类别是'category.片上系统(SoC)' (7695)

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产品型号

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数据表

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Rohs

底架

安装类型

包装/外壳

表面安装

越来越多的功能

触点形状

外壳材料

供应商器件包装

介电材料

插入材料

终端数量

厂商

Voltage Rating AC

操作温度

包装

系列

尺寸/尺寸

容差

零件状态

终止次数

终端

温度系数

连接器类型

类型

电阻

定位的数量

组成

颜色

应用

性别

功率(瓦特)

HTS代码

电容量

紧固类型

子类别

触点类型

技术

端子位置

方向

终端形式

屏蔽/屏蔽

峰值回流焊温度(摄氏度)

入口保护

端子间距

Reach合规守则

输出量

外壳完成

外壳尺寸-插入

JESD-30代码

输出的数量

资历状况

房屋颜色

工作电源电压

失败率

引线间距

电源

温度等级

注意

速度

内存大小

电缆长度

外壳尺寸,MIL

引线样式

核心处理器

周边设备

程序内存大小

连接方式

重置

建筑学

电压 - 阈值

监测的电压数量

重置超时

输入数量

座位高度-最大

可编程逻辑类型

产品类别

包括

主要属性

逻辑单元数

核数量

闪光大小

特征

产品类别

高度

座位高度(最大)

长度

宽度

厚度(最大)

材料可燃性等级

评级结果

XCZU48DR-2FSVG1517E
XCZU48DR-2FSVG1517E
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

10-TFSOP, 10-MSOP (0.118, 3.00mm Width)

10-uMAX/uSOP

Analog Devices Inc./Maxim Integrated

561

Tape & Reel (TR)

MAX16055

活跃

-40°C ~ 125°C (TA)

-

Multi-Voltage Supervisor

开路漏极或开路集电极

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

低电平有效

MCU, FPGA

6 Selectable Threshold Combinations

6

140ms Minimum

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU49DR-2FFVF1760E
XCZU49DR-2FFVF1760E
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1206 (3216 Metric)

1206

Vishay Dale 薄膜

Tray

D55342

活跃

622

-55°C ~ 150°C

Military, MIL-PRF-55342, RM1206

0.126 L x 0.063 W (3.20mm x 1.60mm)

±1%

2

±100ppm/°C

178 Ohms

Thin Film

0.25W, 1/4W

P (0.1%)

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

Military, Non-Inductive

0.033 (0.84mm)

XCZU48DR-L1FFVG1517I
XCZU48DR-L1FFVG1517I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

Molex

Bulk

090635

活跃

561

-40°C ~ 100°C (TJ)

*

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU49DR-1FSVF1760I
XCZU49DR-1FSVF1760I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

Analog Devices Inc./Maxim Integrated

Tape & Reel (TR)

MAX198

Obsolete

622

-40°C ~ 100°C (TJ)

*

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU43DR-2FFVE1156E
XCZU43DR-2FFVE1156E
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

Panduit Corp

Bulk

Obsolete

366

0°C ~ 100°C (TJ)

-

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU43DR-2FSVE1156I
XCZU43DR-2FSVE1156I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Radial

-

Vishay Foil Resistors (Division of Vishay Precision Group)

Bulk

活跃

366

-55°C ~ 125°C

S

0.300 L x 0.105 W (7.62mm x 2.67mm)

±0.01%

2

±2ppm/°C

1.09244 kOhms

金属箔

0.6W

-

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

Moisture Resistant, Non-Inductive

0.336 (8.53mm)

XCZU43DR-L1FSVG1517I
XCZU43DR-L1FSVG1517I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

10-WFDFN

10-uDFN (2x2)

Analog Devices Inc./Maxim Integrated

561

Tape & Reel (TR)

MAX16034

Obsolete

-40°C ~ 85°C

-

备用电池电路

Push-Pull, Totem Pole

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

低电平有效

MCU, FPGA

2.63V

1

140ms Minimum

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU43DR-2FSVG1517E
XCZU43DR-2FSVG1517E
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

通孔

Radial

1517-FCBGA (40x40)

Polyester, Polyethylene Terephthalate (PET), Metallized - Stacked

EPCOS - TDK Electronics

Bulk

Obsolete

63V

561

40V

-55°C ~ 125°C

SilverCap™ B32561

0.453 L x 0.177 W (11.50mm x 4.50mm)

±20%

PC引脚

通用型

1 µF

0.394 (10.00mm)

