SG	BGA	SQUARE	Intel Corporation	Obsolete	INTEL CORP	0.93 V	5.64	0°C ~ 100°C (TJ)	Tray	Arria 10 SX		Discontinued at Digi-Key		8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	1 mm	compliant	S-PBGA-B672	240	不合格		0.9 V	OTHER	1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	240	3.25 mm	现场可编程门阵列				FPGA - 270K Logic Elements	270000		--		27 mm	27 mm
T1014MN3MQA	Teledyne LeCroy	数据表	N/A	-	最小起订量: 1 最小包装量: 1
XCVP1802-2MSELSVC4072	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	AMD				780	Tray	活跃		0°C ~ 100°C (TJ)		Versal® Premium																		-	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA										-
AGFB014R24C2E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel		744	Tray	活跃		0°C ~ 100°C (TJ)		Agilex F																		1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 1.4M Logic Elements			-
XCZU2EG-3SFVA625E	AMD	数据表	536 In Stock	-	最小起订量: 1 最小包装量: 1	625-BFBGA, FCBGA	625-FCBGA (21x21)	AMD		180	Tray	Obsolete		0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																		600MHz, 667MHz, 1.5GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							Zynq®UltraScale+™ FPGA, 103K+ Logic Cells			-
XCVC1902-1LSIVIVA1596	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA, FCBGA	1596-FCBGA (40x40)	AMD 赛灵思		500	Tray	活跃		-40°C ~ 100°C (TJ)		Versal™ AI Core																		400MHz, 1GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							Versal™ AI Core FPGA, 1.9M Logic Cells			-
XCVC1502-2MSEVSVA1596	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	AMD				Tray	活跃				*
XCZU2EG-L2UBVA530E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	530-WFBGA, FCBGA	530-FCBGA (16x9.5)	AMD 赛灵思	2 x 32 kB, 4 x 32 kB	103320 LE	+ 110 C	0 C	SMD/SMT	2 x 32 kB, 4 x 32 kB	256 kB			82	Tray	活跃	0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG															850 mV			533MHz, 600MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							Zynq®UltraScale+™ FPGA, 103K+ Logic Cells		7 Core	-
XCZU3EG-L1UBVA530I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	530-WFBGA, FCBGA	530-FCBGA (16x9.5)	AMD 赛灵思	2 x 32 kB, 4 x 32 kB	154350 LE	+ 100 C	- 40 C	SMD/SMT	2 x 32 kB, 4 x 32 kB	256 kB			82	Tray	活跃	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG															850 mV			500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							Zynq®UltraScale+™ FPGA, 154K+ Logic Cells		7 Core	-
10AS057	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Intel				Bulk	活跃				-
XCVC1502-2MSIVSVA1596	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA, FCBGA	AMD				活跃	Tray	478			Versal™ AI Core																		600MHz, 1.4GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							Versal™ AI Core FPGA, 800k Logic Cells			-
10AS032H4F35I3SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-1152	YES	1152	320000 LE	1	SMD/SMT	40000 LAB	964980	Intel		Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS032H4F35I3SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45		384	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	-40°C ~ 100°C (TJ)	Tray	Arria 10 SX		活跃		8542.39.00.01	SOC - Systems on a Chip	CMOS	BOTTOM	BALL	未说明	1 mm	compliant	S-PBGA-B1152	384	不合格		0.9 V	INDUSTRIAL	1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	384	3.5 mm	现场可编程门阵列	SoC FPGA			FPGA - 320K Logic Elements	320000	2 Core	--	SoC FPGA	35 mm	35 mm
10AS057N2F40I1HG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FBGA (40x40)	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	5.66	INTEL CORP	活跃	10AS057N2F40I1HG	有			588	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	570000 LE	+ 100 C	- 40 C	21	SMD/SMT	71250 LAB		965095	Intel	-40°C ~ 100°C (TJ)	Tray	Arria 10 SX		活跃			SOC - Systems on a Chip						unknown				950 mV			1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				SoC FPGA		48 Transceiver	FPGA - 570K Logic Elements		2 Core	--	SoC FPGA
10AS057K4F40E3LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	YES	1517-FCBGA (40x40)	1517	978979	Intel		Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA,	网格排列	PLASTIC/EPOXY	0.9 V	0.87 V	100 °C	有	10AS057K4F40E3LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45	696	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	570000 LE	21	SMD/SMT	71250 LAB	0°C ~ 100°C (TJ)	Tray	Arria 10 SX		活跃		8542.39.00.01	SOC - Systems on a Chip		BOTTOM	BALL		1 mm	compliant	S-PBGA-B1517					OTHER	1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		3.5 mm	现场可编程门阵列	SoC FPGA			FPGA - 570K Logic Elements		2 Core	--	SoC FPGA	40 mm	40 mm
10AS048K2F35E2SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1152			396	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	0.9 V	未说明	0.87 V	100 °C	有	10AS048K2F35E2SG		BGA	SQUARE	Intel Corporation	活跃	INTEL CORP	0.93 V	5.47	0°C ~ 100°C (TJ)	Tray	Arria 10 SX		活跃		8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	1 mm	compliant	S-PBGA-B1152	396	不合格		0.9 V	OTHER	1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	396	3.5 mm	现场可编程门阵列				FPGA - 480K Logic Elements	480000		--		35 mm	35 mm
M2S005S-1TQ144	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	144-LQFP	YES	144-TQFP (20x20)	144	微芯片技术	MICROSEMI CORP	1.26 V	5.88	84	Tray	Obsolete	TQFP-144	FLATPACK, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	QFP144,.87SQ,20	1.2 V	30	1.14 V	85 °C	无	M2S005S-1TQ144	LFQFP	SQUARE	Microsemi Corporation	Obsolete	0°C ~ 85°C (TJ)		SmartFusion®2	e0		Tin/Lead (Sn/Pb)	8542.39.00.01	现场可编程门阵列	CMOS	QUAD	鸥翼	240	0.5 mm	not_compliant	S-PQFP-G144	84	不合格		1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	-		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	84	1.6 mm	现场可编程门阵列				FPGA - 5K Logic Modules	6060		128KB		20 mm	20 mm
AGID023R18A1E1V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel		480	Tray	活跃		0°C ~ 100°C (TJ)		Agilex I																		1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 2.3M Logic Elements			-
AGFA023R25A2E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel		480	Tray	活跃		0°C ~ 100°C (TJ)		Agilex F																		1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 2.3M Logic Elements			-
AGIB022R31B3I3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel		720	Tray	活跃		-40°C ~ 100°C (TJ)		Agilex I																		1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 2.2M Logic Elements			-
AGFB027R31C3E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel		720	Tray	活跃		0°C ~ 100°C (TJ)		Agilex F																		1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 2.7M Logic Elements			-
1SX065HH2F35E2VG	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	1152-FBGA (35x35)	Intel		392	Tray	活跃		0°C ~ 100°C (TJ)		Stratix® 10 SX																		1.5GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							FPGA - 650K Logic Elements			-
AGFA008R16A2I3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel		384	Tray	活跃		-40°C ~ 100°C (TJ)		Agilex F																		1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							FPGA - 764K Logic Elements			-
XCVM1802-1MSEVSVA2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD 赛灵思		770	活跃		0°C ~ 100°C (TJ)																				600MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							Versal™ Prime FPGA, 1.9M Logic Cells			-