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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	安装类型	包装/外壳	表面安装	供应商器件包装	材料	终端数量																						厂商																													操作温度	系列	JESD-609代码	终端	端子表面处理	组成	附加功能	HTS代码	子类别	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	输出的数量	资历状况	电源	温度等级	界面	速度	内存大小	周边设备	程序内存大小	连接方式
XCVM1802-1LSIVFVC1760	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD	Tray	活跃						500	-40°C ~ 100°C (TJ)	Versal™ Prime																						400MHz, 1GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA									Versal™ Prime FPGA, 1.9M Logic Cells						-
XCVM1302-2MSIVSVD1760	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD	Tray	活跃						402	-40°C ~ 100°C (TJ)	Versal™ Prime																						600MHz, 1.4GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA									Versal™ Prime FPGA, 70k Logic Cells						-
XCVM1802-1MSIVFVC1760	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD	Tray	活跃						500	-40°C ~ 100°C (TJ)	Versal™ Prime																						600MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA									Versal™ Prime FPGA, 1.9M Logic Cells						-
XCVC1502-2LSENSVG1369	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD	Tray	活跃						500	0°C ~ 100°C (TJ)	Versal™ AI Core																						450MHz, 1.08GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA									Versal™ AI Core FPGA, 800k Logic Cells						-
XCVM1302-2HSIVFVC1596	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA	1596-BGA (37.5x37.5)	AMD	Tray	活跃						532	-40°C ~ 100°C (TJ)	Versal™ Prime																						800MHz, 1.65GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA									Versal™ Prime FPGA, 70k Logic Cells						-
XCVC1802-2MLEVSVD1760	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD	Tray	活跃						692	0°C ~ 100°C (TJ)	Versal™ AI Core																						600MHz, 1.4GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA									Versal™ AI Core FPGA, 1.5M Logic Cells						-
XCVM1402-2MSIVFVC1596	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA	1596-BGA (37.5x37.5)	AMD	Tray	活跃						748	-40°C ~ 100°C (TJ)	Versal™ Prime																						600MHz, 1.4GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA									Versal™ Prime FPGA, 1.2M Logic Cells						-
XCVC1802-2MSEVSVA2197	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD	Tray	活跃						770	0°C ~ 100°C (TJ)	Versal™ AI Core																						600MHz, 1.4GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA									Versal™ AI Core FPGA, 1.5M Logic Cells						-
XCVM1402-1LSIVSVD1760	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD	Tray	活跃						726	-40°C ~ 100°C (TJ)	Versal™ Prime																						400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA									Versal™ Prime FPGA, 1.2M Logic Cells						-
XCZU42DR-1FFVE1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD				RISC	1.8/2.5/3.3 V	CAN/Serial I2C/SPI/UART/USB	有	FPGA/Microcontroller	366	Tray	活跃			-40°C ~ 100°C (TJ)	Zynq® UltraScale+™ RFSoC																					CAN/Serial I2C/SPI/U	500MHz, 1.2GHz	256 KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32 Bit								Zynq®UltraScale+™ FPGA, 489K+ Logic Cells						-			ARM Cortex-A53/ARM Cortex-R5F
XCVM1802-2LLEVSVA2197	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD	Tray	活跃						770	0°C ~ 100°C (TJ)	Versal™ Prime																						450MHz, 1.08GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA									Versal™ Prime FPGA, 1.9M Logic Cells						-
BCM3384GUKFSBGB0T	Broadcom	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Broadcom Limited	Hoffman	Tray	BCM3384	活跃								AHE10X10X6		*
XCZU48DR-1FSVG1517I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD	Tray	活跃						561	-40°C ~ 100°C (TJ)	Zynq® UltraScale+™ RFSoC																						500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA									Zynq®UltraScale+™ FPGA, 930K+ Logic Cells						-
M2S050TS-FGG484I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	YES	484-FPBGA (23x23)	484	BGA	微芯片技术	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.82			Non-Compliant	267	Tray	M2S050	活跃	-	166 MHz	56340 LE	SMD/SMT	-	64 kB	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	1.14 V	有	M2S050TS-FGG484I	-40°C ~ 100°C (TJ)	SmartFusion®2	e1		Tin/Silver/Copper (Sn/Ag/Cu)			8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	250	1 mm	compliant	40		S-PBGA-B484	267	不合格	1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		267		2.44 mm	现场可编程门阵列			FPGA - 50K Logic Modules			56340	1 Core		256KB			23 mm	23 mm
