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首页 全部商品 category.集成电路IC category.片上系统（SoC）

类别是'category.片上系统（SoC）' (7695)

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电压 - 供电

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知识产权评级

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XCVM1402-1MLIVFVC1596
XCVM1402-1MLIVFVC1596
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1596-BFBGA

1596-BGA (37.5x37.5)

AMD

748

Tray

活跃

-40°C ~ 100°C (TJ)

*

活跃

600MHz, 1.3GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-

 A2F500M3G-PQG208
A2F500M3G-PQG208
 Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

208-BFQFP

208-PQFP (28x28)

微芯片技术

MCU - 22, FPGA - 66

A2F500

活跃

2XR8I+2XR8I

ACS8802XR8I+2XR8IIP42

ACS880-17-1110A-5+B4+C+H-ABBI

ABB

Panel

0°C ~ 85°C (TJ)

SmartFusion®

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

Ethernet, I²C, SPI, UART/USART

MCU, FPGA

500 Hz

STD

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

512KB

IP42

 AGFC023R25A1E1V
AGFC023R25A1E1V
 Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

480

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

 AGFA008R24C3E3V
AGFA008R24C3E3V
 Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

576

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 764K Logic Elements

-

 AGFB008R16A3E3E
AGFB008R16A3E3E
 Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

镀镍黄铜

Intel

4.06 mm

Straight

291378

CSA, UL

Round

Pepperl Fuchs

Bushing Grip

384

Tray

活跃

11.94 mm

0°C ~ 100°C (TJ)

Agilex F

Metallic

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 764K Logic Elements

-

IP66, IP68

 XCZU4CG-2SFVC784I
XCZU4CG-2SFVC784I
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

活跃

Miscellaneous

252

Tray

XCZU4

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

 XCZU49DR-2FFVF1760I
XCZU49DR-2FFVF1760I
 AMD 数据表

585 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

622

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

 AGFD019R25A2I3V
AGFD019R25A2I3V
 Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

480

Tray

活跃

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

 AGFA027R24C2E1VR2
AGFA027R24C2E1VR2
 Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

744

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

 AGFA008R16A2E3V
AGFA008R16A2E3V
 Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

384

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 764K Logic Elements

-

 XCZU46DR-L2FFVH1760I
XCZU46DR-L2FFVH1760I
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

574

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

 XCZU4EV-1FBVB900E
XCZU4EV-1FBVB900E
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

CE

Hollowshaft

Hollow

Dynapar

有

204

Tray

XCZU4

活跃

HS35R05009141

-40 to 85 Degrees C

Zynq® UltraScale+™ MPSoC EV

7 Pin Connector

5~26 VDC

Differential

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

5~26 VDC

有

IP67

 1SX065HH3F35I2LG
1SX065HH3F35I2LG
 Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

1152-FBGA (35x35)

Intel

活跃

IN430FS1

Hubbell

392

Tray

-40°C ~ 100°C (TJ)

Stratix® 10 SX

1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 650K Logic Elements

-

 UPD63F810GM(A)-8EV-A
UPD63F810GM(A)-8EV-A
 Renesas 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

EPSON

活跃

SG-8101

Tape & Reel (TR)

-40°C ~ 105°C

SG-8101

0.276 L x 0.197 W (7.00mm x 5.00mm)

XO (Standard)

1.8V ~ 3.3V

74.25 MHz

±20ppm

CMOS

Enable/Disable

Crystal

6.8mA (Typ)

3.5mA

-

-

0.055 (1.40mm)

-

 XCZU9CG-2FFVC900E
XCZU9CG-2FFVC900E
 AMD 数据表

897 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

0.8500 V

0.808 V

0.892 V

204

Tray

XCZU9

活跃

0 to 100 °C

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

 XCZU9CG-2FFVB1156E
XCZU9CG-2FFVB1156E
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

0.8500 V

0.808 V

0.892 V

328

Tray

XCZU9

活跃

0 to 100 °C

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

 XCZU3CG-1SFVA625I
XCZU3CG-1SFVA625I
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

AMD

154,350

FCBGA

0.8500 V

0.808 V

180

0.892 V

180

Bulk

XCZU3

活跃

Industrial grade

-40 to 100 °C

Zynq® UltraScale+™ MPSoC CG

625

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Industrial

1

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

141,120

-

 XCZU9EG-3FFVC900E
XCZU9EG-3FFVC900E
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

0.97 V

1.03 V

204

Tray

XCZU9

活跃

599,550

FCBGA

1.0000 V

0 to 100 °C

Zynq® UltraScale+™ MPSoC EG

900

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

扩展工业

3

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

548,160

-

 XCZU15EG-L2FFVB1156E
XCZU15EG-L2FFVB1156E
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

0.72, 0.85 V

0.698, 0.808 V

0.742, 0.892 V

328

Tray

XCZU15

活跃

0 to 110 °C

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2L

Zynq®UltraScale+™ FPGA, 747K+ Logic Cells

-

 M2S090-1FGG484I
M2S090-1FGG484I
 Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

484-BGA

484-FPBGA (23x23)

微芯片技术

1.2000 V

1.14 V

1.26 V

267

Tray

M2S090

活跃

-40 to 100 °C

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 90K Logic Modules

512KB

 AGFA008R24C2I2V
AGFA008R24C2I2V
 Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

0805 (2012 Metric)

0805

KOA Speer Electronics, Inc.

RN73R2A

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

576

活跃

-55°C ~ 155°C

RN73R

0.079 L x 0.049 W (2.00mm x 1.25mm)

±0.5%

2

±50ppm/°C

59 Ohms

Thin Film

0.125W, 1/8W

-

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 764K Logic Elements

-

Automotive AEC-Q200, Moisture Resistant

0.024 (0.60mm)

AEC-Q200

 AGFB014R24B2E3V
AGFB014R24B2E3V
 Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Cell (36)

-

Tycon Systems Inc.

768

Box

TPS-12

活跃

2.19 A

-40°C ~ 85°C

-

21.457 L x 19.291 W x 1.378 H (545.00mm x 490.00mm x 35.00mm)

Monocrystalline

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.4M Logic Elements

-

16.92 V

35 W

2.07 A

20.87 V

 AGIB027R31B3I3E
AGIB027R31B3I3E
 Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

PEI-Genesis

Bulk

活跃

720

-40°C ~ 100°C (TJ)

*

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

 10AS048
10AS048
 Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

PEI-Genesis

活跃

Bulk

*

 XCZU11EG-1FFVF1517E
XCZU11EG-1FFVF1517E
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

464

0.979 V

464

Tray

XCZU11

活跃

653,100

0.9500 V

0.922 V

0 to 100 °C

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

XCZU11EG

MCU, FPGA

扩展工业

1

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

597,120

-