类别是'category.PLDs(可编程逻辑器件)' (2797)

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产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

表面安装

终端数量

JESD-609代码

无铅代码

ECCN 代码

端子表面处理

附加功能

HTS代码

包装方式

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

时间@峰值回流温度-最大值(s)

引脚数量

JESD-30代码

输出的数量

资历状况

温度等级

传播延迟

建筑学

输入数量

组织结构

座位高度-最大

可编程逻辑类型

输出功能

宏细胞数

JTAG BST

专用输入数量

系统内可编程

长度

宽度

EPM2210GF324I3N
EPM2210GF324I3N
Altera Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

324

BGA

BGA, BGA324,18X18,40

3

272

PLASTIC/EPOXY

BGA

BGA324,18X18,40

SQUARE

网格排列

1.89 V

1.71 V

1.8 V

Transferred

ALTERA CORP

e1

3A991.D

锡银铜

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

BOTTOM

BALL

245

1 mm

compliant

324

S-PBGA-B324

不合格

7 ns

0 DEDICATED INPUTS, 272 I/O

2.2 mm

闪存 PLD

MACROCELL

1700

YES

YES

19 mm

19 mm

EPM2210GF324I3N
EPM2210GF324I3N
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

324

INTEL CORP

19 X 19 MM, 1 MM PITCH, LEAD FREE, FBGA-324

172.4 MHz

272

100 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA324,18X18,40

SQUARE

网格排列

1.89 V

1.71 V

1.8 V

活跃

e1

3A991.D

锡银铜

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

BOTTOM

BALL

1 mm

compliant

S-PBGA-B324

272

不合格

7 ns

272

0 DEDICATED INPUTS, 272 I/O

2.2 mm

闪存 PLD

MACROCELL

1700

YES

YES

19 mm

19 mm

XCR3256XL-7.5PQG208I
XCR3256XL-7.5PQG208I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

208

160

85 °C

-40 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

3.6 V

2.7 V

3.3 V

Obsolete

XILINX INC

QFP

QFP-208

167 MHz

3

e3

哑光锡

8542.39.00.01

QUAD

鸥翼

0.5 mm

compliant

208

S-PQFP-G208

不合格

INDUSTRIAL

7.5 ns

160 I/O

4.1 mm

EE PLD

MACROCELL

28 mm

28 mm

PZ5128-S12A84
PZ5128-S12A84
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

84

63 MHz

64

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

5.25 V

4.75 V

5 V

Obsolete

NXP SEMICONDUCTORS

LCC

PEDESTAL, PLASTIC, SOT-189-3, LCC-84

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

84

S-PQCC-J84

不合格

COMMERCIAL

15 ns

2 DEDICATED INPUTS, 64 I/O

4.57 mm

EE PLD

MACROCELL

2

29.3116 mm

29.3116 mm

PZ5128-S12A84
PZ5128-S12A84
Philips Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

84

LDCC84,1.2SQ

SQUARE

CHIP CARRIER

5 V

Transferred

飞利浦半导体

QCCJ, LDCC84,1.2SQ

70 °C

PLASTIC/EPOXY

QCCJ

e0

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J84

不合格

COMMERCIAL

14.5 ns

EE PLD

128

YES

YES

PZ5128-S12A84
PZ5128-S12A84
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

84

SQUARE

LDCC84,1.2SQ

QCCJ

PLASTIC/EPOXY

Obsolete

XILINX INC

3

70 °C

5 V

CHIP CARRIER

e0

锡铅

YES

8542.39.00.01

QUAD

J BEND

225

1.27 mm

unknown

30

S-PQCC-J84

不合格

COMMERCIAL

14.5 ns

EE PLD

128

YES

YES

XH95216-10HQ208C
XH95216-10HQ208C
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

208

HFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

5 V

Obsolete

ADVANCED MICRO DEVICES INC

HEAT SINK, QFP-208

3

168

PLASTIC/EPOXY

e0

锡铅

QUAD

鸥翼

0.5 mm

compliant

S-PQFP-G208

不合格

0 DEDICATED INPUTS, 168 I/O

4.1 mm

MASK PLD

MACROCELL

28 mm

28 mm

XH95216-10HQ208C
XH95216-10HQ208C
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

208

168

PLASTIC/EPOXY

HFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

5 V

Transferred

XILINX INC

QFP

HEAT SINK, QFP-208

3

e0

锡铅

8542.39.00.01

QUAD

鸥翼

0.5 mm

compliant

208

S-PQFP-G208

不合格

0 DEDICATED INPUTS, 168 I/O

4.1 mm

MASK PLD

MACROCELL

28 mm

28 mm

EPM7064SQC100-7
EPM7064SQC100-7
Altera Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