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

0.272 (6.90mm)

XCZU43DR-L2FSVE1156I
XCZU43DR-L2FSVE1156I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

面板安装

1156-BBGA, FCBGA

Bulkhead - Front Side Nut

Circular

Composite

1156-FCBGA (35x35)

Plastic

TE Connectivity Deutsch 连接器

活跃

366

Bulk

D38999/24MA

20

-65°C ~ 200°C

Military, MIL-DTL-38999 Series III, ACT

插座外壳

用于内螺纹插座

3

Threaded

Crimp

B

Shielded

抗环境干扰

化学镍

9-98

Silver

不包括触点

533MHz, 1.333GHz

256KB

A

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

-

-

XCZU43DR-1FFVG1517I
XCZU43DR-1FFVG1517I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Surface Mount, MLCC

0402 (1005 Metric)

1517-FCBGA (40x40)

Vishay Vitramon

561

Bulk

Obsolete

100V

-55°C ~ 150°C

VJ

0.039 L x 0.020 W (1.00mm x 0.50mm)

±10%

C0G, NP0

汽车

18 pF

-

-

500MHz, 1.2GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

-

-

0.024 (0.60mm)

AEC-Q200

XCZU48DR-1FSVG1517I
XCZU48DR-1FSVG1517I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

Molex

Bulk

093090

活跃

561

-40°C ~ 100°C (TJ)

*

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

AGFB014R24C2E2VAA
AGFB014R24C2E2VAA
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

744

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.4M Logic Elements

-

10AS027H3F35I2SG
10AS027H3F35I2SG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-1152

YES

1152

Non-Compliant

384

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

270000 LE

1

SMD/SMT

33750 LAB

965286

Intel

Intel / Altera

Arria 10 SoC

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

10AS027H3F35I2SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.43

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

384

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

384

3.5 mm

现场可编程门阵列

SoC FPGA

FPGA - 270K Logic Elements

270000

2 Core

--

SoC FPGA

35 mm

35 mm

AGFB019R25A3I3E
AGFB019R25A3I3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

TE Connectivity Deutsch 连接器

活跃

D38999/24MC

Bag

480

-40°C ~ 100°C (TJ)

*

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

XCVC1902-2HSIVSVD1760
XCVC1902-2HSIVSVD1760
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

0805 (2012 Metric)

0805

KOA Speer Electronics, Inc.

Tape & Reel (TR)

RN732A

Obsolete

726

-55°C ~ 155°C

RN73

0.079 L x 0.049 W (2.00mm x 1.25mm)

±0.1%

2

±50ppm/°C

48.1 kOhms

Thin Film

0.1W, 1/10W

800MHz, 1.65GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

Moisture Resistant

0.024 (0.60mm)

XCVC1802-1MLIVSVD1760
XCVC1802-1MLIVSVD1760
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

Panduit Corp

Bulk

Obsolete

692

-40°C ~ 100°C (TJ)

*

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

AGFA014R24C2I3V
AGFA014R24C2I3V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Base

-

-

Intel

活跃

Non-Compliant

744

Tray

-40°C ~ 100°C (TJ)

Agilex F

240 V

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.4M Logic Elements

-

0 m

0 m

0 m

XC7Z030-2FBG676I
XC7Z030-2FBG676I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

676-BBGA, FCBGA

676-FCBGA (27x27)

AMD

130

Tray

XC7Z030

活跃

-40°C ~ 100°C (TJ)

Zynq®-7000

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 125K Logic Cells

-

AGFA023R25A3E3E
AGFA023R25A3E3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

480

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

XCZU9EG-2FFVC900E
XCZU9EG-2FFVC900E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

204

Tray

XCZU9

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

Black

533MHz, 600MHz, 1.3GHz

256KB

762 mm

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

AGFB014R24C3E3E
AGFB014R24C3E3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

744

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.4M Logic Elements

-

I.MX 6QUAD / MCIMX6Q6AVT10AE
I.MX 6QUAD / MCIMX6Q6AVT10AE
NXP 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Non-Compliant

Female

AGFC019R25A2E3V
AGFC019R25A2E3V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

480

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

CYW54591RKUBGT
CYW54591RKUBGT
Cypress 数据表

N/A

-

最小起订量: 1

最小包装量: 1

AGFB012R24B2I3V
AGFB012R24B2I3V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

768

Tray

活跃

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.2M Logic Elements

-