798 In Stock

-

10 Weeks

表面贴装

表面贴装

1156-BBGA, FCBGA

1155

440

0°C~85°C TJ

Tray

2008

Virtex®-6 HXT

e1

yes

活跃

4 (72 Hours)

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

0.95V~1.05V

BOTTOM

BALL

245

1V

30

XC6VHX380T

440

不合格

1V

3.4MB

现场可编程门阵列

382464

28311552

29880

1

5.08 ns

3.5mm

35mm

35mm

ROHS3 Compliant

23 In Stock

-

8 Weeks

表面贴装

256-LBGA

YES

179

0°C~85°C TJ

Tray

2014

Cyclone® IV E

活跃

3 (168 Hours)

256

8542.39.00.01

1.15V~1.25V

BOTTOM

BALL

1.2V

1mm

EP4CE10

S-PBGA-B256

179

不合格

1.21.2/3.32.5V

179

现场可编程门阵列

10320

423936

645

1.55mm

17mm

17mm

Non-RoHS Compliant

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

This product may require additional documentation to export from the United States.

Details

35000 LE

147 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

504 kbit

350 MHz

微芯片技术

3500 LAB

24

ProASIC3

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

M1A3PE3000

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

1.2 V

40

85 °C

有

M1A3PE3000L-1PQG208I

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.6

-40 to 85 °C

Tray

M1A3PE3000L

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.14V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

25 mA

700 Mb/s

147

75264 CLBS, 3000000 GATES

4.1 mm

现场可编程门阵列

516096

3000000

1

75264

75264

3000000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

Details

有

90

Fusion

119

Tray

U1AFS1500

-40°C ~ 100°C (TJ)

Tray

U1AFS1500

1.425V ~ 1.575V

276480

1500000

STD

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

324

324-FBGA (19x19)

400.011771 mg

324

0 C

+ 70 C

SMD/SMT

781.25 MHz

有

84

微芯片技术

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

A3PE3000

活跃

BGA, BGA324,18X18,40

网格排列

3

PLASTIC/EPOXY

BGA324,18X18,40

1.2 V

40

70 °C

有

A3PE3000L-FGG324

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

221 I/O

1.14 V

0 to 70 °C

Tray

A3PE3000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B324

221

不合格

1.5 V

1.2/1.5,1.2/3.3 V

COMMERCIAL

1.26 V

1.14 V

63 kB

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

781.25 MHz

STD

75264

75264

75264

3000000

1.25 mm

19 mm

19 mm

无

N/A

-

表面贴装

TQFP-176

YES

176-TQFP (24x24)

176

有

40

A54SX16

3

A54SX16P-1TQG176I

280 MHz

微芯片技术

MICROSEMI CORP

Details

147 I/O

3 V

Actel

Tray

活跃

3.6 V

1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-176

FLATPACK, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

QFP176,1.0SQ,20

-40 °C

3.3 V

40

85 °C

有

LFQFP

SQUARE

活跃

5.25

- 40 C

+ 85 C

SMD/SMT

280 MHz

-40°C ~ 85°C (TA)

Tray

A54SX16P

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

147

不合格

3.3 V, 5 V

3.3,3.3/5 V

INDUSTRIAL

147

1452 CLBS, 16000 GATES

1.6 mm

现场可编程门阵列

24000

1452

0.8 ns

1452

1452

16000

1.4 mm

24 mm

24 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

400-LFBGA

400

400-VFBGA (17x17)

微芯片技术

90

IGLOO2

有

Details

This product may require additional documentation to export from the United States.

