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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	包装/外壳	表面安装	引脚数	供应商器件包装	终端数量					Core												厂商																																				操作温度	包装	系列	JESD-609代码	无铅代码	零件状态	ECCN 代码	类型	端子表面处理	最高工作温度	最小工作温度	HTS代码	电容量	子类别	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	频率	基本部件号	引脚数量	JESD-30代码	输出的数量	资历状况	工作电源电压	电源	温度等级	界面	内存大小	负载电容	内存大小	核心处理器	程序内存大小	连接方式	建筑学	输入数量	组织结构	座位高度-最大	可编程逻辑类型	核心架构	最高频率
MPFS095T-FCVG784E	Microchip Technology	数据表	2186 In Stock	1: ¥1,802.066434 10: ¥1,700.062677 100: ¥1,603.832708 500: ¥1,513.049726 查看所有的价格 -	最小起订量: 1 最小包装量: 1	FCVG-784	784-BGA	RV64GC, RV64IMAC	微芯片技术		This product may require additional documentation to export from the United States.	SMD/SMT	667 MHz, 667 MHz	16 kB, 4 x 32 kB	4 x 32 kB	-	93000 LE	276 I/O	0 C	+ 100 C	1	Tray	活跃				0°C ~ 100°C	Tray	PolarFire®																								1 V					-	857.6kB	RISC-V	DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA											FPGA - 93K Logic Modules			5 Core		128kB
MPFS250TLS-FCG1152I	Microchip Technology	数据表	2683 In Stock	1: ¥3,510.791583 10: ¥3,312.067532 100: ¥3,124.592010 500: ¥2,947.728312 查看所有的价格 -	最小起订量: 1 最小包装量: 1	BGA-1152	1152-FCBGA (35x35)	RV64GC, RV64IMAC	微芯片技术		This product may require additional documentation to export from the United States.	SMD/SMT	667 MHz, 667 MHz	16 kB, 4 x 32 kB	4 x 32 kB	-	254000 LE	372 I/O	- 40 C	+ 100 C	1	Tray	活跃				-40°C ~ 100°C	Tray	PolarFire™																								1 V					-	2.2MB	RISC-V	DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA											FPGA - 254K Logic Modules			5 Core		128kB
5ASTFD5K3F40I3N	ALTERA	数据表	10086 In Stock	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	YES	1517-FBGA (40x40)	1517	-40 °C	1.15 V	未说明	1.12 V	100 °C	有	5ASTFD5K3F40I3N	BGA	SQUARE	Intel Corporation		生命周期结束	INTEL CORP	1.18 V	5.29			MCU - 208, FPGA - 540	FBGA-1517	网格排列	PLASTIC/EPOXY		BGA1517,39X39,40	-40°C ~ 100°C (TJ)	Tray	Arria V ST	e1		活跃			Tin/Silver/Copper (Sn/Ag/Cu)			8542.39.00.01				BOTTOM	BALL	未说明	1 mm	compliant		5ASTFD5		S-PBGA-B1517	540				INDUSTRIAL			1.05GHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	540	17434 CLBS	2.7 mm	现场可编程门阵列							FPGA - 462K Logic Elements	17434	462000			--				40 mm	40 mm
5ASXBB3D4F40I5N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	YES	1517-FBGA (40x40)	1517	-40 °C	1.1 V	未说明	1.07 V	100 °C	有	5ASXBB3D4F40I5N	BGA	SQUARE	Intel Corporation		生命周期结束	INTEL CORP	1.13 V	5.27			MCU - 208, FPGA - 540	FBGA-1517	网格排列	PLASTIC/EPOXY		BGA1517,39X39,40	-40°C ~ 100°C (TJ)	Tray	Arria V SX	e1		活跃			Tin/Silver/Copper (Sn/Ag/Cu)							BOTTOM	BALL	未说明	1 mm	compliant		5ASXBB3		S-PBGA-B1517	540				INDUSTRIAL			800MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	540	13207 CLBS	2.7 mm	现场可编程门阵列							FPGA - 350K Logic Elements	13207	350000			--				40 mm	40 mm
