类别是'category.USB闪存驱动器' (1612)

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写入周期时间 - 字符、页面

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W25Q16DVZPIG TUBE
W25Q16DVZPIG TUBE
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

WSON EP

7

Synchronous

2M

8

24

Symmetrical

16M

NOR

EAR99

Compliant

10/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3.3|3

3.6

25

25

-40

85

Industrial

100000

表面贴装

0.73

6

5

8

Obsolete

8

Sectored

4Kbyte x 512

256byte

W25Q256FVFIG TUBE
W25Q256FVFIG TUBE
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

3|3.3

3.6

2.7 to 3.6

20

25

-40

85

Industrial

100000

表面贴装

2.31

7.49

10.31

16

SOP

SOIC

Gull-wing

Compliant

3A991.b.1.a

NOR

256M

Symmetrical

32

8

32M

Synchronous

7

400/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

Obsolete

16

Sectored

4Kbyte x 8192

256byte

W25Q64FWZPIG TRAY
W25Q64FWZPIG TRAY
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Serial (SPI, Dual SPI, Quad SPI)

1.65

1.8

1.95

1.65 to 1.95

20

25

-40

85

Industrial

100000

表面贴装

0.73

6

5

8

SON

WSON EP

No Lead

Compliant

3A991.b.1.a

NOR

64M

Symmetrical

Bottom|Top

24

8

8M

Synchronous

6

100/Chip

5/Page

Tube

Obsolete

8

Sectored

4Kbyte x 2048

256byte

W25N01GVZEIG TUBE
W25N01GVZEIG TUBE
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

Synchronous

7

0.01/Block

0.7/Page

Serial (SPI, Dual SPI, Quad SPI)

104

2.7

3|3.3

3.6

2.7 to 3.6

35

35

-40

85

Industrial

100000

表面贴装

0.73

8

6

8

SON

WSON EP

No Lead

8.1 x 6.1 x 0.75mm

2.7 V

WSON

+85 °C

-40 °C

3.6 V

Compliant

3A991.b.1.a

SLC NAND

1G

Symmetrical

32

8

128M

Tray

W25N

活跃

8

1Gbit

Sectored

128Kbyte x 1024

2Kbyte

0.75mm

6.1mm

8.1mm

W25Q16DVZPIG/REEL
W25Q16DVZPIG/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Compliant

EAR99

NOR

16M

Symmetrical

24

8

2M

Synchronous

7

10/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3.3|3

3.6

25

25

-40

85

Industrial

100000

Obsolete

Sectored

4Kbyte x 512

256byte

W25Q64FWSSIG TUBE
W25Q64FWSSIG TUBE
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Serial (SPI, Dual SPI, Quad SPI)

1.65

1.8

1.95

1.65 to 1.95

20

25

-40

85

Industrial

100000

表面贴装

1.8

5.28

5.28

8

SOP

SOIC

Gull-wing

Compliant

3A991.b.1.a

NOR

64M

Symmetrical

Top|Bottom

24

8

8M

Synchronous

6

100/Chip

5/Page

Tube

Obsolete

8

Sectored

4Kbyte x 2048

256byte

W25Q80BLUXIG/REEL
W25Q80BLUXIG/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

9

6/Chip

0.8/Page

Serial (SPI, Dual SPI, Quad SPI)

2.3

2.5|3.3

3.6

2.3 to 3.6

18

25

12

-40

85

Industrial

100000

表面贴装

0.53

3

2

8

SON

USON EP

No Lead

Compliant

EAR99

8542.32.00.71

NOR

8M

Symmetrical

Bottom|Top

24

8

1M

Synchronous

Obsolete

8

Sectored

4Kbyte x 256

256byte

W25Q128FVPIG/TRAY
W25Q128FVPIG/TRAY
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2.7

104

3|3.3

3.6

2.7 to 3.6

20

25

-40

85

Industrial

100000

表面贴装

0.73

6

5

8

SON

WSON EP

No Lead

Compliant

3A991.b.1.a

NOR

128M

Symmetrical

24

8

16M

Synchronous

7

200/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

Obsolete

8

Sectored

4Kbyte x 4096

256byte

W29N02GVSIAA/REEL
W29N02GVSIAA/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

