N/A

-

表面贴装

600-BGA

YES

406

0°C~70°C TA

Tray

FLEX-10KA®

e0

Obsolete

3 (168 Hours)

600

3A991

锡铅

8542.39.00.01

3V~3.6V

BOTTOM

BALL

220

3.3V

1.27mm

compliant

30

EPF10K100

S-PBGA-B600

406

不合格

2.5/3.33.3V

0.8 ns

406

可加载 PLD

4992

24576

158000

624

REGISTERED

4

1.93mm

45mm

45mm

Non-RoHS Compliant

2666 In Stock

-

8 Weeks

表面贴装

表面贴装

1156-BBGA

1156

490

0°C~85°C TJ

Tray

2013

ECP3

e1

活跃

3 (168 Hours)

EAR99

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

1.14V~1.26V

BOTTOM

BALL

250

1.2V

1mm

30

LFE3-70

490

1.2V

570.6kB

18mA

552.5kB

现场可编程门阵列

67000

4526080

375MHz

8375

0.379 ns

1.75mm

35mm

35mm

无

ROHS3 Compliant

无铅

N/A

-

表面贴装

CSP

YES

281-CSP (10x10)

281

+ 70 C

SMD/SMT

250 MHz

微芯片技术

有

184

IGLOOe

1.575 V

Tray

AGL600

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

未说明

85 °C

无

AGL600V2-CS281

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

215 I/O

1.14 V

0 C

0°C ~ 70°C (TA)

Tray

AGL600V2

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

unknown

S-PBGA-B281

不合格

1.2 V to 1.5 V

OTHER

30 uA

13824 CLBS, 600000 GATES

1.05 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

0.71 mm

10 mm

10 mm

N/A

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

U1AFS250

活跃

This product may require additional documentation to export from the United States.

N

有

90

Fusion

114

Tray

-40°C ~ 100°C (TJ)

Tray

U1AFS250

1.425V ~ 1.575V

36864

250000

STD

N/A

-

表面贴装

TQFP-176

YES

176-TQFP (24x24)

176

SMD/SMT

269 MHz

有

微芯片技术

40

Actel

5.25 V

Tray

A42MX09

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX09-2TQG176

146 MHz

5.3

MICROSEMI CORP

活跃

SQUARE

LFQFP

Details

104 I/O

3 V

0 C

+ 70 C

0°C ~ 70°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

3.3 V, 5 V

COMMERCIAL

684 CLBS, 14000 GATES

1.6 mm

现场可编程门阵列

14000

1.8 ns

684

14000

1.4 mm

24 mm

24 mm

N/A

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

248 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

870 MHz

有

60

Actel

0.014110 oz

1.575 V

Tray

AX250

活跃

0°C ~ 70°C (TA)

Tray

AX250

1.425V ~ 1.575V

1.5 V

55296

250000

4224

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

0 C

+ 70 C

SMD/SMT

278 MHz

有

微芯片技术

90

Actel

0.014110 oz

Tray

A54SX32

活跃

2.75 V

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

2.5 V

30

70 °C

无

A54SX32A-1FG256

278 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

N

203 I/O

2.25 V

0°C ~ 70°C (TA)

Tray

A54SX32A

e0

TIN LEAD/TIN LEAD SILVER

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

203

不合格

2.5 V

2.5,2.5/5 V

COMMERCIAL

203

2880 CLBS, 48000 GATES

1.97 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

235 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.26 V

Tray

M1A3P600

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

70 °C

无

M1A3P600L-1FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

0°C ~ 85°C (TJ)

Tray

M1A3P600L

e0

锡铅

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

235

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

235

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

1

13824

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

+ 70 C

SMD/SMT

160 MHz

有

微芯片技术

66

Actel

0.062040 oz

5.25 V

Tray

A40MX02

活跃

QFP,

FLATPACK

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX02-1PQG100

92 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.29

Details

57 I/O

3 V

0 C

0°C ~ 70°C (TA)

Tray

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

3.3 V, 5 V

COMMERCIAL

295 CLBS, 3000 GATES

3.4 mm

现场可编程门阵列

3000

2.3 ns

295

3000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

2.25 V

- 40 C

+ 85 C

SMD/SMT

278 MHz

有

微芯片技术

60

Actel

0.046530 oz

2.75 V

活跃

A54SX08

Tray

1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

-40 °C

2.5 V

40

85 °C

有

A54SX08A-1TQG144I

278 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.25

Details

113 I/O

-40°C ~ 85°C (TA)

Tray

A54SX08A

e3

Matte Tin (Sn)

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

2.5 V

2.5,3.3/5 V

INDUSTRIAL

113

768 CLBS, 12000 GATES

1.6 mm

现场可编程门阵列

12000

768

1.1 ns

768

768

12000

1.4 mm

20 mm

20 mm

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

N

138 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

763 MHz

有

90

Actel

0.014110 oz

1.575 V

Tray

AX250

活跃

0°C ~ 70°C (TA)

Tray

AX250

1.425V ~ 1.575V

1.5 V

55296

250000

4224

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

This product may require additional documentation to export from the United States.