5CSEBA5U23I7	ALTERA	数据表	2952 In Stock	1: ¥2,020.344613 10: ¥1,905.985486 100: ¥1,798.099511 500: ¥1,696.320294 查看所有的价格 -	最小起订量: 1 最小包装量: 1	672-FBGA	YES	672-UBGA (23x23)	672	5CSEBA5U23I7	FBGA	SQUARE	Intel Corporation	活跃	INTEL CORP		1.13 V	5.55			MCU - 181, FPGA - 145	FBGA, BGA672,28X28,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY		BGA672,28X28,32	1.1 V	未说明	1.07 V	无	-40°C ~ 100°C (TJ)	Tray	Cyclone® V SE			活跃						8542.39.00.01		现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	0.8 mm	compliant				S-PBGA-B672	145	不合格		1.1,1.2/3.3,2.5 V				800MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	145		1.85 mm	现场可编程门阵列							FPGA - 85K Logic Elements		85000			--				23 mm	23 mm
5CSEMA5U23C8N	ALTERA	数据表	2204 In Stock	1: ¥1,266.880851 10: ¥1,195.170617 100: ¥1,127.519450 500: ¥1,063.697591 查看所有的价格 -	最小起订量: 1 最小包装量: 1	672-FBGA	YES	672-UBGA (23x23)	672	1.07 V	85 °C	有	5CSEMA5U23C8N	FBGA	SQUARE	Intel Corporation	活跃		INTEL CORP	1.13 V	5.25			MCU - 181, FPGA - 145	FBGA, BGA672,28X28,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY		BGA672,28X28,32	1.1 V	未说明	0°C ~ 85°C (TJ)	Tray	Cyclone® V SE			活跃								现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	0.8 mm	compliant		5CSEMA5		S-PBGA-B672	145	不合格		1.1,1.2/3.3,2.5 V	OTHER			600MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	145		1.85 mm	现场可编程门阵列							FPGA - 85K Logic Elements		85000			--				23 mm	23 mm
5CSEBA5U23C8N	ALTERA	数据表	2663 In Stock	1: ¥1,213.568001 10: ¥1,144.875475 100: ¥1,080.071206 500: ¥1,018.935094 查看所有的价格 -	最小起订量: 1 最小包装量: 1	672-FBGA	YES	672-UBGA (23x23)	672	1.1 V	未说明	1.07 V	85 °C	有	5CSEBA5U23C8N	FBGA	SQUARE	Intel Corporation	活跃		FPGA - Field Programmable Gate Array Cyclone V SE dual -core ARM Cortex-A9	INTEL CORP	1.13 V	2			MCU - 181, FPGA - 145	FBGA, BGA672,28X28,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY		BGA672,28X28,32	0°C ~ 85°C (TJ)	Tray	Cyclone® V SE	e1		活跃			锡银铜			8542.39.00.01		现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	0.8 mm	compliant		5CSEBA5		S-PBGA-B672	145	不合格		1.1,1.2/3.3,2.5 V	OTHER			600MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	145		1.85 mm	现场可编程门阵列							FPGA - 85K Logic Elements		85000			--				23 mm	23 mm
5CSEMA6U23C6N	ALTERA	数据表	2106 In Stock	1: ¥2,538.412249 10: ¥2,394.728536 100: ¥2,259.177864 500: ¥2,131.299876 查看所有的价格 -	最小起订量: 1 最小包装量: 1	672-FBGA	YES	672-UBGA (23x23)	672	1.1 V	未说明	1.07 V	85 °C	有	5CSEMA6U23C6N	FBGA	SQUARE	Intel Corporation	活跃		FPGA - Field Programmable Gate Array Cyclone V SE dual -core ARM Cortex-A9	INTEL CORP	1.13 V	5.56			MCU - 181, FPGA - 145	FBGA, BGA672,28X28,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY		BGA672,28X28,32	0°C ~ 85°C (TJ)	Tray	Cyclone® V SE			活跃								现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	0.8 mm	compliant		5CSEMA6		S-PBGA-B672	145	不合格		1.1,1.2/3.3,2.5 V	OTHER			925MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	145		1.85 mm	现场可编程门阵列							FPGA - 110K Logic Elements		110000			--				23 mm	23 mm
5CSEBA5U23I7N	ALTERA	数据表	2668 In Stock	1: ¥1,837.970846 10: ¥1,733.934762 100: ¥1,635.787507 500: ¥1,543.195762 查看所有的价格 -	最小起订量: 1 最小包装量: 1	672-FBGA	YES	672	672-UBGA (23x23)	672		GRID ARRAY, FINE PITCH	3	PLASTIC/EPOXY	1.99	1.13 V	INTEL CORP	活跃	Intel Corporation	SQUARE	FBGA	622 MHz		5CSEBA5U23I7N	有	1.07 V	未说明	1.1 V	BGA672,28X28,32		MCU - 181, FPGA - 145	8542390000	Compliant	FBGA, BGA672,28X28,32	-40°C ~ 100°C (TJ)	Tray	Cyclone® V SE	e1		活跃	3A991		Tin/Silver/Copper (Sn/Ag/Cu)	100 °C	-40 °C	8542.39.00.01		现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	0.8 mm	compliant	800 MHz	5CSEBA5		S-PBGA-B672	145	不合格	1.13 V	1.1,1.2/3.3,2.5 V		CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	556.3 kB		800MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	145		1.85 mm	现场可编程门阵列	85000		ARM	800 MHz	32075	7	FPGA - 85K Logic Elements		85000			--				23 mm	23 mm	无铅