3|3.3

3.6

2.7 to 3.6

35

35

-40

85

Industrial

100000

表面贴装

1

18.4

12

48

SOP

TSOP-I

Gull-wing

Compliant

3A991.b.1.a

Unknown

SLC NAND

2G

Symmetrical

29

8

256M

Asynchronous

25

0.01/Block

0.7/Page

Parallel

2.7

活跃

48

Sectored

128Kbyte x 2048

2Kbyte

K9F1208U0C-PCB0T00
K9F1208U0C-PCB0T00
Samsung Semiconductor 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Parallel

2.7

3.3

3.6

20

20

20

-10

125

Commercial

100000

表面贴装

1

18.4

12

48

SOP

TSOP-I

Gull-wing

Compliant

3A991.b.1.a

8542.32.00.71

NAND

512M

Symmetrical

26

8

64M

Asynchronous

0.003/Block

42(Min)

0.5

卷带

Obsolete

48

Sectored

512byte

K9F2G08R0A-JIB0000
K9F2G08R0A-JIB0000
Samsung Semiconductor 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Compliant

1.95

1.8

1.65

Parallel

Asynchronous

Symmetrical

2G

8542.32.00.71

Compliant

Obsolete

Sectored

K9F8G08U0M-PIB0T00
K9F8G08U0M-PIB0T00
Samsung Semiconductor 数据表

N/A

-

最小起订量: 1

最小包装量: 1

TSOP-I

Compliant

8542.32.00.71

8G

Symmetrical

Asynchronous

Parallel

2.7

3.3

3.6

表面贴装

1

18.4

12

48

Obsolete

48

Sectored

KLM8G2FE3B-B001000
KLM8G2FE3B-B001000
Samsung Semiconductor 数据表

N/A

-

最小起订量: 1

最小包装量: 1

64G

Synchronous

Serial e-MMC

1.7|2.7

1.8|3.3

1.95|3.6

表面贴装

0.68

11.5

13

153

FBGA

供应商未确认

Obsolete

153

Sectored

W25Q16DVSNIG/REEL
W25Q16DVSNIG/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Compliant

EAR99

NOR

16M

Symmetrical

24

8

2M

Synchronous

7

10/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3.3|3

3.6

25

25

-40

85

Industrial

100000

Obsolete

Sectored

4Kbyte x 512

256byte

W25Q32JWBYIM-T
W25Q32JWBYIM-T
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1.7 to 1.95

20

20

-40

85

Industrial

100000

表面贴装

0.33

12

WLCSP

Compliant

3A991.b.1.a

NOR

32M

Symmetrical

24

8

4M

Synchronous

6

50/Chip

5/Page

Serial (SPI, Dual SPI, Quad SPI)

1.7

133

1.8

1.95

Tube

活跃

12

Sectored

4Kbyte x 1024

256byte

W25Q128JVYIQ/REEL
W25Q128JVYIQ/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

25

-40

85

Industrial

100000

表面贴装

0.33

24

WLCSP

Compliant

3A991.b.1.a

NOR

128M

Symmetrical

24

8

16M

Synchronous

6

200/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3|3.3

3.6

2.7 to 3.6

25

Tube

活跃

24

Sectored

4Kbyte x 4096

256byte

W25Q16DVSNAG-E
W25Q16DVSNAG-E
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

30

25

-40

105

汽车

表面贴装

1.5(Max)

4(Max)

5(Max)

8

SOIC N

Compliant

EAR99

Unknown

NOR

16M

Symmetrical

24

8

2M

Synchronous

8

10/Chip

4/Page

Serial (SPI, Dual SPI, Quad SPI)

2.7

3|3.3

3.6

2.7 to 3.6

Obsolete

8

Sectored

4Kbyte x 512

256byte

W25X40CVUXAG-T
W25X40CVUXAG-T
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-40

