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产品型号	品牌	数据表	库存	价格(含增值税)	数量	触点镀层	底架	安装类型	包装/外壳	供应商器件包装	第一种连接器安装类型	第二个连接器安装类型								厂商							操作温度	包装	系列	尺寸/尺寸	容差	终止次数	温度系数	连接器类型	类型	电阻	定位的数量	最小工作温度	颜色	性别	功率(瓦特)	电容量	紧固类型	电压 - 供电	方向	入口保护	深度	样式	功能	输出的数量	接头数量	电压 - 输入（最大值）	输出类型	电压 - 输入（最小值）	失败率	引线间距	电路数量	镀层	速度	输出配置	内存大小	引线样式	输出电流	核心处理器	周边设备	连接方式	电压 - 输出（最小值/固定）	拓扑	电压 - 阈值	监测的电压数量	重置超时	频率开关	同步整流器	输入	比率-输入：输出	第一个连接器	第二个连接器	电压 - 输出（最大值）	差分 - 输入：输出	主要属性	特征
AGFB006R24C3E3V	Intel	数据表	799 In Stock	1: ¥36,906.704668 10: ¥35,693.137976 25: ¥35,445.022820 50: ¥35,198.632390 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Gold	Bulkhead, Front Side Nut, Jam Nut, Panel	-	-		Intel	Compliant	576	Tray	活跃			0°C ~ 100°C (TJ)	Bulk	Agilex F				Crimp		Crimp, Receptacle			66	175 °C	-65 °C			Female			Threaded	Straight	46.02 mm				66						Cadmium	1.4GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MPU, FPGA										FPGA - 573K Logic Elements	-			31.57 mm		无	抗环境干扰
AGFB006R24C2I3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-			Intel		576	Tray	活跃			-40°C ~ 100°C (TJ)		Agilex F																														1.4GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MPU, FPGA										FPGA - 573K Logic Elements	-
AGFA012R24C3E3V	Intel	数据表	924 In Stock	1: ¥54,617.524551 10: ¥52,821.590474 25: ¥52,454.409604 50: ¥52,089.781140 查看所有的价格 -	最小起订量: 1 最小包装量: 1	-	-				Intel			Non-Compliant	744	Tray	活跃	0°C ~ 100°C (TJ)		Agilex F																														1.4GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MPU, FPGA										FPGA - 1.2M Logic Elements	-
XCZU3EG-1SFVC784E	AMD	数据表	2576 In Stock	1: ¥3,868.616833 10: ¥3,649.638523 100: ¥3,443.055210 500: ¥3,248.165293 查看所有的价格 -	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)				AMD			252	Tray	XCZU3	活跃	0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																														500MHz, 600MHz, 1.2GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA										Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	-
XCZU47DR-L2FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)			Panduit Corp		Bulk	Obsolete	366			-40°C ~ 100°C (TJ)		*																														533MHz, 1.333GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU47DR-2FSVE1156E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	0805 (2012 Metric)	0805				KOA Speer Electronics, Inc.			Tape & Reel (TR)	RN732A	Obsolete	366	-55°C ~ 155°C		RN73	0.079 L x 0.049 W (2.00mm x 1.25mm)	±0.5%	2		±25ppm/°C			1.18 kOhms				Thin Film			0.1W, 1/10W															533MHz, 1.333GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-	Moisture Resistant	0.024 (0.60mm)
XCZU47DR-L2FFVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)				Molex			Bulk	505433	活跃	561	-40°C ~ 100°C (TJ)		*																														533MHz, 1.333GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU48DR-1FFVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)			Pulse Electronics		Bulk	Obsolete	366			-40°C ~ 100°C (TJ)		-																														500MHz, 1.2GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU46DR-2FSVH1760E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)				NXP USA Inc.			Tube	BLF6	活跃	574	0°C ~ 100°C (TJ)		*																														533MHz, 1.333GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU47DR-L2FFVE1156I	Xilinx	数据表	5000 In Stock	-	最小起订量: 1 最小包装量: 1	表面贴装	24-VFQFN Exposed Pad	24-QFN (4x4)	366			Skyworks Solutions Inc.			Tray	SI5330	Obsolete	350 MHz	-40°C ~ 85°C		-							Fanout Buffer (Distribution), Translator										1.71V ~ 3.63V			LVPECL								1		533MHz, 1.333GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA					CMOS, HSTL, LVTTL, SSTL	1:4			No/Yes	Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU48DR-L1FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)				Molex			Bulk	120084	活跃	366	-40°C ~ 100°C (TJ)		*																														500MHz, 1.2GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU48DR-L1FFVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)				TE Connectivity Deutsch 连接器			Bag	YDL68G	活跃	366	-40°C ~ 100°C (TJ)		*																														500MHz, 1.2GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU49DR-L1FSVF1760I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)				