207

Tray

M2GL050

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL050T

100 °C

-40 °C

1.14V ~ 2.625V

228.3 kB

56340

1869824

1

N/A

-

表面贴装

TQFP-176

YES

176-TQFP (24x24)

176

SMD/SMT

280 MHz

有

40

Actel

微芯片技术

3.6 V

Tray

A54SX16

活跃

LFQFP, QFP176,1.0SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP176,1.0SQ,20

3.3 V

40

70 °C

有

A54SX16-1TQG176

280 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.25

Details

147 I/O

3 V

0 C

+ 70 C

0°C ~ 70°C (TA)

Tray

A54SX16

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

147

不合格

3.3 V, 5 V

3.3,5 V

COMMERCIAL

147

1452 CLBS, 16000 GATES

1.6 mm

现场可编程门阵列

24000

1452

0.8 ns

1452

1452

16000

1.4 mm

24 mm

24 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (27X27)

484

40

Actel

0.014110 oz

0 C

2.25 V

360 I/O

微芯片技术

Details

Tray

A54SX72

活跃

2.75 V

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

2.5 V

40

70 °C

有

A54SX72A-2FGG484

294 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

+ 70 C

SMD/SMT

294 MHz

有

0°C ~ 70°C (TA)

Tray

A54SX72A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

360

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

360

6036 CLBS, 108000 GATES

2.44 mm

现场可编程门阵列

108000

6036

1.1 ns

6036

6036

108000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

有

310 MHz

SMD/SMT

+ 85 C

- 40 C

1.425 V

97 I/O

微芯片技术

N

This product may require additional documentation to export from the United States.

1.575 V

Tray

M1A3P1000

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1A3P1000-2FG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

0.014110 oz

ProASIC3

160

-40°C ~ 100°C (TJ)

Tray

M1A3P1000

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

2

24576

1000000

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

Details

235 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

有

60

微芯片技术

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

M1A3P600-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

-40 to 85 °C

Tray

M1A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

STD

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

SMD/SMT

1098.9 MHz

有

90

Fusion

微芯片技术

0.014110 oz

1.575 V

Tray

M7AFS600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

M7AFS600-FG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

N

119 I/O

1.425 V

- 40 C

+ 85 C

-40°C ~ 85°C (TA)

Tray

M7AFS600

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

600000 GATES

1.7 mm

现场可编程门阵列

110592

600000

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

N

172 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1098.9 MHz

有

60

Fusion

0.014110 oz

Tray

M7AFS600

活跃

1.575 V

-40°C ~ 85°C (TA)

Tray

M7AFS600

1.425V ~ 1.575V

1.5 V

110592

600000

STD

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

60

微芯片技术

ProASIC3

0.014110 oz

1.5000 V

Tray

M1A3P1000

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P1000-2FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

300 I/O

0 to 70 °C

Tray

M1A3P1000

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

COMMERCIAL

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

2

24576

1000000

23 mm

23 mm

N/A

-

表面贴装

240-BQFP

YES

183

0°C~85°C TJ

Tray

APEX-20KE®

e3

Obsolete

3 (168 Hours)

240

3A991

Matte Tin (Sn)

8542.39.00.01

1.71V~1.89V

QUAD

鸥翼

245

1.8V

0.5mm

compliant

40

EP20K100

S-PQFP-G240

175

不合格

1.81.8/3.3V

1.73 ns

175

可加载 PLD

4160

53248

263000

416

MACROCELL

4

4.1mm

32mm

32mm

符合RoHS标准

972 In Stock

• 1: ¥8,531.647069
• 10: ¥8,251.109355
• 25: ¥8,193.753083
• 50: ¥8,136.795511
查看所有的价格

-

11 Weeks

表面贴装

900-BBGA, FCBGA

304

-40°C~100°C TJ

Tray

Kintex® UltraScale+™

活跃

4 (72 Hours)

8542.39.00.01

0.825V~0.876V

未说明

未说明

现场可编程门阵列

355950

31641600

20340

ROHS3 Compliant

1350 In Stock

-

8 Weeks

表面贴装

表面贴装

256-LBGA

256

SRAM

211

-40°C~100°C TJ

Tray

2008

MachXO

e1

yes

活跃

3 (168 Hours)

