类别是'category.片上系统(SoC)' (7695)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | 零件状态 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 建筑学 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 产品类别 | 速度等级 | 收发器数量 | 主要属性 | 逻辑单元数 | 核数量 | 闪光大小 | 产品类别 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | 10AS048H3F34I2SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-1152 | 492 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 480000 LE | 1 | SMD/SMT | 60000 LAB | 965065 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | SOC - Systems on a Chip | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | FPGA - 480K Logic Elements | 2 Core | -- | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS048H4F34E3LG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-1152 | YES | 1152 | Arria 10 SoC | Intel / Altera | Intel | 965353 | 60000 LAB | SMD/SMT | 1 | 480000 LE | 1.2 GHz | 2 x 32 kB | This product may require additional documentation to export from the United States. | 有 | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS048H4F34E3LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.47 | 492 | - | 2 x 32 kB | Details | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 492 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 480K Logic Elements | 480000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | ||||||||||||
![]() | AGIB022R31B2E2V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 720 | Tray | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU9EG-L2FFVB1156E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | Bulk | XCZU9 | 活跃 | 328 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F500M3G-PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 208-BFQFP | 208-PQFP (28x28) | 微芯片技术 | Tray | A2F500 | 活跃 | MCU - 22, FPGA - 66 | -40°C ~ 100°C (TJ) | SmartFusion® | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU19EG-1FFVC1760I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | Tray | XCZU19 | 活跃 | 512 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB023R25A1E1V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 480 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS022 | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Intel | 活跃 | Bulk | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS160T-FCVG784T2 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | 微芯片技术 | 活跃 | MCU - 136, FPGA - 312 | Tray | -40°C ~ 125°C (TJ) | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z045-1FFG676C | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | AMD | 130 | Tray | 活跃 | XC7Z045 | 0°C ~ 85°C (TJ) | Zynq®-7000 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 350K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | R8A77610DA01BGV#U9 | Renesas | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 449-FBGA | 449-FBGA (21x21) | Renesas Electronics America Inc | Obsolete | - | Bulk | - | - | 400MHz | 16KB | SH-4A | DDR | CANbus, I²C, USB | MPU | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1502-2MLEVSVA1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | AMD | 活跃 | Tray | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z045-1FFG900CES | AMD | 数据表 | 458 In Stock | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | Tray | XC7Z045 | Obsolete | 130 | 0°C ~ 85°C (TJ) | Zynq®-7000 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 350K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVP1502-2MSEVSVA2785 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2785-BFBGA | 2785-BGA (50x50) | AMD | 活跃 | 780 | Tray | 0°C ~ 100°C (TJ) | Versal® Premium | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Premium FPGA, 3.7M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066H2F34E2LG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | 660000 LE | 24 | SMD/SMT | 82500 LAB | 965075 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS066H2F34E2LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.46 | 492 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 492 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 660K Logic Elements | 660000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||
![]() | AGFB027R24C2I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 744 | Tray | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1902-1LLIVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 活跃 | 770 | Tray | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU3EG-2SBVA484I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | Tray | XCZU3 | 活跃 | 82 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU3EG-2SBVA484E | AMD | 数据表 | 446 In Stock | - | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | 82 | Tray | 活跃 | XCZU3 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVE1752-1MSEVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | AMD | 活跃 | Tray | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU5CG-1FBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | Tray | 活跃 | XCZU5 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA006R24C2I2V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 576 | Tray | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB012R24C3I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 744 | Tray | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F200M3F-1FGG256 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 256-LBGA | 256-FPBGA (17x17) | 微芯片技术 | Tray | A2F200 | 活跃 | MCU - 25, FPGA - 66 | 0°C ~ 85°C (TJ) | SmartFusion® | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 1 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS027H2F34E1HG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | 有 | 10AS027H2F34E1HG | 活跃 | INTEL CORP | 5.64 | 384 | 有 | 2 x 32 kB | 1.2 GHz | 270000 LE | + 100 C | 0 C | 24 | SMD/SMT | 33750 LAB | 964929 | Intel | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 24 Transceiver | FPGA - 270K Logic Elements | 2 Core | -- | SoC FPGA |
10AS048H3F34I2SG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS048H4F34E3LG
ALTERA
分类:Embedded - System On Chip (SoC)
AGIB022R31B2E2V
Intel
分类:Embedded - System On Chip (SoC)
XCZU9EG-L2FFVB1156E
AMD
分类:Embedded - System On Chip (SoC)
A2F500M3G-PQG208I
Microchip
分类:Embedded - System On Chip (SoC)
XCZU19EG-1FFVC1760I
AMD
分类:Embedded - System On Chip (SoC)
AGFB023R25A1E1V
Intel
分类:Embedded - System On Chip (SoC)
10AS022
Intel
分类:Embedded - System On Chip (SoC)
MPFS160T-FCVG784T2
Microchip
分类:Embedded - System On Chip (SoC)
XC7Z045-1FFG676C
AMD
分类:Embedded - System On Chip (SoC)
R8A77610DA01BGV#U9
Renesas
分类:Embedded - System On Chip (SoC)
XCVC1502-2MLEVSVA1596
AMD
分类:Embedded - System On Chip (SoC)
XC7Z045-1FFG900CES
AMD
分类:Embedded - System On Chip (SoC)
XCVP1502-2MSEVSVA2785
AMD
分类:Embedded - System On Chip (SoC)
10AS066H2F34E2LG
ALTERA
分类:Embedded - System On Chip (SoC)
AGFB027R24C2I3E
Intel
分类:Embedded - System On Chip (SoC)
XCVC1902-1LLIVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
XCZU3EG-2SBVA484I
AMD
分类:Embedded - System On Chip (SoC)
XCZU3EG-2SBVA484E
AMD
分类:Embedded - System On Chip (SoC)
XCVE1752-1MSEVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
XCZU5CG-1FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
AGFA006R24C2I2V
Intel
分类:Embedded - System On Chip (SoC)
AGFB012R24C3I3E
Intel
分类:Embedded - System On Chip (SoC)
A2F200M3F-1FGG256
Microchip
分类:Embedded - System On Chip (SoC)
10AS027H2F34E1HG
ALTERA
分类:Embedded - System On Chip (SoC)
