类别是'category.片上系统(SoC)' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 传播延迟 | 连接方式 | 数据率 | 建筑学 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 核心架构 | 阀门数量 | 最高频率 | 速度等级 | 主要属性 | 寄存器数量 | 最大结点温度(Tj) | 逻辑单元数 | 闪光大小 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | M2S090-1FG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 676-BGA | YES | 425 | -40°C~100°C TJ | Tray | 2009 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 676 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | not_compliant | 166MHz | 未说明 | M2S090 | S-PBGA-B676 | 425 | 不合格 | 1.26V | 1.2V | 1.14V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 425 | 现场可编程门阵列 | ARM | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 27mm | 27mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
![]() | M2S090-1FG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 676-BGA | YES | 425 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 676 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | not_compliant | 166MHz | 未说明 | M2S090 | S-PBGA-B676 | 425 | 不合格 | 1.26V | 1.2V | 1.14V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 425 | 现场可编程门阵列 | ARM | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 27mm | 27mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
![]() | M2S050T-1FGG896I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 896-BGA | 896 | 896-FBGA (31x31) | 377 | -40°C~100°C TJ | Tray | 2009 | SmartFusion®2 | 活跃 | 3 (168 Hours) | 100°C | -40°C | 166MHz | M2S050T | 1.2V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | 1 | FPGA - 50K Logic Modules | 256KB | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090T-FCS325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 325-TFBGA, CSPBGA | YES | 180 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 325 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.5mm | not_compliant | 未说明 | R-PBGA-B325 | 180 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 180 | 现场可编程门阵列 | FPGA - 90K Logic Modules | 86316 | 512KB | 1.16mm | 13.5mm | 11mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
![]() | M2S090-FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BGA | YES | 267 | -40°C~100°C TJ | Tray | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 484 | 哑光锡 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | 未说明 | S-PBGA-B484 | 267 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | 现场可编程门阵列 | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 23mm | 23mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
![]() | A2F200M3F-FGG256I | Microsemi Corporation | 数据表 | 10 In Stock | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 256-LBGA | 256 | 256-FPBGA (17x17) | MCU - 25, FPGA - 66 | -40°C~100°C TJ | Tray | 1997 | SmartFusion® | 活跃 | 3 (168 Hours) | 100°C | -40°C | 80MHz | A2F200 | 1.5V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 4.5kB | 7mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 400 kbps | MCU, FPGA | 2500 | ARM | 200000 | 100MHz | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010-VFG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 2 days ago) | 256-LBGA | YES | FLASH | 138 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 256 | 哑光锡 | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | 340MHz | 未说明 | S-PBGA-B256 | 138 | 不合格 | 1.2V | 3.45V | 1.14V | 256kB | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 3.316 ns | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | 现场可编程门阵列 | 12084 | FPGA - 10K Logic Modules | 85°C | 256KB | 1.56mm | 14mm | 14mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||
![]() | 1SX250LH3F55E1VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2912-BBGA, FCBGA | 1160 | 0°C~100°C TJ | Tray | Stratix® 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2500K Logic Elements | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SX250LH3F55E2LG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2912-BBGA, FCBGA | 1160 | 0°C~100°C TJ | Tray | Stratix® 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2500K Logic Elements | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057N3F40E2SG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 1517-BBGA, FCBGA | YES | 588 | 0°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B1517 | 588 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 588 | 现场可编程门阵列 | FPGA - 570K Logic Elements | 570000 | 3.5mm | 40mm | 40mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||
![]() | XAZU5EV-1SFVC784Q | Xilinx Inc. | 数据表 | 727 In Stock | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | YES | 125°C | -40°C | 活跃 | 3 (168 Hours) | 784 | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 0.85V | 0.8mm | 未说明 | S-PBGA-B784 | AUTOMOTIVE | 微处理器电路 | 3.32mm | 23mm | 23mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F500M3G-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | MCU - 41, FPGA - 128 | 0°C~85°C TJ | Tray | 2011 | SmartFusion® | 活跃 | 3 (168 Hours) | 85°C | 0°C | 100MHz | A2F500M3G | 1.5V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 13.5kB | 16.5mA | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 400 kbps | MCU, FPGA | 5500 | ARM | 500000 | 120MHz | 1 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 512KB | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||
![]() | M2S005S-1TQ144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 144-LQFP | YES | 84 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Obsolete | 3 (168 Hours) | 144 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 鸥翼 | 未说明 | 1.2V | 0.5mm | not_compliant | 未说明 | S-PQFP-G144 | 84 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 84 | 现场可编程门阵列 | FPGA - 5K Logic Modules | 6060 | 128KB | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
