类别是'category.片上系统(SoC)' (7695)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 连接方式 | 建筑学 | 输入数量 | 可编程逻辑类型 | 主要属性 | 逻辑单元数 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | 10AS066N4F40I3SGES | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | YES | 588 | -40°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B1517 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 660K Logic Elements | 3.5mm | 40mm | 40mm | 符合RoHS标准 | ||||||||||||||||||||
![]() | 5ASXFB5G4F35C4N | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 26 Weeks | 1152-BBGA, FCBGA | YES | MCU - 208, FPGA - 385 | 0°C~85°C TJ | Tray | Arria V SX | e1 | 活跃 | 3 (168 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.1V | 1mm | 未说明 | 5ASXFB5 | S-PBGA-B1152 | 350 | 不合格 | 1.13V | 1.11.2/3.32.5V | 1.07V | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 670MHz | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 350 | 现场可编程门阵列 | FPGA - 462K Logic Elements | 420000 | 2.7mm | 35mm | 35mm | 符合RoHS标准 | ||||||||
![]() | 10AS066K2F40I2SG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 1517-BBGA, FCBGA | YES | 696 | -40°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B1517 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 660K Logic Elements | 3.5mm | 40mm | 40mm | 符合RoHS标准 | |||||||||||||||||||
![]() | 10AS057K4F40I3SG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 1517-BBGA, FCBGA | YES | 696 | -40°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B1517 | 696 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 696 | 现场可编程门阵列 | FPGA - 570K Logic Elements | 570000 | 3.5mm | 40mm | 40mm | 符合RoHS标准 | ||||||||||||
![]() | 10AS057K4F40E3LG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 1517-BBGA, FCBGA | YES | 696 | 0°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B1517 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 570K Logic Elements | 3.5mm | 40mm | 40mm | 符合RoHS标准 | |||||||||||||||||||
![]() | 10AS066K2F40E2LG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 1517-BBGA, FCBGA | YES | 696 | 0°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B1517 | 696 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 696 | 现场可编程门阵列 | FPGA - 660K Logic Elements | 660000 | 3.5mm | 40mm | 40mm | 符合RoHS标准 | ||||||||||||
![]() | 10AS066K3F40I2LG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 1517-BBGA, FCBGA | YES | 696 | -40°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B1517 | 696 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 696 | 现场可编程门阵列 | FPGA - 660K Logic Elements | 660000 | 3.5mm | 40mm | 40mm | 符合RoHS标准 | ||||||||||||
![]() | 10AS057K2F40I2LG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 1517-BBGA, FCBGA | YES | 696 | -40°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B1517 | 696 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 696 | 现场可编程门阵列 | FPGA - 570K Logic Elements | 570000 | 3.5mm | 40mm | 40mm | 符合RoHS标准 | ||||||||||||
![]() | 10AS066K2F40E2SG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 1517-BBGA, FCBGA | YES | 696 | 0°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B1517 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 660K Logic Elements | 3.5mm | 40mm | 40mm | 符合RoHS标准 | |||||||||||||||||||
![]() | 10AS066K2F40I2LG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 1517-BBGA, FCBGA | YES | 696 | -40°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B1517 | 696 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 696 | 现场可编程门阵列 | FPGA - 660K Logic Elements | 660000 | 3.5mm | 40mm | 40mm | 符合RoHS标准 | ||||||||||||
![]() | 5ASXFB3G4F35C5N | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 1152-BBGA, FCBGA | YES | MCU - 208, FPGA - 385 | 0°C~85°C TJ | Tray | Arria V SX | e1 | 活跃 | 3 (168 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.1V | 1mm | 未说明 | 5ASXFB3 | S-PBGA-B1152 | 350 | 不合格 | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 622MHz | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 350 | 现场可编程门阵列 | FPGA - 350K Logic Elements | 350000 | 2.7mm | 35mm | 35mm | 符合RoHS标准 | ||||||||
![]() | 5ASXFB5G4F35C5N | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 1152-BBGA, FCBGA | YES | MCU - 208, FPGA - 385 | 0°C~85°C TJ | Tray | Arria V SX | e1 | 活跃 | 3 (168 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.1V | 1mm | 未说明 | 5ASXFB5 | S-PBGA-B1152 | 350 | 不合格 | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 622MHz | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 350 | 现场可编程门阵列 | FPGA - 462K Logic Elements | 420000 | 2.7mm | 35mm | 35mm | 符合RoHS标准 | ||||||||
![]() | XCZU7CG-L2FFVF1517E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | 1517-BBGA, FCBGA | YES | 464 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | 活跃 | 4 (72 Hours) | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 0.72V | 未说明 | R-PBGA-B1517 | 0.742V | 0.698V | 533MHz, 1.3GHz | 256KB | 微处理器电路 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||
![]() | XCZU17EG-1FFVD1760I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | 1760-BBGA, FCBGA | 308 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | 活跃 | 4 (72 Hours) | 8542.31.00.01 | 未说明 | 未说明 | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||
