N/A

-

WiFi

+ 70 C

3.3 V

0 C

1

3.3 V

610 mA

Serial

285 mA

Silex Technology

Silex Technology

Details

802.11 a/b/g/n/ac, Bluetooth 5.0

12 mm x 16 mm x 1.5 mm

切割胶带

SX-PCEAC2

Wireless & RF Modules

2.4 GHz, 5 GHz

3.3 V

876 Mb/s

多协议模块

多协议模块

N/A

-

表面贴装

Module

Laird Connectivity Inc.

+ 85 C

3.3 V

- 40 C

3.3 V

SDIO, UART

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

802.11b/g/n

21 mm x 15.5 mm x 4 mm

-40°C ~ 85°C

-

2.97V ~ 3.63V

2.4GHz

3.3 V

-

54Mbps

CYW43439

802.11b/g/n, Bluetooth v5.2

18dBm

Bluetooth, WiFi

Integrated, Chip, MHF4

-94dBm

SDIO, UART

-

301mA

-

N/A

-

表面贴装

87-SMD Module

松下电子元器件

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

ENW-49

活跃

24 x 13 x 3.1mm

-40°C ~ 85°C (TA)

PAN9520

3V ~ 3.6V

3.3V

2.4GHz

4MB Flash, 128kB ROM, 320kB SRAM

150Mbps

ESP32-S2

802.11b/g/n

19.5dBm

WiFi

PCB Trace

-97dBm

ADC, DAC, GPIO, I²C, I²S, LCD, RMT, SPI, PWM, UART, USB

73mA ~ 76mA

175mA ~ 260mA

CCK, DSSS, OFDM

N/A

-

表面贴装

36-SMD Module

微芯片技术

- 40 C

50

2.7 V

I2C, SPI, UART

Microchip

Microchip Technology / Atmel

Tray

活跃

22.43 mm x 14.73 mm x 2 mm

U.FL

802.11 b/g/n

有

+ 85 C

3.6 V

-40°C ~ 85°C

Tray

ATWINC3400-MR210xA

Wireless & RF Modules

2.7V ~ 3.6V

2.4 GHz

1MB Flash, 256kB ROM, 708kB RAM

18.3 dBm

72.2Mbps

ATWINC3400

多协议模块

802.11b/g/n, Bluetooth v5.0

18.3dBm

Bluetooth, WiFi

Antenna Not Included, U.FL

-95dBm

I²C, SPI, UART

23.68mA ~ 63.9mA

23.68mA ~ 275mA

16-QAM, 64-QAM, BPSK, CCK, DBPSK, DSSS, DQPSK, GFSK, OFDM, QPSK

多协议模块

N/A

-

N/A

-

SMD模块

3 Mbps

表面贴装

47

1.8, 3.6 V

0.028/0.0326

N/A

-

GPIO, I2S, SDIO, UART

802.11az

+ 85 C

- 40 C

IW611HN

N/A

-

1

Quectel

Quectel

Quectel Wireless Solutions

N/A

-

N/A

-

表面贴装

33-SMD Module

微芯片技术

+ 70 C

4.2 V

- 20 C

88

3.3 V

SMD/SMT

UART, I2C

- 90 dBm, -92 dBm

Microchip

Microchip Technology / Atmel

Internal Antenna

Class 2

Tray

BM78

活跃

-

-20°C ~ 70°C

Tray

-

Wireless & RF Modules

3.3V ~ 4.2V

Unshielded

2.44 GHz

3.8 V

4MB Flash, 320kB ROM, 28kB SRAM

1.5 dBm

115.2kBaud

-

蓝牙模块

Bluetooth 5.0 + EDR

2.402 GHz to 2.48 GHz

2dBm

Bluetooth

Integrated, Chip

-92dBm

I²C, UART

37mA

43mA

-

蓝牙模块

Bluetooth Modules - 802.15.1

N/A

-

1 Mbps

表面贴装

Non-Compliant

1.8000, 3.6000, 2.1000, 3.6000 V

0.0105 A

N/A

-

1

Quectel

Quectel

Reel

Quectel Wireless Solutions

N/A

-

Quectel

-102 dBm

On Module

有

250

Quectel

Quectel

Tape & Reel (TR)

