category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	包装/外壳	表面安装	供应商器件包装	终端数量		Core										厂商																															操作温度	包装	系列	JESD-609代码	无铅代码	ECCN 代码	端子表面处理	附加功能	HTS代码	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	输出的数量	资历状况	工作电源电压	电源	温度等级	速度	内存大小	核心处理器	周边设备	程序内存大小	连接方式	建筑学	输入数量	座位高度-最大	可编程逻辑类型	速度等级	主要属性	逻辑单元数
M2S060T-FCS325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	ARM Cortex M3	176	微芯片技术	SmartFusion2	200	Tray	M2S060	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	30	1.14 V	85 °C	无	M2S060T-FCS325	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.87	This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant			S-PBGA-B325	200	不合格		1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200	1.01 mm	现场可编程门阵列		FPGA - 60K Logic Modules	56520	1 Core	256KB	11 mm	11 mm
M2S025T-VF400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA	YES	400-VFBGA (17x17)	400	ARM Cortex M3	27696 LE	有	2308 LAB	90	微芯片技术	1.2000 V	1.14 V	1.26 V	207	Tray	M2S025	活跃	LFBGA, BGA400,20X20,32	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	85 °C	无	M2S025T-VF400	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.3		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	0 to 85 °C	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant			S-PBGA-B400	160	不合格		1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	160	1.51 mm	现场可编程门阵列	STD	FPGA - 25K Logic Modules	23988	1 Core	256KB	17 mm	17 mm
M2S010-VF256I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-256	YES	256-FPBGA (14x14)	256	ARM Cortex M3	1007 LAB	微芯片技术	119	138	Tray	M2S010	活跃	LFBGA, BGA256,16X16,32	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA256,16X16,32	1.2 V	30	1.14 V	无	M2S010-VF256I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant			S-PBGA-B256	138	不合格		1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	138	1.56 mm	现场可编程门阵列		FPGA - 10K Logic Modules	12084	1 Core	256KB	14 mm	14 mm
M2S150-FCSG536I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	536-LFBGA, CSPBGA	536-CSPBGA (16x16)	ARM Cortex M3	微芯片技术	146124 LE	有	12177 LAB	90	293	Tray	M2S150	活跃				This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					FPGA - 150K Logic Modules		1 Core	512KB
M2S060-VFG400I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	400-LFBGA	YES	400-VFBGA (17x17)	400	ARM Cortex M3	4710 LAB	90	微芯片技术	SmartFusion2	1.2000 V	207	Tray	M2S060	活跃	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	40	1.14 V	有	M2S060-VFG400I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81	This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	56520 LE	有	-40 to 100 °C	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant			S-PBGA-B400	207	不合格		1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	207	1.51 mm	现场可编程门阵列	STD	FPGA - 60K Logic Modules	56520	1 Core	256KB	17 mm	17 mm
M2S050T-FCS325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	ARM Cortex M3	微芯片技术	200	Tray	M2S050	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	30	1.14 V	85 °C	无	M2S050T-FCS325	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81	This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	176	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN		CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant			S-PBGA-B325	200	不合格		1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200	1.01 mm	现场可编程门阵列		FPGA - 50K Logic Modules	56340	1 Core	256KB	11 mm	11 mm
M2S050-1FCSG325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325-FCBGA (11x11)	325	ARM Cortex M3	有	4695 LAB	微芯片技术	176	1.2000 V	200	Tray	M2S050	活跃	5.76	1.26 V	MICROSEMI CORP	活跃	SQUARE	TFBGA	M2S050-1FCSG325I	有	1.14 V	40	1.2 V	BGA325,21X21,20	PLASTIC/EPOXY	3	GRID ARRAY, THIN PROFILE, FINE PITCH	TFBGA, BGA325,21X21,20	This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	-40 to 100 °C	Tray	SmartFusion2	e1		3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant			S-PBGA-B325	200	不合格		1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200	1.01 mm	现场可编程门阵列	1	FPGA - 50K Logic Modules	56340	1 Core	256KB	11 mm	11 mm	无铅