MPFS250T-1FCVG484T2	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA, FCBGA	484-FCBGA (19x19)	微芯片技术						MCU - 136, FPGA - 108	Tray	活跃	-40°C ~ 125°C (TJ)		-																													-	2.2MB	RISC-V	DMA, PCI, PWM		CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA											FPGA - 254K Logic Modules					128KB
M2S050-FGG896	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	896-BGA	896-FBGA (31x31)	微芯片技术	-	64 kB					10%	1.2000 V	377	Tray		M2S050	活跃	-	166 MHz	56340 LE	+ 85 C	0 C	SMD/SMT	0 to 85 °C		SmartFusion®2										1 uF										896				1.2 V					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA										STD	FPGA - 50K Logic Modules			1 Core		256KB		3.2 mm	3.2 x 2.5 x 2.79 mm
M2S025TS-1FGG484M	Microchip	数据表	2989 In Stock	1: ¥2,365.394991 10: ¥2,231.504712 100: ¥2,105.193122 500: ¥1,986.031247 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	484-FPBGA (23x23)	微芯片技术	-	166 MHz	27696 LE	SMD/SMT	-	64 kB				Compliant	267	Tray	M2S025		活跃	-55°C ~ 125°C (TJ)		SmartFusion®2																													166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA											FPGA - 25K Logic Modules			1 Core		256KB
M2S050T-1FGG896	Microchip	数据表	2917 In Stock	1: ¥2,058.213587 10: ¥1,941.710930 100: ¥1,831.802762 500: ¥1,728.115817 查看所有的价格 -	最小起订量: 1 最小包装量: 1	896-BGA	896-FBGA (31x31)	微芯片技术	M2S050		活跃	-	166 MHz	56340 LE	SMD/SMT	-	64 kB					1.2000 V	377	Tray	0 to 85 °C		SmartFusion®2																													166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA										1	FPGA - 50K Logic Modules			1 Core		256KB
M2S060TS-1FG484M	Microchip	数据表	2579 In Stock	1: ¥2,884.100643 10: ¥2,720.849667 100: ¥2,566.839309 500: ¥2,421.546514 查看所有的价格 -	最小起订量: 1 最小包装量: 1	BGA-484	YES	484-FPBGA (23x23)	484	- 55 C	60	SMD/SMT	4710 LAB	Microchip	Microchip Technology / Atmel	微芯片技术	SmartFusion2	-	64 kB	Tray	M2S060	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	-55 °C	1.2 V	30	1.14 V	125 °C	无	M2S060TS-1FG484M	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84			有	This product may require additional documentation to export from the United States.	-	1314 kbit		166 MHz	56520 LE	267 I/O	+ 125 C	0.326090 oz	-55°C ~ 125°C (TJ)	Tray	SmartFusion2	e0	有		3A001.A.2.C		Tin/Lead (Sn/Pb)			8542.39.00.01		SOC - Systems on a Chip		BOTTOM	BALL	240	1 mm	not_compliant				S-PBGA-B484			1.2 V		MILITARY			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA			2.44 mm	现场可编程门阵列		SoC FPGA			FPGA - 60K Logic Modules			1 Core		256KB	SoC FPGA	23 mm	23 mm