Molex			Bulk	073404	活跃	622	-40°C ~ 100°C (TJ)		*																														500MHz, 1.2GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU48DR-2FSVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)				Molex			Bulk	098853	活跃	561	-40°C ~ 100°C (TJ)		*																														533MHz, 1.333GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU49DR-1FFVF1760E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Surface Mount, MLCC	1206 (3216 Metric)	1760-FCBGA (42.5x42.5)			Vishay Vitramon		Tape & Reel (TR)	活跃	100V	622		-55°C ~ 150°C		GA	0.126 L x 0.063 W (3.20mm x 1.60mm)	±20%			X7R								汽车			0.18 µF											-	-		500MHz, 1.2GHz		256KB	-		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-	-	-		0.067 (1.70mm)		AEC-Q200
XCZU49DR-2FSVF1760E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	SC-74A, SOT-753	SOT-23-5			Analog Devices Inc./Maxim Integrated		Tape & Reel (TR)	MAX6307	Obsolete	622		0°C ~ 70°C (TA)		-							Multi-Voltage Supervisor													开路漏极或开路集电极										533MHz, 1.333GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	低电平有效			MCU, FPGA	4.1V, Adj	2	1ms Minimum							Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU43DR-L2FFVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Axial	Axial				TT Electronics/IRC			Cut Tape (CT)	SPP2UL	Discontinued at Digi-Key	561	-55°C ~ 200°C		SPP	0.169 Dia x 0.571 L (4.30mm x 14.50mm)	±5%	2		±300ppm/°C			6.8 Ohms				Wirewound			2W												-			533MHz, 1.333GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-	Fusible, Moisture Resistant, Safety, Weldable	-
XCZU43DR-2FSVE1156E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	16-WQFN Exposed Pad	16-TQFN (5x5)			Analog Devices Inc./Maxim Integrated		Tape & Reel (TR)	MAX5097	活跃	366		-40°C ~ 125°C (TJ)		-																					Step-Down	1		40V	Adjustable (Fixed)	5V				533MHz, 1.333GHz	Positive	256KB		600mA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		1.24V (3.3V)	巴克	MCU, FPGA				330kHz	无			11V		Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU48DR-L1FSVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)				Molex			Bulk	120066	活跃	561	-40°C ~ 100°C (TJ)		*																														500MHz, 1.2GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU48DR-L2FFVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)				Molex			Bulk	055935	活跃	561	-40°C ~ 100°C (TJ)		*																														533MHz, 1.333GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU43DR-L2FSVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		1517-BBGA, FCBGA	1517-FCBGA (40x40)	面板安装	Free Hanging (In-Line)	Female	Bag	50 Ohms	Q-1S05D0	Bulkhead - Front Side Nut	活跃	Female	Amphenol Custom Cable	3 GHz	-	RG-58	561			-		-											Black						-		N-Type to Fakra											533MHz, 1.333GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA							N-Type Jack, Right Angle	Fakra Jack, Right Angle			Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-	Shielded	36.00 (914.40mm)
XCZU43DR-L1FFVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Axial	Axial				Vishay Dale			Tape & Reel (TR)	RLR20	活跃	561	-65°C ~ 150°C		Military, MIL-PRF-39017/02, RLR20	0.138 Dia x 0.375 L (3.51mm x 9.53mm)	±2%	2		±100ppm/°C			1.6 kOhms				Metal Film			0.5W, 1/2W												M (1%)			500MHz, 1.2GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-	Military, Moisture Resistant, Weldable	-
XCZU43DR-2FSVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)			Vishay Vitramon		Bulk	Obsolete	561			-40°C ~ 100°C (TJ)		*																														533MHz, 1.333GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU48DR-1FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)				Molex			Bulk	121055	活跃	366	-40°C ~ 100°C (TJ)		*																														500MHz, 1.2GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU43DR-1FSVG1517E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1206 (3216 Metric)	1206				TT Electronics/IRC			Cut Tape (CT)	PFC-W1206	Discontinued at Digi-Key	561	-65°C ~ 150°C		PFC - Precision	0.126 L x 0.063 W (3.20mm x 1.60mm)	±0.1%	2		±25ppm/°C			2.49 kOhms				Thin Film			0.333W, 1/3W												-			500MHz, 1.2GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-	Anti-Sulfur, Moisture Resistant	0.028 (0.71mm)