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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 访问时间(最大) | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 页面尺寸 | 产品类别 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||||||||||||||||||||||||||||||||||||
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BR25L640FJ-WE2 | ROHM Semiconductor | 数据表 | 4916 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | Copper, Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2005 | e2 | yes | 不用于新设计 | 1 (Unlimited) | 8 | EAR99 | 锡铜 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 10 | BR25L640 | 8 | 5V | SPI, Serial | 64Kb 8K x 8 | 3mA | 5MHz | 70 ns | EEPROM | SPI | 8 | 5ms | 64 kb | 0.000002A | SPI | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1.65mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
CY7C026A-15AXI | Cypress Semiconductor Corp | 数据表 | 17 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | -40°C~85°C TA | Tray | 1997 | e3 | Obsolete | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | 4.5V~5.5V | QUAD | 260 | 1 | 5V | 0.5mm | 40 | CY7C026 | 100 | 5V | 5V | 256Kb 16K x 16 | 2 | 305mA | SRAM | Parallel | 16KX16 | 3-STATE | 16 | 15ns | 14b | 256 kb | 0.0015A | 15 ns | COMMON | Asynchronous | 16b | 2V | 1.6mm | 14mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
GD25Q16CTIG | GigaDevice Semiconductor (HK) Limited | 数据表 | 1000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 4 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | Non-Volatile | -40°C~85°C TA | Tube | 2016 | 活跃 | 3 (168 Hours) | 2.7V~3.6V | 16Mb 2M x 8 | 120MHz | FLASH | SPI - Quad I/O | 50μs, 2.4ms | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
BR93H86RF-WCE2 | ROHM Semiconductor | 数据表 | 2500 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 8-SOIC (0.173, 4.40mm Width) | YES | Non-Volatile | Automotive grade | -40°C~125°C TA | Cut Tape (CT) | Automotive, AEC-Q100 | 活跃 | 1 (Unlimited) | 8 | 2.7V~5.5V | DUAL | 未说明 | 1 | 4V | 1.27mm | 未说明 | R-PDSO-G8 | 不合格 | 5.5V | 2/5V | 2.7V | 16Kb 1K x 16 | SYNCHRONOUS | 1.25MHz | EEPROM | SPI | 1KX16 | 16 | 5ms | 0.000002A | 16384 bit | SERIAL | 3-WIRE | 1000000 Write/Erase Cycles | 10ms | 40 | SOFTWARE | 1.71mm | 5mm | 4.4mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
W25X10BVSNIG | Winbond Electronics | 数据表 | 5 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | SpiFlash® | Obsolete | 3 (168 Hours) | 8 | EAR99 | 2.7V~3.6V | DUAL | 1 | 3V | 1.27mm | 8 | 3.3V | 3.6V | 2.7V | SPI, Serial | 1Mb 128K x 8 | 16.5mA | 104MHz | 7 ns | FLASH | SPI | 1MX1 | 1 | 3ms | 24b | 1 Mb | 0.000005A | Synchronous | 1b | 2.7V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256B | 1.72mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
CY7C1041GE30-10BVXI | Cypress Semiconductor Corp | 数据表 | 42 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 48-VFBGA | YES | 48 | Volatile | -40°C~85°C TA | Tray | 2010 | 活跃 | 3 (168 Hours) | 48 | 3A991.B.2.A | 8542.32.00.41 | 3V~3.6V | BOTTOM | 1 | 3V | 0.75mm | CY7C1041 | 不合格 | 3.6V | 2.5/3.3V | 2.2V | 4Mb 256K x 16 | SRAM | Parallel | 256KX16 | 3-STATE | 16 | 10ns | 4194304 bit | 10 ns | COMMON | 1V | 1mm | 8mm | 6mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