M2S005-FGG484	Microchip	数据表	61 In Stock	1: ¥150.128098 10: ¥141.630285 100: ¥133.613474 500: ¥126.050448 查看所有的价格 -	最小起订量: 1 最小包装量: 1	484-BGA	YES	484-FPBGA (23x23)	484	64 kB	微芯片技术	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	40	1.14 V	85 °C	有	M2S005-FGG484	BGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	2.39			1.2000 V	1.14 V	1.26 V	209		Tray	M2S005	活跃	-	166 MHz	6060 LE	+ 85 C	0 C	SMD/SMT	-	0 to 85 °C		SmartFusion®2	e1					Tin/Silver/Copper (Sn/Ag/Cu)			8542.39.00.01		现场可编程门阵列	CMOS	BOTTOM	BALL	250	1 mm	compliant				S-PBGA-B484	209	不合格	1.2 V	1.2 V	OTHER			166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	209		2.44 mm	现场可编程门阵列						STD	FPGA - 5K Logic Modules	6060	1 Core	128KB				23 mm	23 mm
M2S050-FG484	Microchip	数据表	2955 In Stock	1: ¥1,293.986068 10: ¥1,220.741576 100: ¥1,151.642989 500: ¥1,086.455652 查看所有的价格 -	最小起订量: 1 最小包装量: 1	484-BGA	484-FPBGA (23x23)	微芯片技术				1.2000 V	1.14 V	1.26 V	267		Tray	M2S050	活跃	-	166 MHz	56340 LE	SMD/SMT	-	64 kB		0 to 85 °C		SmartFusion®2																													166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA										STD	FPGA - 50K Logic Modules			1 Core		256KB
M2S005S-VFG400I	Microchip	数据表	48 In Stock	1: ¥352.481903 10: ¥332.530098 100: ¥313.707641 500: ¥295.950607 查看所有的价格 -	最小起订量: 1 最小包装量: 1	400-LFBGA	400-VFBGA (17x17)	微芯片技术	64 kB					169	Tray	M2S005	活跃		-	166 MHz	6060 LE	-	-40°C ~ 100°C (TJ)		SmartFusion®2																													166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA											FPGA - 5K Logic Modules			1 Core		128KB
M2S005S-TQG144I	Microchip	数据表	64 In Stock	1: ¥158.201413 10: ¥149.246615 100: ¥140.798695 500: ¥132.828955 查看所有的价格 -	最小起订量: 1 最小包装量: 1	TQFP-144	144-TQFP (20x20)	微芯片技术	6060 LE	0.046530 oz	60	SMD/SMT	505 LAB	Microchip	Microchip Technology / Atmel	Details	-	64 kB	84	Tray	M2S005	活跃					有	This product may require additional documentation to export from the United States.	-	166 MHz		-40°C ~ 100°C (TJ)	Tray	SmartFusion2											SOC - Systems on a Chip																		166MHz	64KB	ARM® Cortex®-M3	-	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						SoC FPGA					FPGA - 5K Logic Modules			1 Core		128KB	SoC FPGA
M2S010-TQG144	Microchip	数据表	2683 In Stock	1: ¥219.135015 10: ¥206.731147 100: ¥195.029385 500: ¥183.989988 查看所有的价格 -	最小起订量: 1 最小包装量: 1	144-LQFP	144-TQFP (20x20)	微芯片技术	Tray	M2S010	活跃		有	-	400 kbit	166 MHz	12084 LE	+ 85 C	0.035380 oz	0 C	60	SMD/SMT	1007 LAB	Microchip	Microchip Technology / Atmel	Details	-	64 kB					84	0°C ~ 85°C (TJ)	Tray	SmartFusion®2											SOC - Systems on a Chip													1.2 V					166MHz	64KB	ARM® Cortex®-M3	-	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						SoC FPGA					FPGA - 10K Logic Modules			1 Core		256KB	SoC FPGA
M2S010-TQ144I	Microchip	数据表	2689 In Stock	-	最小起订量: 1 最小包装量: 1	144-LQFP	YES	144-TQFP (20x20)	144	微芯片技术		SMD	38.4 MHz	表面贴装	84		Tray	Obsolete	TQFP-144	FLATPACK, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	QFP144,.87SQ,20	1.2 V	30	1.14 V	无	M2S010-TQ144I	LFQFP	SQUARE	Microsemi Corporation	Obsolete	MICROSEMI CORP	1.26 V	5.85		-40 to 85 °C		SmartFusion®2	e0				Temperature Compensated Crystal Oscillator (TCXO)	Tin/Lead (Sn/Pb)			8542.39.00.01		现场可编程门阵列	CMOS	QUAD	鸥翼	240	0.5 mm	not_compliant			4	S-PQFP-G144	84	不合格		1.2 V			10 pF	166MHz	64KB	ARM® Cortex®-M3	-		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	84		1.6 mm	现场可编程门阵列							FPGA - 10K Logic Modules		12084		削波正弦波	256KB				20 mm	20 mm