M2S050T-1FG896	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-896	896-FBGA (31x31)	ARM Cortex M3	微芯片技术			This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	27	1.2000 V	1.14 V	1.26 V	377	Tray	M2S050	活跃		0 to 85 °C	Tray	SmartFusion2														896							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA				1	FPGA - 50K Logic Modules		1 Core	256KB
M2S060TS-1VF400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	400-LFBGA	400-VFBGA (17x17)	ARM Cortex M3	微芯片技术	This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	90	SmartFusion2	1.2 V	1.14 V	1.26 V	207	Tray	M2S060	活跃			0 to 85 °C	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA				1	FPGA - 60K Logic Modules		1 Core	256KB
M2S090-1FG676	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-676	YES	676-FBGA (27x27)	676	ARM Cortex M3	86316 LE	有	7193 LAB	微芯片技术	40	425	Tray	M2S090	活跃	FBGA-676	网格排列	3	PLASTIC/EPOXY	BGA676,26X26,40	1.2 V	30	1.14 V	85 °C	无	M2S090-1FG676	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.27		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant			S-PBGA-B676	425	不合格		1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	425	2.44 mm	现场可编程门阵列		FPGA - 90K Logic Modules	86316	1 Core	512KB	27 mm	27 mm
M2S010-VFG256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	256-LBGA	YES	256-FPBGA (17x17)	256	ARM Cortex M3	166 MHz	-	-	64 kB	12084 LE	138 I/O	0 C	微芯片技术	+ 85 C	有	1007 LAB	119	0.406091 oz	1.2000 V	Tray	M2S010	活跃	VFBGA-256	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA256,16X16,32	1.2 V	40	1.14 V	85 °C	有	M2S010-VFG256	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.77		This product may require additional documentation to export from the United States.	Details	SMD/SMT	0 to 85 °C	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant			S-PBGA-B256	138	不合格	1.2 V	1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	138	1.56 mm	现场可编程门阵列	STD	FPGA - 10K Logic Modules	12084	1 Core	256KB	14 mm	14 mm
M2S005-VF400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA	YES	400-VFBGA (17x17)	400	ARM Cortex M3	6060 LE	有	505 LAB	90	微芯片技术	1.2000 V	1.14 V	1.26 V	169	Tray	M2S005	活跃	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	85 °C	无	M2S005-VF400	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.3		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	0 to 85 °C	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant			S-PBGA-B400	160	不合格		1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	160	1.51 mm	现场可编程门阵列	STD	FPGA - 5K Logic Modules	4956	1 Core	128KB	17 mm	17 mm
M2S060-FCS325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	ARM Cortex M3	176	微芯片技术	SmartFusion2	200	Tray	M2S060	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	30	1.14 V	85 °C	无	M2S060-FCS325	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84	This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant			S-PBGA-B325	200	不合格		1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200	1.01 mm	现场可编程门阵列		FPGA - 60K Logic Modules	56520	1 Core	256KB	11 mm	11 mm
M2S025-1FCSG325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325-FCBGA (11x11)	325	ARM Cortex M3	有	2308 LAB	微芯片技术	176	8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/85	180	Tray	M2S025	活跃	BGA325,21X21,20	1.2 V	40	1.14 V	有	M2S025-1FCSG325I	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.78	PLASTIC/EPOXY	3	GRID ARRAY, THIN PROFILE, FINE PITCH	FBGA-325	This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant			S-PBGA-B325	180	不合格		1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	180	1.01 mm	现场可编程门阵列		FPGA - 25K Logic Modules	27696	1 Core	256KB	11 mm	11 mm
M2S005-1TQG144	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	TQFP-144	144-TQFP (20x20)	ARM Cortex M3	微芯片技术	SMD/SMT	166 MHz	-	-	0.046530 oz	60	505 LAB	有	6060 LE	64 kB	84	Tray	M2S005	活跃				This product may require additional documentation to export from the United States.	Details	0°C ~ 85°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	-	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					FPGA - 5K Logic Modules		1 Core	128KB