![]() | 10AS022C4U19I3LG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 484-BFBGA | YES | 192 | -40°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 0.8mm | 未说明 | S-PBGA-B484 | 192 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 192 | 现场可编程门阵列 | FPGA - 220K Logic Elements | 220000 | 3.25mm | 19mm | 19mm | 符合RoHS标准 | |||||||||||
![]() | XCZU19EG-3FFVB1517E | Xilinx Inc. | 数据表 | 80 In Stock | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | 1517-BBGA, FCBGA | 644 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | 活跃 | 4 (72 Hours) | 8542.31.00.01 | 未说明 | 未说明 | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||
![]() | XAZU3EG-1SFVA625I | Xilinx Inc. | 数据表 | 70 In Stock | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | 625-BFBGA, FCBGA | YES | 128 | -40°C~100°C TJ | Tray | Zynq® UltraScale+™ MPSoC EG | 活跃 | 4 (72 Hours) | 625 | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 0.85V | 0.8mm | 未说明 | S-PBGA-B625 | 500MHz, 1.2GHz | 1.8MB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I2C, SPI, UART/USART, USB | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 3.43mm | 21mm | 21mm | ROHS3 Compliant | ||||||||||||||||||
![]() | 10AS057K1F35I1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 396 | -40°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | unknown | S-PBGA-B1152 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 570K Logic Elements | 3.5mm | 35mm | 35mm | 符合RoHS标准 | |||||||||||||||||||
![]() | XCZU2CG-2SFVC784E | Xilinx Inc. | 数据表 | 2344 In Stock | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | 784-BFBGA, FCBGA | 252 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | yes | 活跃 | 4 (72 Hours) | 8542.31.00.01 | 未说明 | 未说明 | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||
![]() | 10AS057H1F34I1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 492 | -40°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | unknown | S-PBGA-B1152 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 570K Logic Elements | 3.65mm | 35mm | 35mm | 符合RoHS标准 | |||||||||||||||||||
![]() | 10AS048K2F35I2LG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 396 | -40°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B1152 | 396 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 现场可编程门阵列 | FPGA - 480K Logic Elements | 480000 | 3.5mm | 35mm | 35mm | 符合RoHS标准 | |||||||||||||
![]() | 10AS032H4F35I3SG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 1152-BBGA, FCBGA | YES | 384 | -40°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B1152 | 384 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 现场可编程门阵列 | FPGA - 320K Logic Elements | 320000 | 3.5mm | 35mm | 35mm | 符合RoHS标准 | ||||||||||||
![]() | 10AS048H4F34I3SG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | 1152-BBGA, FCBGA | YES | 492 | -40°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B1152 | 492 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 现场可编程门阵列 | FPGA - 480K Logic Elements | 480000 | 3.65mm | 35mm | 35mm | 符合RoHS标准 | ||||||||||||
![]() | 10AS048E2F29I2SG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 780-BBGA, FCBGA | YES | 360 | -40°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 780 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B780 | 360 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | 现场可编程门阵列 | FPGA - 480K Logic Elements | 480000 | 3.35mm | 29mm | 29mm | 符合RoHS标准 | |||||||||||
![]() | 10AS048K4F35E3LG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 396 | 0°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B1152 | 396 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 现场可编程门阵列 | FPGA - 480K Logic Elements | 480000 | 3.5mm | 35mm | 35mm | 符合RoHS标准 |
10AS066N4F40I3SGES
Intel
分类:Embedded - System On Chip (SoC)
5ASXFB5G4F35C4N
Intel
分类:Embedded - System On Chip (SoC)
10AS066K2F40I2SG
Intel
分类:Embedded - System On Chip (SoC)
10AS057K4F40I3SG
Intel
分类:Embedded - System On Chip (SoC)
10AS057K4F40E3LG
Intel
分类:Embedded - System On Chip (SoC)
10AS066K2F40E2LG
Intel
分类:Embedded - System On Chip (SoC)
10AS066K3F40I2LG
Intel
分类:Embedded - System On Chip (SoC)
10AS057K2F40I2LG
Intel
分类:Embedded - System On Chip (SoC)
10AS066K2F40E2SG
Intel
分类:Embedded - System On Chip (SoC)
10AS066K2F40I2LG
Intel
分类:Embedded - System On Chip (SoC)
5ASXFB3G4F35C5N
Intel
分类:Embedded - System On Chip (SoC)
5ASXFB5G4F35C5N
Intel
分类:Embedded - System On Chip (SoC)
XCZU7CG-L2FFVF1517E
Xilinx Inc.
分类:Embedded - System On Chip (SoC)
XCZU17EG-1FFVD1760I
Xilinx Inc.
分类:Embedded - System On Chip (SoC)
10AS022C4U19I3LG
Intel
分类:Embedded - System On Chip (SoC)
XCZU19EG-3FFVB1517E
Xilinx Inc.
分类:Embedded - System On Chip (SoC)
XAZU3EG-1SFVA625I
Xilinx Inc.
分类:Embedded - System On Chip (SoC)
10AS057K1F35I1SG
Intel
分类:Embedded - System On Chip (SoC)
XCZU2CG-2SFVC784E
Xilinx Inc.
分类:Embedded - System On Chip (SoC)
10AS057H1F34I1SG
Intel
分类:Embedded - System On Chip (SoC)
10AS048K2F35I2LG
Intel
分类:Embedded - System On Chip (SoC)
10AS032H4F35I3SG
Intel
分类:Embedded - System On Chip (SoC)
10AS048H4F34I3SG
Intel
分类:Embedded - System On Chip (SoC)
10AS048E2F29I2SG
Intel
分类:Embedded - System On Chip (SoC)
10AS048K4F35E3LG
Intel
分类:Embedded - System On Chip (SoC)
