类别是'category.片上系统(SoC)' (7695)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 包装/外壳 | 表面安装 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 界面 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 连接方式 | 建筑学 | 数据总线宽度 | 输入数量 | 可编程逻辑类型 | 核心架构 | 最高频率 | 主要属性 | 逻辑单元数 | 闪光大小 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | 1SX280LH3F55I2LG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2912-BBGA, FCBGA | 1160 | -40°C~100°C TJ | Tray | Stratix® 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
![]() | 1SX280LH2F55E2VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2912-BBGA, FCBGA | 1160 | 0°C~100°C TJ | Tray | Stratix® 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
![]() | 1SX280LH3F55E1VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2912-BBGA, FCBGA | 1160 | 0°C~100°C TJ | Tray | Stratix® 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
![]() | 1SX280LH2F55I2VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2912-BBGA, FCBGA | 1160 | -40°C~100°C TJ | Tray | Stratix® 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
![]() | 1SX280LH2F55E1VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2912-BBGA, FCBGA | 1160 | 0°C~100°C TJ | Tray | Stratix® 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
![]() | 1SX280LH2F55I1VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2912-BBGA, FCBGA | 1160 | -40°C~100°C TJ | Tray | Stratix® 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
![]() | 1SX280LH2F55I2LG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2912-BBGA, FCBGA | 1160 | -40°C~100°C TJ | Tray | Stratix® 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
![]() | 5ASXFB5H6F40C6NES | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FBGA, FC (40x40) | MCU - 208, FPGA - 540 | 0°C~85°C TJ | Tray | Arria V SX | Obsolete | 3 (168 Hours) | 5ASXFB5 | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 462K Logic Elements | ||||||||||||||||||||||||||||||||||||||||
![]() | M2S090-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 484-BGA | YES | 267 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | not_compliant | 未说明 | S-PBGA-B484 | 267 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | 现场可编程门阵列 | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | |||||||||||||
![]() | M2S090T-1FG484I | Microsemi Corporation | 数据表 | 60 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | YES | 267 | -40°C~100°C TJ | Tray | 2009 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | not_compliant | 166MHz | 未说明 | M2S090T | S-PBGA-B484 | 267 | 不合格 | 1.26V | 1.2V | 1.14V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | 现场可编程门阵列 | ARM | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||
![]() | M2S090-1FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | YES | 267 | -40°C~100°C TJ | Tray | 2009 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | not_compliant | 166MHz | 未说明 | M2S090 | S-PBGA-B484 | 267 | 不合格 | 1.26V | 1.2V | 1.14V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | 现场可编程门阵列 | ARM | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||
![]() | M2S150-FCG1152 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 1152-BBGA, FCBGA | YES | 574 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 哑光锡 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | 166MHz | 未说明 | M2S150 | S-PBGA-B1152 | 574 | 不合格 | 1.26V | 1.2V | 1.14V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 574 | 现场可编程门阵列 | ARM | FPGA - 150K Logic Modules | 146124 | 512KB | 2.9mm | 35mm | 35mm | 符合RoHS标准 | 无铅 | |||||||||||
![]() | M2S090TS-1FG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 676-BGA | YES | 425 | -40°C~100°C TJ | Tray | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 676 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | not_compliant | 166MHz | 未说明 | M2S090TS | S-PBGA-B676 | 425 | 不合格 | 1.26V | 1.2V | 1.14V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 425 | 现场可编程门阵列 | ARM | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 27mm | 27mm | Non-RoHS Compliant | |||||||||||
![]() | 1SX250LH3F55I2VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2912-BBGA, FCBGA | 1160 | -40°C~100°C TJ | Tray | Stratix® 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2500K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
![]() | 1SX250LH2F55I1VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2912-BBGA, FCBGA | 1160 | -40°C~100°C TJ | Tray | Stratix® 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2500K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
![]() | 1SX250LH2F55I2LG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2912-BBGA, FCBGA | 1160 | -40°C~100°C TJ | Tray | Stratix® 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2500K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
![]() | 1SX250LH3F55I2LG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2912-BBGA, FCBGA | 1160 | -40°C~100°C TJ | Tray | Stratix® 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2500K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
![]() | 1SX250LH2F55E2LG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2912-BBGA, FCBGA | 1160 | 0°C~100°C TJ | Tray | Stratix® 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2500K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
![]() | 1SX250LH3F55I3VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2912-BBGA, FCBGA | 1160 | -40°C~100°C TJ | Tray | Stratix® 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2500K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
![]() | BCM1125HB0K800G | Broadcom Limited | 数据表 | 770 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA | Obsolete | 1 (Unlimited) | 800MHz | 64b | 800MHz | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | BCM1125HA4K600 | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete | 1 (Unlimited) | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066H3F34I3SGES | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA, FC (35x35) | 492 | -40°C~100°C TJ | Tray | Arria 10 SX | Obsolete | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 660K Logic Elements | |||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066K3F35I3SGES | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA, FC (35x35) | 396 | -40°C~100°C TJ | Tray | Arria 10 SX | Obsolete | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 660K Logic Elements | |||||||||||||||||||||||||||||||||||||||||
![]() | M2S025T-1FG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 484-BGA | YES | 267 | -55°C~125°C TJ | Tray | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | not_compliant | 未说明 | S-PBGA-B484 | 267 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | 现场可编程门阵列 | FPGA - 25K Logic Modules | 27696 | 256KB | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | 含铅 | ||||||||||||||
![]() | BCM85620IFSBG | Broadcom Limited | 数据表 | 480 In Stock | - | 最小起订量: 1 最小包装量: 1 | 活跃 | 1 (Unlimited) | ROHS3 Compliant |
1SX280LH3F55I2LG
Intel
分类:Embedded - System On Chip (SoC)
1SX280LH2F55E2VG
Intel
分类:Embedded - System On Chip (SoC)
1SX280LH3F55E1VG
Intel
分类:Embedded - System On Chip (SoC)
1SX280LH2F55I2VG
Intel
分类:Embedded - System On Chip (SoC)
1SX280LH2F55E1VG
Intel
分类:Embedded - System On Chip (SoC)
1SX280LH2F55I1VG
Intel
分类:Embedded - System On Chip (SoC)
1SX280LH2F55I2LG
Intel
分类:Embedded - System On Chip (SoC)
5ASXFB5H6F40C6NES
Intel
分类:Embedded - System On Chip (SoC)
M2S090-FG484I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S090T-1FG484I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S090-1FG484I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S150-FCG1152
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S090TS-1FG676I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
1SX250LH3F55I2VG
Intel
分类:Embedded - System On Chip (SoC)
1SX250LH2F55I1VG
Intel
分类:Embedded - System On Chip (SoC)
1SX250LH2F55I2LG
Intel
分类:Embedded - System On Chip (SoC)
1SX250LH3F55I2LG
Intel
分类:Embedded - System On Chip (SoC)
1SX250LH2F55E2LG
Intel
分类:Embedded - System On Chip (SoC)
1SX250LH3F55I3VG
Intel
分类:Embedded - System On Chip (SoC)
BCM1125HB0K800G
Broadcom Limited
分类:Embedded - System On Chip (SoC)
BCM1125HA4K600
Broadcom Limited
分类:Embedded - System On Chip (SoC)
10AS066H3F34I3SGES
Intel
分类:Embedded - System On Chip (SoC)
10AS066K3F35I3SGES
Intel
分类:Embedded - System On Chip (SoC)
M2S025T-1FG484M
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
BCM85620IFSBG
Broadcom Limited
分类:Embedded - System On Chip (SoC)