105

汽车

100000

表面贴装

0.53

3

2

8

SON

USON EP

Compliant

EAR99

Unknown

4M

Symmetrical

24

8

512K

Synchronous

8

2/Chip

3/Page

Serial (SPI, Dual SPI)

2.6

3|3.3

3.6

12

15

活跃

8

Sectored

4Kbyte x 128

256byte

W25Q16JLZPIG/REEL
W25Q16JLZPIG/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

3.3|2.5

3.6

2.3 to 3.6

25

25

-40

85

Industrial

100000

表面贴装

0.73

6

5

8

WSON EP

Compliant

EAR99

NOR

16M

Symmetrical

24

8

2M

Synchronous

6

25/Chip

3/Page

Serial (SPI, Dual SPI, Quad SPI)

2.3

104

Tube

活跃

8

Sectored

4Kbyte x 512

256byte

W29N01HVSINA-T
W29N01HVSINA-T
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

3|3.3

3.6

2.7 to 3.6

35

35

-40

85

Industrial

100000

表面贴装

1

18.4

12

48

SOP

TSOP-I

Gull-wing

Compliant

3A991.b.1.a

SLC NAND

1G

Symmetrical

28

8

128M

Asynchronous

0.01/Block

0.7/Page

Parallel

2.7

40

活跃

48

Sectored

128Kbyte x 1024

2Kbyte

W29N08GZSIBA/TRAY
W29N08GZSIBA/TRAY
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

20

-40

85

Industrial

100000

表面贴装

1

18.4

12

48

TSOP-I

Compliant

3A991.b.1.a

Unknown

SLC NAND

8G

Symmetrical

31

8

1G

Asynchronous

0.01/Block

0.7/Page

Parallel

1.7

1.8

1.95

1.7 to 1.95

20

活跃

48

2Kbyte

W25Q16JVSNSQ
W25Q16JVSNSQ
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

8-SOIC (0.154, 3.90mm Width)

8-SOIC

Winbond Electronics

8542.32.00.71

Compliant

Tube

W25Q16

活跃

Non-Volatile

Unknown

-40°C ~ 125°C (TA)

SpiFlash®

Unconfirmed

FLASH - NOR

2.7V ~ 3.6V

16Mbit

133 MHz

6 ns

FLASH

SPI - Quad I/O

3ms

2M x 8

W25Q32JWXGIM/REEL
W25Q32JWXGIM/REEL
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

133

1.7

Serial (SPI, Dual SPI, Quad SPI)

5/Page

50/Chip

6

Synchronous

4M

8

24

Symmetrical

32M

NOR

3A991.b.1.a

Compliant

Industrial

100000

表面贴装

0.43

4

4

8

XSON EP

85

-40

20

20

1.7 to 1.95

1.95

1.8

Tube

活跃

8

Sectored

4Kbyte x 1024

256byte

W25Q16CVSNAG/TRAY
W25Q16CVSNAG/TRAY
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Serial (SPI, Dual SPI, Quad SPI)

2.7

3|3.3

3.6

2.7 to 3.6

18

15

-40

105

汽车

100000

表面贴装

1.5(Max)

4(Max)

5(Max)

8

SOP

SOIC

Gull-wing

Compliant

EAR99

Unknown

NOR

16M

Symmetrical

Bottom|Top

24

8

2M

Synchronous

7

10/Chip

3/Page

Obsolete

8

Sectored

4Kbyte x 512

256byte

W25Q128JVEIQ-S
W25Q128JVEIQ-S
Winbond Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Synchronous

6

200/Chip

3/Page

58nm

Serial (SPI, Dual SPI, Quad SPI)

133

2.7

3|3.3

3.6

2.7 to 3.6

25

25

-40

85

Industrial

100000

表面贴装

0.73

6

8

8

SON

WSON EP

No Lead

Winbond

Winbond

Compliant

3A991.b.1.a

NOR

128M

Symmetrical

24

8

16M

Tray|Tube

活跃

Memory & Data Storage

8

Sectored

NOR 闪存

4Kbyte x 4096

256byte

NOR 闪存