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产品型号	品牌	数据表	库存	价格(含增值税)	数量	包装/外壳	表面安装	引脚数	供应商器件包装	终端数量												厂商																															操作温度	包装	系列	JESD-609代码	零件状态	端子表面处理	最高工作温度	最小工作温度	HTS代码	子类别	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	频率	基本部件号	JESD-30代码	输出的数量	资历状况	工作电源电压	电源	温度等级	界面	内存大小	速度	内存大小	核心处理器	周边设备	输入数量	座位高度-最大	可编程逻辑类型	逻辑元件/单元数	产品类别	核心架构	最高频率	逻辑块数(LABs)
5CSXFC2C6U23I7N	ALTERA	数据表	57 In Stock	-	最小起订量: 1 最小包装量: 1	672-FBGA	YES	484	672-UBGA (23x23)	672	PLASTIC/EPOXY	BGA672,28X28,32	1.1 V	未说明	1.07 V	有	5CSXFC2C6U23I7N		FBGA	SQUARE	Intel Corporation	活跃	INTEL CORP	1.13 V	2.09	MCU - 181, FPGA - 145	Compliant	FBGA, BGA672,28X28,32	GRID ARRAY, FINE PITCH	-40°C ~ 100°C (TJ)	Tray	Cyclone® V SX		活跃		100 °C	-40 °C		现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	0.8 mm	compliant	800 MHz	5CSXFC2	S-PBGA-B672	145	不合格	1.1 V	1.1,1.2/3.3,2.5 V		CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.5 MB	800MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	3.125 Gbps	MCU, FPGA	145	1.85 mm	现场可编程门阵列	25000		ARM				6	FPGA - 25K Logic Elements	25000		--		23 mm	23 mm
AGFC023R25A2E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel		480	Tray	活跃			0°C ~ 100°C (TJ)		Agilex F																							1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA											FPGA - 2.3M Logic Elements			-
AGFB022R24C2I3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel		744	Tray	活跃			-40°C ~ 100°C (TJ)		Agilex F																							1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA											FPGA - 2.2M Logic Elements			-
10AS027E1F29E1SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	780-BBGA, FCBGA	780-FBGA (29x29)	Non-Compliant				360		0°C ~ 100°C (TJ)	Tray	Arria 10 SX		Discontinued at Digi-Key																					1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA											FPGA - 270K Logic Elements			--
1SX280HU3F50I2LGAS	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-2397	4 x 32 kB	1 GHz	2800000 LE	704 I/O	+ 100 C	- 40 C	1	SMD/SMT	350000 LAB	999A3L	Intel		Intel / Altera	Stratix	Details	4 x 32 kB	-						Tray	Stratix 10 SX							SOC - Systems on a Chip												0.85 V									-								SoC FPGA					96 Transceiver			4 Core		SoC FPGA
AGFA008R16A3I3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel		384	Tray	活跃			-40°C ~ 100°C (TJ)		Agilex F																							1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA											FPGA - 764K Logic Elements			-
10AS066H4F34I3LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	YES	1152-FCBGA (35x35)	1152	SMD/SMT	82500 LAB	965100	Intel		Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS066H4F34I3LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.46		492	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	660000 LE	24	-40°C ~ 100°C (TJ)	Tray	Arria 10 SX		活跃				8542.39.00.01	SOC - Systems on a Chip	CMOS	BOTTOM	BALL	未说明	1 mm	compliant			S-PBGA-B1152	492	不合格		0.9 V	INDUSTRIAL		1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	492	3.65 mm	现场可编程门阵列		SoC FPGA		FPGA - 660K Logic Elements	660000	2 Core	--	SoC FPGA	35 mm	35 mm
10AS022C4U19E3SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	UBGA-484	YES	484	1	SMD/SMT	27500 LAB	965089		Intel	Intel / Altera	Arria 10 SoC	2 x 32 kB	-	FBGA, BGA484,22X22,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA484,22X22,32	0.9 V	未说明	0.87 V	100 °C	有	10AS022C4U19E3SG	FBGA	SQUARE	活跃	INTEL CORP	0.93 V	5.46			192	Non-Compliant	有	2 x 32 kB	1.2 GHz	220000 LE	0.423288 oz	0°C ~ 100°C (TJ)	Tray	Arria 10 SX		活跃				8542.39.00.01	SOC - Systems on a Chip	CMOS	BOTTOM	BALL	未说明	0.8 mm	compliant			S-PBGA-B484	192	不合格		0.9 V	OTHER		1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	192	3.25 mm	现场可编程门阵列		SoC FPGA		FPGA - 220K Logic Elements	220000	2 Core	--	SoC FPGA	19 mm	19 mm
XCZU7EG-2FBVB900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	AMD		204	Tray	XCZU7	活跃			-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																							533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA											Zynq®UltraScale+™ FPGA, 504K+ Logic Cells			-
AGFA006R16A3E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel		384	Tray	活跃			0°C ~ 100°C (TJ)		Agilex F																							1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA											FPGA - 573K Logic Elements			-
PCIMX6QP6AVT1AA	NXP	数据表	N/A	-	最小起订量: 1 最小包装量: 1							Non-Compliant