M2S060TS-FCSG325	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	M2S060TS-FCSG325	TFBGA	微芯片技术	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.81				200	Tray	M2S060	活跃	-	166 MHz	56520 LE	-	64 kB	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	40	1.14 V	85 °C	有	0°C ~ 85°C (TJ)	SmartFusion®2	e1		Tin/Silver/Copper (Sn/Ag/Cu)		LG-MIN, WD-MIN	8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	250	0.5 mm	compliant			S-PBGA-B325	200	不合格	1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		200		1.01 mm	现场可编程门阵列			FPGA - 60K Logic Modules			56520	1 Core		256KB			11 mm	11 mm
M2S050T-FG896I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	896-BGA	YES	896-FBGA (31x31)	896	无	M2S050T-FG896I	微芯片技术	BGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.81			Non-Compliant	377	Tray	M2S050	活跃	-	166 MHz	56340 LE	SMD/SMT	-	64 kB	BGA, BGA896,30X30,40	网格排列	3	PLASTIC/EPOXY	BGA896,30X30,40	1.2 V	30	1.14 V	-40°C ~ 100°C (TJ)	SmartFusion®2	e0		Tin/Lead (Sn/Pb)			8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	240	1 mm	not_compliant			S-PBGA-B896	377	不合格	1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		377		2.44 mm	现场可编程门阵列			FPGA - 50K Logic Modules			56340	1 Core		256KB			31 mm	31 mm
A2F200M3F-CS288	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	288-TFBGA, CSPBGA	288-CSP (11x11)	微芯片技术						MCU - 31, FPGA - 78	Tray	A2F200	活跃	0°C ~ 85°C (TJ)	SmartFusion®																						80MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA									ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops						256KB
M2S005S-1TQG144T2	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	144-LQFP	144-TQFP (20x20)	微芯片技术			213	Tray	M2S005	活跃	3	40	有	M2S005S-1TQG144T2	Microsemi Corporation	活跃	MICROSEMI CORP	5.79				0°C ~ 85°C (TJ)	SmartFusion®2			Pure Matte Tin (Sn)								250		compliant									166MHz	64KB	ARM® Cortex®-M3	-		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					现场可编程门阵列				FPGA - 5K Logic Modules						128KB
A2F200M3F-FG484I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BGA	YES	484-FPBGA (23x23)	484	微芯片技术	1.575 V	5.23				MCU - 41, FPGA - 94	Tray	A2F200	活跃	BGA, BGA484,26X26,40	网格排列	3	PLASTIC/EPOXY	BGA484,26X26,40	-40 °C	1.5 V	20	1.425 V	100 °C	无	A2F200M3F-FG484I	80 MHz	BGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	-40°C ~ 100°C (TJ)	SmartFusion®	e0		Tin/Lead (Sn/Pb)			8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL	225	1 mm	compliant			S-PBGA-B484	94	不合格	1.5,1.8,2.5,3.3 V	INDUSTRIAL		80MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA		94	4608 CLBS, 200000 GATES	2.44 mm	现场可编程门阵列				ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops	4608	4608		200000	256KB				23 mm	23 mm
XCZU3CG-L2SFVA625E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	625-BFBGA, FCBGA	625-FCBGA (21x21)	AMD		ABB	KA2-2143	180	Tray	活跃					0°C ~ 100°C (TJ)	Zynq® UltraScale+™ MPSoC CG																						533MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA									Zynq®UltraScale+™ FPGA, 154K+ Logic Cells						-
XCZU11EG-3FFVC1156E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Surface	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD	0.9000 V	0.873 V	0.927 V	360	Tray	XCZU11	活跃					230C180B	CSA, UL	Amperite	180	0 to 100 °C	Zynq® UltraScale+™ MPSoC EG		0.110 in Flat Blade																				600MHz, 667MHz, 1.5GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						230 VAC, 230 VDC		3	Zynq®UltraScale+™ FPGA, 653K+ Logic Cells						-	关闭延迟	1NC
M2S010-1TQG144I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	144-LQFP	144-TQFP (20x20)	Steel	微芯片技术	25.4 mm	Straight	CGB399	cUL, UL	Round	Crouse-Hinds Industrial Produc	Bushing Grip with Strain Relief	无	1.2000 V	84	Tray	M2S010	活跃	-	166 MHz	12084 LE	SMD/SMT	-	64 kB					30.18 mm	-40 to 100 °C	SmartFusion®2				Metallic																		166MHz	64KB	ARM® Cortex®-M3	-	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA								1	FPGA - 10K Logic Modules				1 Core	256KB
XCZU3EG-1SFVA625E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	625-BFBGA, FCBGA	625-FCBGA (21x21)	AMD			VH7281GS+8122G	Johnson Controls	154,350	FCBGA	0.8500 V	0.808 V	180	0.892 V	180	Tray	XCZU3	活跃				0 to 100 °C	Zynq® UltraScale+™ MPSoC EG															625							500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							扩展工业	1	Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	141,120					-
XCZU2CG-L1SFVA625I	AMD	数据表	174 In Stock	-	最小起订量: 1 最小包装量: 1	625-BFBGA, FCBGA	625-FCBGA (21x21)	AMD	XCZU2	活跃						DH363FGKV	Cutler Hammer, Div of Eaton Corp	0.72, 0.85 V	0.698, 0.808 V	0.742, 0.892 V	180	Tray	-40 to 100 °C	Zynq® UltraScale+™ MPSoC CG															625							500MHz, 1.2GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								1L	Zynq®UltraScale+™ FPGA, 103K+ Logic Cells						-
XCZU11EG-2FFVC1760I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	AMD	活跃						Miscellaneous	0.8500 V	512	Tray	XCZU11	-40 to 100 °C	Zynq® UltraScale+™ MPSoC EG																						533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								2	Zynq®UltraScale+™ FPGA, 653K+ Logic Cells						-