100

Obsolete

ALTERA CORP

QFP

QFP, QFP100,.7X.9

125 MHz

3

64

70 °C

PLASTIC/EPOXY

QFP

QFP100,.7X.9

RECTANGULAR

FLATPACK

5.25 V

4.75 V

5 V

e0

锡铅

CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

8542.39.00.01

QUAD

鸥翼

220

0.65 mm

compliant

100

R-PQFP-G100

不合格

COMMERCIAL

7.5 ns

0 DEDICATED INPUTS, 64 I/O

3.65 mm

EE PLD

MACROCELL

64

NO

YES

20 mm

14 mm

PZ3320N8EB
PZ3320N8EB
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

256

PLASTIC

BGA

BGA256,20X20,50

SQUARE

网格排列

3.3 V

Obsolete

XILINX INC

3

85 °C

-40 °C

e0

锡铅

YES

8542.39.00.01

BOTTOM

BALL

225

1.27 mm

not_compliant

30

S-PBGA-B256

不合格

INDUSTRIAL

11 ns

可加载 PLD

320

YES

YES

PZ5064NS10BC-S
PZ5064NS10BC-S
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

Transferred

XILINX INC

TQFP-44

80 MHz

3

32

85 °C

-40 °C

PLASTIC

QFP

TQFP44,.47SQ,32

SQUARE

FLATPACK

5.5 V

4.5 V

5 V

YES

8542.39.00.01

TRAY

QUAD

鸥翼

240

0.8 mm

not_compliant

30

S-PQFP-G44

32

不合格

INDUSTRIAL

12 ns

PAL/PLA-TYPE

36

2 DEDICATED INPUTS, 32 I/O

EE PLD

64

YES

2

YES

10 mm

10 mm

PZ5064NS10BC-S
PZ5064NS10BC-S
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

活跃

ADVANCED MICRO DEVICES INC

TQFP-44

80 MHz

3

32

85 °C

-40 °C

PLASTIC

QFP

TQFP44,.47SQ,32

SQUARE

FLATPACK

5.5 V

4.5 V

5 V

YES

TRAY

QUAD

鸥翼

240

0.8 mm

compliant

30

S-PQFP-G44

32

不合格

INDUSTRIAL

12 ns

PAL/PLA-TYPE

36

2 DEDICATED INPUTS, 32 I/O

EE PLD

64

YES

2

YES

10 mm

10 mm

PZ3064AS10A44
PZ3064AS10A44
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

LDCC44,.7SQ

SQUARE

CHIP CARRIER

3.3 V

Obsolete

XILINX INC

3

70 °C

PLASTIC/EPOXY

QCCJ

e0

锡铅

YES

8542.39.00.01

QUAD

J BEND

225

1.27 mm

not_compliant

30

S-PQCC-J44

不合格

COMMERCIAL

11.5 ns

EE PLD

64

YES

YES

PZ3064AS10A44
PZ3064AS10A44
Philips Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

LDCC44,.7SQ

SQUARE

CHIP CARRIER

3.3 V

Transferred

飞利浦半导体

QCCJ, LDCC44,.7SQ

70 °C

PLASTIC/EPOXY

QCCJ

e0

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J44

不合格

COMMERCIAL

11.5 ns

EE PLD

64

YES

YES

AMPAL16R8BPC
AMPAL16R8BPC
Rochester Electronics LLC 数据表

N/A

-

最小起订量: 1

最小包装量: 1

活跃

ROCHESTER ELECTRONICS LLC

,

8542.39.00.01

未说明

unknown

未说明

OT PLD

PZ5064N12BP
PZ5064N12BP
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

100

ADVANCED MICRO DEVICES INC

67 MHz

3

64

85 °C

-40 °C

PLASTIC/EPOXY

QFP

TQFP100,.63SQ

SQUARE

FLATPACK

5.5 V

4.5 V

5 V

活跃

e0

锡铅

YES

QUAD

鸥翼

240

0.5 mm

not_compliant

30

S-PQFP-G100

64

不合格

INDUSTRIAL

14.5 ns

PAL/PLA-TYPE

68

2 DEDICATED INPUTS, 64 I/O

EE PLD

64

YES

2

YES

14 mm

14 mm

XC7354-10WC44I
XC7354-10WC44I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