XCZU19EG-3FFVE1924E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1924-BBGA, FCBGA	1924-FCBGA (45x45)	AMD		668	Tray	XCZU19	活跃			0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																							600MHz, 667MHz, 1.5GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA											Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells			-
XC7Z020-1CLG484I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-LFBGA, CSPBGA	484-CSPBGA (19x19)	AMD		130	Tray	XC7Z020	活跃			-40°C ~ 100°C (TJ)		Zynq®-7000																							667MHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA											Artix™-7 FPGA, 85K Logic Cells			-
AGFB019R25A2E4X	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel		活跃	Tray	480			0°C ~ 100°C (TJ)		Agilex F																							1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA											FPGA - 1.9M Logic Elements			-
XCZU47DR-1FFVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD 赛灵思		561	Tray	活跃			-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																							500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA											Zynq®UltraScale+™ FPGA, 930K+ Logic Cells			-
XCZU46DR-L1FFVH1760I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	AMD 赛灵思		574	Tray	活跃			-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																							500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA											Zynq®UltraScale+™ FPGA, 930K+ Logic Cells			-
5CSTFD5D5F31I7N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	896-BGA	YES	896	896-FBGA (31x31)	896	BGA, BGA896,30X30,40	网格排列	3	PLASTIC/EPOXY	BGA896,30X30,40	1.1 V	未说明	1.07 V	有		5CSTFD5D5F31I7N	BGA	SQUARE	Intel Corporation	活跃	INTEL CORP	1.13 V	2.02	MCU - 181, FPGA - 288	Compliant	-40°C ~ 100°C (TJ)	Tray	Cyclone® V ST	e1	活跃	Tin/Silver/Copper (Sn/Ag/Cu)	100 °C	-40 °C	8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	1 mm	compliant	800 MHz	5CSTFD5	S-PBGA-B896	288	不合格	1.13 V	1.1,1.2/3.3,2.5 V		CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	556.3 kB	800MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	5 Gbps	MCU, FPGA	288	2 mm	现场可编程门阵列	85000		ARM	800 MHz	32075	7	9	FPGA - 85K Logic Elements	85000		--		31 mm	31 mm	无铅
10AS022C4U19E3LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	484	5.46				192	Non-Compliant	FBGA, BGA484,22X22,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA484,22X22,32	0.9 V	未说明	0.87 V	100 °C	有		10AS022C4U19E3LG	FBGA	SQUARE	Intel Corporation	活跃	INTEL CORP	0.93 V	0°C ~ 100°C (TJ)	Tray	Arria 10 SX		活跃				8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	0.8 mm	compliant			S-PBGA-B484	192	不合格		0.9 V	OTHER		1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	192	3.25 mm	现场可编程门阵列								FPGA - 220K Logic Elements	220000		--		19 mm	19 mm
AGFB022R31C3I3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel		720	Tray	活跃			-40°C ~ 100°C (TJ)		Agilex F																							1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA											FPGA - 2.2M Logic Elements			-
AGFA014R24B2E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel		768	Tray	活跃			0°C ~ 100°C (TJ)		Agilex F																							1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA											FPGA - 1.4M Logic Elements			-
5CSXFC2C6U23C8N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	672-FBGA	484	672-UBGA (23x23)	8542390000	Compliant			MCU - 181, FPGA - 145		0°C ~ 85°C (TJ)	Tray	Cyclone® V SX		活跃		85 °C	0 °C									600 MHz	5CSXFC2				1.1 V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.5 MB	600MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	3.125 Gbps	MCU, FPGA				25000		ARM				6	FPGA - 25K Logic Elements			--
AGFA027R31C2E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel		720	Tray	活跃			0°C ~ 100°C (TJ)		Agilex F																							1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA											FPGA - 2.7M Logic Elements			-
XCZU2EG-2SBVA484I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA, FCBGA	484-FCBGA (19x19)	AMD		82	Tray	XCZU2	活跃			-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																							533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA											Zynq®UltraScale+™ FPGA, 103K+ Logic Cells			-
AGFB027R24C2E2VR2	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel		744	Tray	活跃			0°C ~ 100°C (TJ)		Agilex F																							1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA											FPGA - 2.7M Logic Elements			-
AGFB008R16A2E4X	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel		384	Tray	活跃			0°C ~ 100°C (TJ)		Agilex F																							1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA											FPGA - 764K Logic Elements			-