256

EAR99

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

IT CAN ALSO OPERATE AT 2.5V AND 3.3V

8542.39.00.01

1.71V~3.465V

BOTTOM

BALL

260

1.8V

1mm

40

LCMXO1200

256

211

3.3V

21mA

21mA

4.4 ns

4.4 ns

闪存 PLD

1200

9421

550MHz

150

MACROCELL

600

7

1.55mm

17mm

17mm

无

ROHS3 Compliant

无铅

990 In Stock

-

10 Weeks

表面贴装

225-LFBGA, CSPBGA

YES

150

0°C~85°C TJ

Tray

2012

Spartan®-7

活跃

3 (168 Hours)

225

8542.39.00.01

0.95V~1.05V

BOTTOM

BALL

未说明

1V

未说明

S-PBGA-B225

202.5kB

现场可编程门阵列

23360

1658880

1825

1.05 ns

ROHS3 Compliant

N/A

-

FCBGA

YES

2007

e0

no

Discontinued

4 (72 Hours)

957

3A991.D

85°C

0°C

8542.39.00.01

BOTTOM

BALL

225

1.5V

1.27mm

30

957

S-PBGA-B957

684

1.5V

1.575V

1.51.5/3.33.3V

OTHER

216kB

820MHz

684

3584 CLBS, 3000000 GATES

现场可编程门阵列

6

28672

0.35 ns

3584

3000000

3.5mm

40mm

40mm

无

符合RoHS标准

N/A

-

表面贴装

324-BGA

YES

324-FBGA (19x19)

324

M1A3PE3000

活跃

BGA, BGA324,18X18,40

微芯片技术

网格排列

3

PLASTIC/EPOXY

BGA324,18X18,40

-40 °C

1.5 V

30

1.425 V

85 °C

无

M1A3PE3000-1FG324I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

有

84

ProASIC3

221

Tray

-40°C ~ 100°C (TJ)

Tray

M1A3PE3000

e0

锡铅银

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B324

221

不合格

1.5/3.3 V

INDUSTRIAL

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

19 mm

19 mm

N/A

-

表面贴装

324-BGA

YES

324-FBGA (19x19)

324

活跃

BGA, BGA324,18X18,40

微芯片技术

网格排列

3

PLASTIC/EPOXY

BGA324,18X18,40

1.5 V

30

1.425 V

70 °C

无

M1A3PE3000-2FG324

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

有

84

ProASIC3

221

Tray

M1A3PE3000

0°C ~ 85°C (TJ)

Tray

M1A3PE3000

e0

锡铅银

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B324

221

不合格

1.5/3.3 V

COMMERCIAL

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

19 mm

19 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

+ 70 C

0 C

1.425 V

177 I/O

N

This product may require additional documentation to export from the United States.

微芯片技术

ProASIC3

0.014110 oz

1.575 V

Tray

A3P600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P600-1FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

90

有

272 MHz

SMD/SMT

0°C ~ 85°C (TJ)

Tray

A3P600

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

有

160

微芯片技术

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3P1000

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1A3P1000-FG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

N

97 I/O

-40°C ~ 100°C (TJ)

Tray

M1A3P1000

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

STD

24576

1000000

13 mm

13 mm

N/A

-

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

SMD/SMT

231 MHz

有

160

微芯片技术

ProASIC3

0.014110 oz

1.575 V

Tray

M7A3P1000

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

M7A3P1000-FG144I

350 MHz

LBGA

SQUARE

不推荐

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

97 I/O

1.425 V

- 40 C

+ 85 C

-40°C ~ 100°C (TJ)

Tray

M7A3P1000

e0

Tin/Lead/Silver (Sn/Pb/Ag)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B144

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

18 kB

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

231 MHz

STD

24576

24576

1000000

1.05 mm

13 mm

13 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

N

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

90

微芯片技术

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

M1A3P1000

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P1000-2FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

M1A3P1000

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

2

24576

1000000

17 mm

17 mm