Obsolete

XILINX INC

LCC

WQCCJ, LDCC44,.7SQ

76.9 MHz

1

25

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

WQCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER, WINDOW

5.5 V

4.5 V

5 V

e0

锡铅

54 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 2 EXTERNAL CLOCKS; 108 FLIP-FLOPS

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

44

S-CQCC-J44

不合格

INDUSTRIAL

22 ns

8 DEDICATED INPUTS, 25 I/O

4.826 mm

UV PLD

MACROCELL

54

NO

8

NO

16.51 mm

16.51 mm

PZ5064C10A44
PZ5064C10A44
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

77 MHz

32

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

5.25 V

4.75 V

5 V

Obsolete

NXP SEMICONDUCTORS

LCC

QCCJ,

64 MACROCELLS

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

44

S-PQCC-J44

不合格

COMMERCIAL

12.5 ns

2 DEDICATED INPUTS, 32 I/O

4.57 mm

EE PLD

MACROCELL

2

16.5862 mm

16.5862 mm

PZ5064C10A44
PZ5064C10A44
Philips Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

LDCC44,.7SQ

SQUARE

CHIP CARRIER

5 V

Transferred

飞利浦半导体

QCCJ, LDCC44,.7SQ

70 °C

PLASTIC/EPOXY

QCCJ

e0

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J44

不合格

COMMERCIAL

12.5 ns

EE PLD

64

YES

YES

PZ5064C10A44
PZ5064C10A44
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

80 MHz

3

32

70 °C

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

5.5 V

4.5 V

5 V

活跃

ADVANCED MICRO DEVICES INC

e0

锡铅

YES

QUAD

J BEND

225

1.27 mm

not_compliant

30

S-PQCC-J44

32

不合格

COMMERCIAL

12.5 ns

PAL/PLA-TYPE

36

2 DEDICATED INPUTS, 32 I/O

EE PLD

64

YES

2

YES

16.585 mm

16.585 mm

PZ3128-S15BP-T
PZ3128-S15BP-T
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

100

59 MHz

80

70 °C

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

3.63 V

2.97 V

3.3 V

Obsolete

XILINX INC

QFP

TFQFP,

128 MACROCELLS

8542.39.00.01

QUAD

鸥翼

0.5 mm

unknown

100

S-PQFP-G100

不合格

COMMERCIAL

17.5 ns

2 DEDICATED INPUTS, 80 I/O

1.2 mm

EE PLD

MACROCELL

2

14 mm

14 mm

PZ3064AS7A44
PZ3064AS7A44
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

QCCJ

SQUARE

CHIP CARRIER

3.6 V

3 V

3.3 V

Obsolete

NXP SEMICONDUCTORS

111 MHz

32

70 °C

PLASTIC/EPOXY

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J44

不合格

COMMERCIAL

9 ns

2 DEDICATED INPUTS, 32 I/O

4.57 mm

EE PLD

MACROCELL

2

16.5862 mm

16.5862 mm

PZ3064AS7A44
PZ3064AS7A44
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

LDCC44,.7SQ

SQUARE

CHIP CARRIER

3.3 V

Obsolete

XILINX INC

3

70 °C

PLASTIC/EPOXY

QCCJ

e0

锡铅

YES

8542.39.00.01

QUAD

J BEND

225

1.27 mm

not_compliant

30

S-PQCC-J44

不合格

COMMERCIAL

9 ns

EE PLD

64

YES

YES

XC9572XV-5CSG48C
XC9572XV-5CSG48C
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

48

Obsolete

XILINX INC

BGA

FBGA, BGA48,7X7,32

222 MHz

3

38

70 °C

PLASTIC/EPOXY

FBGA

BGA48,7X7,32

SQUARE

GRID ARRAY, FINE PITCH

2.62 V

2.37 V

2.5 V

e1

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

YES

8542.39.00.01

BOTTOM

BALL

260

0.8 mm

compliant

30

48

S-PBGA-B48

不合格

COMMERCIAL

5 ns

0 DEDICATED INPUTS, 38 I/O

1.8 mm

闪存 PLD

MACROCELL

72

YES

YES

7 mm

7 mm

PZ3064I15A84
PZ3064I15A84
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

84

PEDESTAL, PLASTIC, SOT-189-3, LCC-84

58 MHz

64

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

3.63 V

2.97 V

3.3 V

Obsolete

NXP SEMICONDUCTORS

LCC

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

84

S-PQCC-J84

不合格

INDUSTRIAL

17.5 ns

2 DEDICATED INPUTS, 64 I/O

4.57 mm

EE PLD

MACROCELL

2

29.3116 mm

29.3116 mm