![]() | M2S005-1TQ144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 144-LQFP | YES | 84 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | no | Obsolete | 3 (168 Hours) | 144 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 鸥翼 | 未说明 | 1.2V | 0.5mm | not_compliant | 未说明 | S-PQFP-G144 | 1.26V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 现场可编程门阵列 | FPGA - 5K Logic Modules | 128KB | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
![]() | M2S005-VFG256I | Microsemi Corporation | 数据表 | 1200 In Stock | - | 最小起订量: 1 最小包装量: 1 | 3 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 256-LFBGA | YES | 161 | -40°C~100°C TJ | Tray | 2013 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 256 | Matte Tin (Sn) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | 未说明 | S-PBGA-B256 | 161 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 161 | 现场可编程门阵列 | FPGA - 5K Logic Modules | 6060 | 128KB | 1.56mm | 14mm | 14mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||
![]() | M2S005-VF400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | YES | 169 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 400 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | not_compliant | 未说明 | S-PBGA-B400 | 171 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 171 | 现场可编程门阵列 | FPGA - 5K Logic Modules | 6060 | 128KB | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
![]() | M2S005S-VF256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 256-LFBGA | YES | 161 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | not_compliant | 未说明 | S-PBGA-B256 | 161 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 161 | 现场可编程门阵列 | FPGA - 5K Logic Modules | 6060 | 128KB | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
![]() | M2S005-VF256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 256-LFBGA | YES | 161 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | not_compliant | 未说明 | S-PBGA-B256 | 161 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 161 | 现场可编程门阵列 | FPGA - 5K Logic Modules | 6060 | 128KB | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
![]() | M2S005S-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | YES | 209 | 0°C~85°C TJ | Tray | 2002 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 484 | 哑光锡 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | 未说明 | S-PBGA-B484 | 209 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 209 | 现场可编程门阵列 | FPGA - 5K Logic Modules | 6060 | 128KB | 2.44mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
![]() | M2S005S-1VF400 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | 400-VFBGA (17x17) | 169 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | 活跃 | 3 (168 Hours) | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 128KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010-1VF256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 256-LFBGA | YES | 138 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | not_compliant | 未说明 | S-PBGA-B256 | 138 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 256KB | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
![]() | M2S005S-1VF256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 256-LFBGA | YES | 161 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | not_compliant | 未说明 | S-PBGA-B256 | 161 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 161 | 现场可编程门阵列 | FPGA - 5K Logic Modules | 6060 | 128KB | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
![]() | M2S010-1VF256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 256-LFBGA | YES | 138 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | not_compliant | 未说明 | S-PBGA-B256 | 138 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 256KB | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
![]() | M2S005S-VF400 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | YES | 169 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 400 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | not_compliant | 未说明 | S-PBGA-B400 | 171 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 171 | 现场可编程门阵列 | FPGA - 5K Logic Modules | 6060 | 128KB | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
![]() | M2S010-1VFG400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | 400 | 400-VFBGA (17x17) | 195 | -40°C~100°C TJ | Tray | 2009 | SmartFusion®2 | 活跃 | 3 (168 Hours) | 100°C | -40°C | 166MHz | M2S010 | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 10K Logic Modules | 256KB | 符合RoHS标准 |
M2S090-1FG676I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S090-1FG676
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S050T-1FGG896I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S090T-FCS325I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S090-FGG484I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
A2F200M3F-FGG256I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S010-VFG256
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
1SX250LH3F55E1VG
Intel
分类:Embedded - System On Chip (SoC)
1SX250LH3F55E2LG
Intel
分类:Embedded - System On Chip (SoC)
10AS057N3F40E2SG
Intel
分类:Embedded - System On Chip (SoC)
XAZU5EV-1SFVC784Q
Xilinx Inc.
分类:Embedded - System On Chip (SoC)
A2F500M3G-1FGG484
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S005S-1TQ144I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S005-1TQ144I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S005-VFG256I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S005-VF400I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S005S-VF256I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S005-VF256
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S005S-FGG484
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S005S-1VF400
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S010-1VF256
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S005S-1VF256I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S010-1VF256I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S005S-VF400
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S010-1VFG400I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