M2S005-1VF400I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	YES	400-VFBGA (17x17)	400	ARM Cortex M3	6060 LE	有	505 LAB	微芯片技术	90	1.14 V	1.26 V	169	Tray	M2S005	活跃	LFBGA, BGA400,20X20,32	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	无	M2S005-1VF400I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.86		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant			S-PBGA-B400	160	不合格		1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	160	1.51 mm	现场可编程门阵列	1	FPGA - 5K Logic Modules	4956	1 Core	128KB	17 mm	17 mm
M2S060TS-FGG676	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	676-BGA	676-FBGA (27x27)	ARM Cortex M3	微芯片技术	-	64 kB	56520 LE	有	4710 LAB	40	SmartFusion2	387	Tray	M2S060	活跃				This product may require additional documentation to export from the United States.	Details	166 MHz	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					FPGA - 60K Logic Modules		1 Core	256KB
M2S060T-FG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	56520 LE	有	4710 LAB	60	SmartFusion2	267	Tray	M2S060	活跃			This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					FPGA - 60K Logic Modules		1 Core	256KB
M2S025T-1FCSG325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FCBGA-325	325-FCBGA (11x11)	ARM Cortex M3	微芯片技术	64 kB	27696 LE	有	2308 LAB	176	180	Tray	M2S025	活跃			This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					FPGA - 25K Logic Modules		1 Core	256KB
M2S150TS-1FCVG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA	YES	484-FBGA (19x19)	484	ARM Cortex M3	84	微芯片技术	273	Tray	M2S150	活跃	VFBGA-484	GRID ARRAY, FINE PITCH	4	PLASTIC/EPOXY	1.2 V	40	1.14 V	85 °C	有	M2S150TS-1FCVG484	FBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1	无		Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01		BOTTOM	BALL	250	0.8 mm	compliant			S-PBGA-B484					OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		3.15 mm	现场可编程门阵列		FPGA - 150K Logic Modules		1 Core	512KB	19 mm	19 mm
M2S150-FCVG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA	484-FBGA (19x19)	ARM Cortex M3	微芯片技术	This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	84	1.2000 V	1.14 V	1.26 V	273	Tray	M2S150	活跃				0 to 85 °C	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA				STD	FPGA - 150K Logic Modules		1 Core	512KB
M2S060T-1FGG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	56520 LE	有	4710 LAB	60	SmartFusion2	267	Tray	M2S060	活跃			This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	0°C ~ 85°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					FPGA - 60K Logic Modules		1 Core	256KB
M2S025TS-1FCS325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325-FCBGA (11x11)	325	ARM Cortex M3	2308 LAB	微芯片技术	176	180	Tray	M2S025	活跃	TFBGA, BGA325,21X21,20	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	30	1.14 V	85 °C	无	M2S025TS-1FCS325	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.88	This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	有	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant			S-PBGA-B325	180	不合格		1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	180	1.01 mm	现场可编程门阵列		FPGA - 25K Logic Modules	27696	1 Core	256KB	11 mm	11 mm
M2S060TS-1VFG400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA	YES	400-VFBGA (17x17)	400	ARM Cortex M3	4710 LAB	90	微芯片技术	SmartFusion2	207	Tray	M2S060	活跃	LFBGA, BGA400,20X20,32	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	1.14 V	85 °C	有	M2S060TS-1VFG400	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81		This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	56520 LE	有	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant	40		S-PBGA-B400	207	不合格		1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	207	1.51 mm	现场可编程门阵列		FPGA - 60K Logic Modules	56520	1 Core	256KB	17 mm	17 mm
M2S010TS-VF400I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 1 month ago)	VFPBGA-400	YES	400-VFBGA (17x17)	400	ARM Cortex M3	微芯片技术	90	195	Tray	M2S010	活跃	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	无	M2S010TS-VF400I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.88	This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)		8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant			S-PBGA-B400	195	不合格		1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	195	1.51 mm	现场可编程门阵列		FPGA - 10K Logic Modules	12084	1 Core	256KB	17 mm	17 mm