N

7000 LE

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1282.05 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

AFS600

活跃

0°C ~ 85°C (TJ)

Tray

AFS600

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

13.5 kB

110592

600000

1.28205 GHz

1

13824

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

248 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

763 MHz

微芯片技术

有

60

Actel

0.014110 oz

Tray

AX250

活跃

1.575 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

40

70 °C

有

AX250-1FGG484

763 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

0°C ~ 70°C (TA)

Tray

AX250

e1

Tin/Silver/Copper (Sn/Ag/Cu)

250000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

248

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

248

2816 CLBS, 250000 GATES

2.44 mm

现场可编程门阵列

55296

250000

4224

0.84 ns

2816

4224

250000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

PLCC-68

YES

68-PLCC (24.23x24.23)

68

+ 70 C

SMD/SMT

175 MHz

有

微芯片技术

19

Actel

0.171777 oz

5.25 V

Tray

A40MX04

活跃

ROHS COMPLIANT, PLASTIC, LCC-68

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX04-2PLG68

101 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.3

Details

57 I/O

3 V

0 C

0°C ~ 70°C (TA)

Tube

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

3.3 V, 5 V

COMMERCIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2 ns

547

6000

3.68 mm

24.23 mm

24.23 mm

N/A

-

表面贴装

VQFP

YES

80-VQFP (14x14)

80

+ 85 C

SMD/SMT

188 MHz

有

微芯片技术

90

Actel

5.5 V

Tray

A40MX02

活跃

1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-80

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

A40MX02-3VQG80I

109 MHz

TQFP

SQUARE

活跃

MICROSEMI CORP

5.3

Details

57 I/O

3 V

- 40 C

-40°C ~ 85°C (TA)

Tray

A40MX02

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

260

0.65 mm

compliant

S-PQFP-G80

不合格

3.3 V, 5 V

INDUSTRIAL

295 CLBS, 3000 GATES

1.2 mm

现场可编程门阵列

3000

1.7 ns

295

3000

1 mm

14 mm

14 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

This product may require additional documentation to export from the United States.

Details

11000 LE

154 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

微芯片技术

310 MHz

有

-

24

147456 bit

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P1000

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P1000-2PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

A3P1000

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

1.5 V

COMMERCIAL

8 mA

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

2

24576

1000000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

1.14 V

0 C

+ 70 C

SMD/SMT

526.32 MHz, 892.86 MHz

微芯片技术

有

90

IGLOOe

0.014110 oz

Tray

AGL600

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

85 °C

无

AGL600V2-FG256

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

177 I/O

0°C ~ 70°C (TA)

Tray

AGL600V2

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B256

不合格

1.2 V to 1.5 V

OTHER

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

+ 70 C

SMD/SMT

247 MHz

有

微芯片技术

16

Actel

0.239083 oz

Tray

A42MX09

活跃

5.25 V

5.29

MICROSEMI CORP

活跃

SQUARE

QCCJ

135 MHz

A42MX09-1PLG84

有

70 °C

40

3.3 V

PLASTIC/EPOXY

3

CHIP CARRIER

QCCJ,

Details

72 I/O

3 V

0 C

0°C ~ 70°C (TA)

Tube

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

3.3 V, 5 V

COMMERCIAL

684 CLBS, 14000 GATES

4.572 mm

现场可编程门阵列

14000

2.1 ns

684

14000

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

FBGA

YES

676-FBGA (27x27)

676

This product may require additional documentation to export from the United States.

Details

444 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

微芯片技术

有

40

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE1500

活跃

27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.5 V

40

70 °C

有

M1A3PE1500-1FGG676

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0 to 70 °C

Tray

M1A3PE1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

444

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

444

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1

38400

38400

1500000

1.73 mm

27 mm

27 mm

N/A

-

表面贴装

VQFP

YES

80-VQFP (14x14)

80

SMD/SMT

188 MHz

有

微芯片技术

90

Actel

Tray

A40MX04

活跃

5.25 V

TQFP,

FLATPACK, THIN PROFILE

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A40MX04-3VQG80

109 MHz

TQFP

SQUARE

活跃

MICROSEMI CORP

5.3

Details

69 I/O

3 V

0 C

+ 70 C

0°C ~ 70°C (TA)

Tray

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.65 mm

compliant

S-PQFP-G80

不合格

3.3 V, 5 V

COMMERCIAL

547 CLBS, 6000 GATES

1.2 mm

现场可编程门阵列

6000

1.7 ns

547

6000

1 mm

14 mm

14 mm

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

SMD/SMT

153 MHz

有

16

微芯片技术

Actel

0.239083 oz

5.25 V

72

Tray

A42MX16

活跃

PLASTIC, LCC-84

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

5 V

40

125 °C

有

A42MX16-PLG84A

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.53

Details

4.75 V

- 40 C

+ 125 C

-40°C ~ 125°C (TA)

Tube

A42MX16

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

5 V

AUTOMOTIVE

24000 GATES

4.57 mm

现场可编程门阵列

24000

STD

2.4 ns

24000

3.68 mm

29.31 mm

29.31 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

676

676-FBGA (27x27)

400.011771 mg

微芯片技术

A3PE1500

活跃

This product may require additional documentation to export from the United States.

Details

444 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

40

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

0 to 70 °C

Tray

A3PE1500

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

33.8 kB

276480

1500000

310 MHz

2

38400

1.73 mm

27 mm

27 mm

无

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

N

235 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P600-FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

M1A3P600

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

STD

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

A3P400

活跃

1.5000 V

1.425 V

1.575 V

0.014110 oz

ProASIC3

90

有

272 MHz

SMD/SMT

+ 70 C

0 C

1.425 V

178 I/O

N

This product may require additional documentation to export from the United States.

1.575 V

Tray

0 to 70 °C

Tray

A3P400

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

6.8 kB

55296

400000

272 MHz

1

9216

1.2 mm

17 mm

17 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

272 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.5000 V

Tray

A3PE600

活跃

1.575 V

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

无

A3PE600-1FG256

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

BGA,

This product may require additional documentation to export from the United States.

N

165 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0 to 70 °C

Tray

A3PE600

e0

TIN LEAD/TIN LEAD SILVER

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

272 MHz

1

13824

13824

600000

1.2 mm

17 mm

17 mm

无