活跃

Pad

32 mm x 29 mm x 2.4 mm

+ 85 C

4.3 V

- 40 C

3.3 V

ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0

Reel

EC/EG21

-

UART/USB

33 dBm

10 Mbps

700/800/900/1800/2100/2600 MHz

LCC

Quectel Wireless Solutions

N/A

-

5 V

- 40 C

100

5 V

Serial

Silex Technology

Silex Technology

Details

WPA/WPA2

802.11 a/ac/b/g/n

55 mm x 30 mm x 9.25 mm

WiFi

+ 85 C

Bulk

SX-590

Wireless & RF Modules

5 V

WiFi模块

WiFi Modules - 802.11

N/A

-

表面贴装

34-SMD Module

EDAC Inc.

活跃

Bulk

-40°C ~ 85°C

*

2.2V ~ 4.2V

2.4GHz

1MB Flash

115.2kbps

-

Bluetooth v2.0 + EDR, Class 2

4dBm

Bluetooth

不包括天线

-

SPI, UART

-

-

-

N/A

-

N/A

-

Danaher Controls

HS35060083345

Hollowshaft

Hollow

-40 to 70 Degrees C

6 Pin Connector

5~26 VDC

Differential

5~26 VDC

有

IP67

Included

N/A

-

Danaher Controls

HS35060085205PS

Hollowshaft

Hollow

-40 to 70 Degrees C

6 Pin Connector

5~26 VDC

单端

5~26 VDC

有

IP67

Included

N/A

-

N/A

-

表面贴装

Module

Quectel

CE, CSA, IEC, UL

Cutler Hammer, Div of Eaton Co

无

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

SC20

活跃

JGX9100AAG

-35°C ~ 75°C

SC20

3.5V ~ 4.2V

910 A

2.4GHz, 5GHz

-

接地故障

150Mbps

-

802.11a/b/g/n, Bluetooth v2.1 + EDR, Bluetooth v3.0, Bluetooth v4.1, Bluetooth v4.2, BeiDou, Galileo, GLONASS, GPS, GNSS

-

Bluetooth, Cellular, Navigation, WiFi

不包括天线

-

ADC, GPIO, I²C, PCM, PWM, UART, USB

-

-

-

N/A

-

LCC

Compact NB-IoT Module

表面贴装

Industrial grade

QAD2021U

Siemens Building Technologies

无显示

-40 to 85 °C

Pipe Surface

1 kOhm Nickel RTD

94

Temperature

Industrial

N/A

-

MUVH1RP28K

Cutler Hammer, Div of Eaton Corp

N/A

-

Industrial grade

LCC

LTE Category 1 Module

表面贴装

-40 to 85 °C

Industrial

N/A

-

表面贴装

1932-BBGA, FCBGA

1932-FBGA, FC (45x45)

微芯片技术

Microchip

Microchip Technology / Atmel

Details

Tray

BM83

活跃

840

-90dBm

10.4dBm

56

0°C ~ 85°C (TJ)

Tray

Stratix® V GS

活跃

Wireless & RF Modules

0.82 V ~ 0.88 V

2.402GHz ~ 2.48GHz

5SGSED8

-

3Mbps

IS2083BM

695000

蓝牙模块

-

60968960

262400

11dBm

Bluetooth

PCB Trace

-90dBm

ADC, GPIO, I²S, JTAG, PWM, UART, USB

38.5mA ~ 49mA

22mA ~ 59mA

-

Bluetooth Modules - 802.15.1

N/A

-

通孔

Radial

Polyester, Metallized

250

Quectel

Quectel

Details

--

250V

160V

有

-40°C ~ 105°C

Bulk

MMR

0.728 L x 0.217 W (18.50mm x 5.50mm)

±10%

活跃

--

PC引脚

通用型

0.47µF

0.591 (15.00mm)

--

Quectel Wireless Solutions

0.512 (13.00mm)

--