类别是'category.片上系统(SoC)' (7695)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 表面安装 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 界面 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 连接方式 | 建筑学 | 输入数量 | 可编程逻辑类型 | 核心架构 | 主要属性 | 逻辑单元数 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | 5ASXBB5D6F35C6N | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | MCU - 208, FPGA - 385 | 0°C~85°C TJ | Tray | Arria V SX | 活跃 | 3 (168 Hours) | 5ASXBB5 | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 462K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
![]() | 5ASXFB5G6F35C6N | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 26 Weeks | 1152-BBGA, FCBGA | MCU - 208, FPGA - 385 | 0°C~85°C TJ | Tray | Arria V SX | 活跃 | 3 (168 Hours) | 8542.39.00.01 | 5ASXFB5 | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 462K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||
![]() | 5ASXFB3G6F35C6N | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | MCU - 208, FPGA - 385 | 0°C~85°C TJ | Tray | Arria V SX | 活跃 | 3 (168 Hours) | 8542.39.00.01 | 5ASXFB3 | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 350K Logic Elements | 符合RoHS标准 | |||||||||||||||||||||||||||||||
![]() | 5ASXBB3D6F31C6N | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 26 Weeks | 896-BBGA, FCBGA | MCU - 208, FPGA - 250 | 0°C~85°C TJ | Tray | 2015 | Arria V SX | 活跃 | 3 (168 Hours) | 5ASXBB3 | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 350K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||
![]() | 5CSEBA4U23C7SN | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | 活跃 | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.1V | 0.8mm | 未说明 | S-PBGA-B672 | 145 | 不合格 | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 现场可编程门阵列 | FPGA - 40K Logic Elements | 40000 | 1.85mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||
![]() | 10AS066H3F34I2SGES | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 492 | -40°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B1152 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 660K Logic Elements | 3.65mm | 35mm | 35mm | 符合RoHS标准 | |||||||||||||||||||||
![]() | XCZU17EG-1FFVE1924I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | 1924-BBGA, FCBGA | 668 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | 活跃 | 4 (72 Hours) | 8542.31.00.01 | 未说明 | 未说明 | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||
![]() | XCZU2CG-L2SBVA484E | Xilinx Inc. | 数据表 | 318 In Stock | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | 484-BFBGA, FCBGA | YES | 82 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | 活跃 | 4 (72 Hours) | 484 | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 0.72V | 未说明 | R-PBGA-B484 | 0.742V | 0.698V | 533MHz, 1.3GHz | 256KB | 微处理器电路 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||
![]() | XCZU17EG-1FFVE1924E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | 1924-BBGA, FCBGA | 668 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | 活跃 | 4 (72 Hours) | 8542.31.00.01 | 未说明 | 未说明 | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||
![]() | 5CSEMA6U23C7N | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | 活跃 | 3 (168 Hours) | 672 | BOTTOM | BALL | 未说明 | 1.1V | 0.8mm | 未说明 | 5CSEMA6 | S-PBGA-B672 | 145 | 不合格 | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 现场可编程门阵列 | FPGA - 110K Logic Elements | 110000 | 1.85mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||
![]() | 10AS057K1F40E1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 1517-BBGA, FCBGA | 696 | 0°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 570K Logic Elements | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
![]() | XC7Z020-2CLG484CES | Xilinx Inc. | 数据表 | 60 In Stock | - | 最小起订量: 1 最小包装量: 1 | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) | 130 | 0°C~85°C TJ | Tray | 2010 | Zynq®-7000 | Obsolete | 3 (168 Hours) | 85°C | 0°C | 766MHz | XC7Z020 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 766MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | Artix™-7 FPGA, 85K Logic Cells | 符合RoHS标准 | ||||||||||||||||||||||||||
![]() | 10AS032H2F35I1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 384 | -40°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B1152 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 320K Logic Elements | 3.5mm | 35mm | 35mm | 符合RoHS标准 | |||||||||||||||||||||
![]() | 1SX250LN2F43I2VG | Intel | 数据表 | 1000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 1760-BBGA, FCBGA | 688 | -40°C~100°C TJ | Tray | Stratix® 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2500K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
![]() | 10AS057K2F40E1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 1517-BBGA, FCBGA | 696 | 0°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 570K Logic Elements | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
![]() | 10AS057K2F35I1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 1152-BBGA, FCBGA | 396 | -40°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 570K Logic Elements | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
![]() | 10AS066K1F40E1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 1517-BBGA, FCBGA | 696 | 0°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 660K Logic Elements | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
![]() | 10AS066N2F40I1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 1517-BBGA, FCBGA | 588 | -40°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 660K Logic Elements | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
![]() | 10AS032E2F27E1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 672-BBGA, FCBGA | 240 | 0°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 320K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
![]() | 10AS027H2F35E1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 384 | 0°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 270K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
![]() | 10AS027H2F35I1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 384 | -40°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 270K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
![]() | 10AS027H1F35I1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 384 | -40°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 270K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
![]() | 10AS027H1F34I1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 384 | -40°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 270K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
![]() | 10AS032E1F27E1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 672-BBGA, FCBGA | 240 | 0°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 320K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
![]() | 10AS032E1F29E1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 780-BBGA, FCBGA | 360 | 0°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 320K Logic Elements | 符合RoHS标准 |
5ASXBB5D6F35C6N
Intel
分类:Embedded - System On Chip (SoC)
5ASXFB5G6F35C6N
Intel
分类:Embedded - System On Chip (SoC)
5ASXFB3G6F35C6N
Intel
分类:Embedded - System On Chip (SoC)
5ASXBB3D6F31C6N
Intel
分类:Embedded - System On Chip (SoC)
5CSEBA4U23C7SN
Intel
分类:Embedded - System On Chip (SoC)
10AS066H3F34I2SGES
Intel
分类:Embedded - System On Chip (SoC)
XCZU17EG-1FFVE1924I
Xilinx Inc.
分类:Embedded - System On Chip (SoC)
XCZU2CG-L2SBVA484E
Xilinx Inc.
分类:Embedded - System On Chip (SoC)
XCZU17EG-1FFVE1924E
Xilinx Inc.
分类:Embedded - System On Chip (SoC)
5CSEMA6U23C7N
Intel
分类:Embedded - System On Chip (SoC)
10AS057K1F40E1HG
Intel
分类:Embedded - System On Chip (SoC)
XC7Z020-2CLG484CES
Xilinx Inc.
分类:Embedded - System On Chip (SoC)
10AS032H2F35I1SG
Intel
分类:Embedded - System On Chip (SoC)
1SX250LN2F43I2VG
Intel
分类:Embedded - System On Chip (SoC)
10AS057K2F40E1HG
Intel
分类:Embedded - System On Chip (SoC)
10AS057K2F35I1HG
Intel
分类:Embedded - System On Chip (SoC)
10AS066K1F40E1HG
Intel
分类:Embedded - System On Chip (SoC)
10AS066N2F40I1HG
Intel
分类:Embedded - System On Chip (SoC)
10AS032E2F27E1HG
Intel
分类:Embedded - System On Chip (SoC)
10AS027H2F35E1HG
Intel
分类:Embedded - System On Chip (SoC)
10AS027H2F35I1HG
Intel
分类:Embedded - System On Chip (SoC)
10AS027H1F35I1HG
Intel
分类:Embedded - System On Chip (SoC)
10AS027H1F34I1HG
Intel
分类:Embedded - System On Chip (SoC)
10AS032E1F27E1HG
Intel
分类:Embedded - System On Chip (SoC)
10AS032E1F29E1HG
Intel
分类:Embedded - System On Chip (SoC)