5ASXMB3E4F31I3N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	896-BBGA, FCBGA	YES	896-FBGA (31x31)	896		PLASTIC/EPOXY	BGA896,30X30,40	-40 °C	1.15 V	未说明	1.12 V	100 °C	有	5ASXMB3E4F31I3N	BGA	SQUARE		Intel Corporation	生命周期结束	INTEL CORP	1.18 V	5.28			MCU - 208, FPGA - 250	Compliant	BGA, BGA896,30X30,40	网格排列	-40°C ~ 100°C (TJ)	Tray	Arria V SX	e1		活跃			Tin/Silver/Copper (Sn/Ag/Cu)	100 °C	-40 °C	8542.39.00.01				BOTTOM	BALL	未说明	1 mm	compliant	800 MHz	5ASXMB3		S-PBGA-B896	540				INDUSTRIAL	EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB		800MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	540	13207 CLBS	2.7 mm	现场可编程门阵列			ARM				FPGA - 350K Logic Elements	13207	350000			--				31 mm	31 mm
5ASXBB5D4F35I5N	ALTERA	数据表	10 In Stock	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	YES	1152-FBGA (35x35)	1152	-40 °C	1.1 V	未说明	1.07 V	100 °C	有	5ASXBB5D4F35I5N	BGA	SQUARE	Intel Corporation		生命周期结束	INTEL CORP	1.13 V	5.27			MCU - 208, FPGA - 385	FBGA-1152	网格排列	PLASTIC/EPOXY		BGA1152,34X34,40	-40°C ~ 100°C (TJ)	Tray	Arria V SX	e1		活跃			Tin/Silver/Copper (Sn/Ag/Cu)							BOTTOM	BALL	未说明	1 mm	compliant		5ASXBB5		S-PBGA-B1152	385				INDUSTRIAL			800MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	385	17434 CLBS	2.7 mm	现场可编程门阵列							FPGA - 462K Logic Elements	17434	462000			--				35 mm	35 mm
M2S060T-1VFG400I	Microchip	数据表	2458 In Stock	1: ¥1,564.683447 10: ¥1,476.116462 100: ¥1,392.562699 500: ¥1,313.738396 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	400-LFBGA	YES	400	400-VFBGA (17x17)	400	微芯片技术	40	1.14 V	有	M2S060T-1VFG400I	LFBGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.81	1.2000 V	1.14 V	1.26 V	Compliant		207	Tray	M2S060	活跃	-	166 MHz	56520 LE	-	64 kB	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	-40 to 100 °C		SmartFusion®2	e1					Tin/Silver/Copper (Sn/Ag/Cu)	100 °C	-40 °C	8542.39.00.01		现场可编程门阵列	CMOS	BOTTOM	BALL	250	0.8 mm	compliant				S-PBGA-B400	207	不合格	1.2 V	1.2 V				166MHz	164.3 kB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	207		1.51 mm	现场可编程门阵列						1	FPGA - 60K Logic Modules		56520	1 Core	256KB			17 mm	17 mm
AGFA014R24B2E4F	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Molex				Bulk	121010	活跃	768			0°C ~ 100°C (TJ)		*																													1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA											FPGA - 1.4M Logic Elements					-
10AS016E3F29E2SG	ALTERA	数据表	522 In Stock	1: ¥6,853.918381 10: ¥6,465.960734 100: ¥6,099.962957 500: ¥5,754.682041 查看所有的价格 -	最小起订量: 1 最小包装量: 1	780-BBGA, FCBGA	YES	780-FBGA (29x29)	780	BGA780,28X28,40	0.9 V	未说明	0.87 V	100 °C	有	10AS016E3F29E2SG	BGA	SQUARE	Intel Corporation		活跃	INTEL CORP	0.93 V	1.97			Non-Compliant	288	BGA, BGA780,28X28,40	网格排列		PLASTIC/EPOXY	0°C ~ 100°C (TJ)	Tray	Arria 10 SX			活跃						8542.39.00.01		现场可编程门阵列	CMOS	BOTTOM	BALL	未说明	1 mm	compliant				S-PBGA-B780	288	不合格		0.9 V	OTHER			1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	288		3.35 mm	现场可编程门阵列							FPGA - 160K Logic Elements		160000			--				29 mm	29 mm