CY7C1021CV33-10ZC | Cypress Semiconductor Corp | 数据表 | 304 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Volatile | 0°C~70°C TA | Tray | 2002 | e0 | Obsolete | 3 (168 Hours) | 44 | Tin/Lead (Sn/Pb) | 3V~3.6V | DUAL | 240 | 1 | 3.3V | 0.8mm | not_compliant | 10GHz | 30 | CY7C1021 | 44 | 不合格 | 3.3V | 3.63V | 2.97V | 1Mb 64K x 16 | 1 | 90mA | SRAM | Parallel | 3-STATE | 16 | 10ns | 16b | 1 Mb | 0.005A | COMMON | Asynchronous | 16b | 3V | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT45DB021E-MHN-Y | Adesto Technologies | 数据表 | 50 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | Gold | 表面贴装 | 表面贴装 | 8-UDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TC | Tray | 1997 | e4 | 活跃 | 1 (Unlimited) | 8 | 1.65V~3.6V | DUAL | 260 | 1 | 1.8V | 1.27mm | 未说明 | 8 | 不合格 | 3.6V | 1.65V | SPI, Serial | 2Mb 264Bytes x 1024 pages | 16mA | 70MHz | 8 ns | FLASH | SPI | 8b | 2MX1 | 1 | 8μs, 3ms | 22b | 2 Mb | Synchronous | 2.7V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256B | 0.6mm | 6mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 93LC66AT-I/STG | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 有 | 93LC66AT-I/STG | 2 MHz | 512 words | 3 V | TSSOP | RECTANGULAR | Microchip Technology Inc | 不推荐 | MICROCHIP TECHNOLOGY INC | 5.07 | SOIC | TSSOP, TSSOP8,.25 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 1 | 512 | PLASTIC/EPOXY | TSSOP8,.25 | -40 °C | 40 | 85 °C | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | EEPROMs | CMOS | DUAL | 鸥翼 | 260 | 1 | 0.65 mm | compliant | 8 | R-PDSO-G8 | 不合格 | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | SYNCHRONOUS | 0.002 mA | 512X8 | 1.2 mm | 8 | 0.000001 A | 4096 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 6 ms | 200 | SOFTWARE | 4.4 mm | 3 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24LCS21AT-I/SNG | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 0.1 MHz | 128 words | 3 V | SOP | RECTANGULAR | Microchip Technology Inc | 不推荐 | MICROCHIP TECHNOLOGY INC | 7.32 | SOIC | 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOIC-8 | 小概要 | 1 | 128 | PLASTIC/EPOXY | -40 °C | 40 | 85 °C | 有 | 24LCS21AT-I/SNG | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | CMOS | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | 不合格 | 5.5 V | INDUSTRIAL | 2.5 V | SYNCHRONOUS | 128X8 | 1.75 mm | 8 | 1024 bit | SERIAL | EEPROM | I2C | 10 ms | 4.9 mm | 3.9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT28C256E-35UM/883 | Atmel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 25C040XT-E/ST | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 5 V | 512 words | 3 MHz | 25C040XT-E/ST | 有 | 125 °C | 40 | -40 °C | TSSOP8,.25 | PLASTIC/EPOXY | 512 | 1 | 4.40 MM, PLASTIC, TSSOP-8 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SOIC | 5.38 | MICROCHIP TECHNOLOGY INC | 不推荐 | Microchip Technology Inc | RECTANGULAR | TSSOP | e3 | 有 | EAR99 | Matte Tin (Sn) | DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES | 8542.32.00.51 | EEPROMs | CMOS | DUAL | 鸥翼 | 260 | 1 | 0.65 mm | compliant | 8 | R-PDSO-G8 | 不合格 | 5.5 V | 5 V | AUTOMOTIVE | 4.5 V | SYNCHRONOUS | 0.005 mA | 512X8 | 1.2 mm | 8 | 0.000001 A | 4096 bit | SERIAL | EEPROM | SPI | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | 4.4 mm | 3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 25LC160BT-E/SNG | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 有 | 25LC160BT-E/SNG | 10 MHz | 2048 words | 5 V | SOP | RECTANGULAR | Microchip Technology Inc | 不推荐 | MICROCHIP TECHNOLOGY INC | 5.25 | SOIC | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | 小概要 | 1 | 2000 | PLASTIC/EPOXY | SOP8,.25 | -40 °C | 40 | 125 °C | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | EEPROMs | CMOS | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | 不合格 | 5.5 V | 3/5 V | AUTOMOTIVE | 2.5 V | SYNCHRONOUS | 0.006 mA | 2KX8 | 1.75 mm | 8 | 0.000005 A | 16384 bit | SERIAL | EEPROM | SPI | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | 4.9 mm | 3.9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 27C64-12ISO | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CAT28C16AWI-12T | ON Semiconductor | 数据表 | 2900 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 24-SOIC (0.295, 7.50mm Width) | 24 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2009 | e3 | Obsolete | 1 (Unlimited) | 24 | EAR99 | Tin (Sn) | 8542.32.00.51 | 4.5V~5.5V | DUAL | 未说明 | 1 | 5V | 1.27mm | 未说明 | CAT28C16A | 24 | 不合格 | 5V | 5V | 16Kb 2K x 8 | 35mA | ASYNCHRONOUS | 120ns | EEPROM | Parallel | 2KX8 | 8 | 5ms | 16 kb | 0.0001A | 5V | 100000 Write/Erase Cycles | 5ms | YES | NO | NO | 2.65mm | 15.4mm | 7.5mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
CY7C1471V25-133AXC | Cypress Semiconductor Corp | 数据表 | 2205 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | 0°C~70°C TA | Tray | 2004 | NoBL™ | e3 | yes | Obsolete | 3 (168 Hours) | 100 | 3A991.B.2.A | Matte Tin (Sn) | FLOW-THROUGH ARCHITECTURE | 2.375V~2.625V | QUAD | 260 | 1 | 2.5V | 0.65mm | 20 | CY7C1471 | 100 | 2.5V | 2.625V | 2.375V | 72Mb 2M x 36 | 4 | 305mA | 133MHz | 6.5ns | SRAM | Parallel | 2MX36 | 3-STATE | 36 | 21b | 72 Mb | COMMON | Synchronous | 36b | 2.38V | 1.6mm | 20mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 25AA640XT-I/ST | Microchip Technology | 数据表 | 31 In Stock | - | 最小起订量: 1 最小包装量: 1 | 5 Weeks | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2004 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 1000K ERASE/WRITE CYCLES; DATA RETENTION > 200 YEARS | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 25AA640 | 8 | 5.5V | 2/5V | SPI, Serial | 64Kb 8K x 8 | 5mA | 1MHz | 475 ns | EEPROM | SPI | 8 | 5ms | 64 kb | 0.000001A | SPI | 100000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
CY7C1470BV33-250BZXC | Cypress Semiconductor Corp | 数据表 | 22 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2004 | NoBL™ | e1 | 活跃 | 3 (168 Hours) | 165 | 3A991.B.2.A | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 3.135V~3.6V | BOTTOM | 260 | 1 | 3.3V | 1mm | 40 | CY7C1470 | 165 | 3.3V | 3.6V | 3.135V | 72Mb 2M x 36 | 4 | 500mA | 200MHz | 3ns | SRAM | Parallel | 2MX36 | 3-STATE | 36 | 21b | 72 Mb | COMMON | Synchronous | 36b | 17mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S-24C08DI-M5T1U5 | ABLIC U.S.A. Inc. | 数据表 | 70 In Stock | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | 表面贴装 | SC-74A, SOT-753 | YES | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | e3 | 活跃 | 1 (Unlimited) | 5 | TIN | IT ALSO OPERATES AT 0.4 MHZ AT 1.7 TO 5.5 V SUPPLY VOLTAGE | 1.7V~5.5V | DUAL | 未说明 | 1 | 5V | 0.95mm | 未说明 | R-PDSO-G5 | 5.5V | 2.5V | 8Kb 1K x 8 | SYNCHRONOUS | 1MHz | 500ns | EEPROM | I2C | 1KX8 | 8 | 5ms | 8192 bit | SERIAL | I2C | 5ms | 1.3mm | 2.9mm | 1.6mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 25AA160B-I/SNG | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 有 | 25AA160B-I/SNG | 10 MHz | 2048 words | 2.5 V | SOP | RECTANGULAR | Microchip Technology Inc | 不推荐 | MICROCHIP TECHNOLOGY INC | SOIC | 5.26 | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | 小概要 | 1 | 2000 | PLASTIC/EPOXY | SOP8,.25 | -40 °C | 40 | 85 °C | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | EEPROMs | CMOS | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | 不合格 | 5.5 V | 2/5 V | INDUSTRIAL | 1.8 V | SYNCHRONOUS | 0.006 mA | 2KX8 | 1.75 mm | 8 | 0.000001 A | 16384 bit | SERIAL | EEPROM | SPI | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | 4.9 mm | 3.9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8162Z18DGB-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA-119 | YES | 119 | 有 | 250 MHz | + 85 C | 3.6 V | - 40 C | 21 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | BGA, | 网格排列 | 1000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 5.5 ns | 85 °C | 有 | GS8162Z18DGB-250I | 1048576 words | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.26 | BGA | Tray | GS8162Z18DGB | 3A991.B.2.B | NBT Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | 119 | R-PBGA-B119 | 不合格 | 2.7 V | INDUSTRIAL | 2.3 V | 18 Mbit | SYNCHRONOUS | 230 mA, 250 mA | 5.5 ns | 1 M x 18 | 1.99 mm | 18 | SRAM | 18874368 bit | PARALLEL | ZBT SRAM | SRAM | 22 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 28C04A20-L | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | 5 V | QCCJ | RECTANGULAR | Microchip Technology Inc | Obsolete | MICROCHIP TECHNOLOGY INC | 5.89 | QFJ | PLASTIC, LCC-32 | CHIP CARRIER | 512 | PLASTIC/EPOXY | LDCC32,.5X.6 | 未说明 | 200 ns | 70 °C | 无 | 28C04A-20/L | 512 words | e0 | EAR99 | Tin/Lead (Sn/Pb) | 10K WRITE/ERASE ENDURANCE MIN; DATA RETENTION >200 YEARS | 8542.32.00.51 | EEPROMs | CMOS | QUAD | J BEND | 未说明 | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | 不合格 | 5.5 V | 5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.03 mA | 512X8 | 3-STATE | 3.56 mm | 8 | 0.0001 A | 4096 bit | PARALLEL | EEPROM | 5 V | 10000 Write/Erase Cycles | 1 ms | 200 | YES | NO | NO | 13.97 mm | 11.43 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MX25L1636EM2I-08G | Macronix | 数据表 | 18 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | 2017 | e3 | 不用于新设计 | 3 (168 Hours) | 8 | MATTE TIN (800) | IT ALSO CONFIGURED AS 16M X 1 | 2.7V~3.6V | DUAL | 260 | 1 | 3.3V | 1.27mm | 40 | R-PDSO-G8 | 不合格 | 3.6V | 3/3.3V | 2.7V | 16Mb 2M x 8 | SYNCHRONOUS | 133MHz | FLASH | SPI | 4MX4 | 4 | 300μs, 3ms | 0.00002A | 16777216 bit | SERIAL | 2.7V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 2 | 2.16mm | 5.28mm | 5.23mm | Non-RoHS Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST25VF020B-80-4C-Q3AE-T | Microchip Technology | 数据表 | 23 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-UFDFN Exposed Pad | 8 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2011 | SST25 | e3 | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) - annealed | 2.7V~3.6V | DUAL | 0.5mm | SST25VF020B | 不合格 | 3.3V | SPI, Serial | 2Mb 256K x 8 | 20mA | 80MHz | 6 ns | FLASH | SPI | 8b | 8 | 10μs | 1b | 2 Mb | 0.00002A | Synchronous | 8b | SPI | 100000 Write/Erase Cycles | 100 | HARDWARE/SOFTWARE | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
CY7C1361C-133AXCT | Cypress Semiconductor Corp | 数据表 | 1500 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2003 | e4 | yes | 活跃 | 3 (168 Hours) | 100 | 3A991.B.2.A | Nickel/Palladium/Gold (Ni/Pd/Au) | FLOW-THROUGH ARCHITECTURE | 3.135V~3.6V | QUAD | 260 | 1 | 3.3V | 0.65mm | 20 | CY7C1361 | 3.3V | 3.6V | 3.135V | 9Mb 256K x 36 | 4 | 250mA | 133MHz | 6.5ns | SRAM | Parallel | 256KX36 | 3-STATE | 36 | 18b | 9 Mb | COMMON | Synchronous | 36b | 1.6mm | 20mm | 无 | ROHS3 Compliant | 无铅 |
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