类别是'category.片上系统(SoC)' (7720)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | Core | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 界面 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 建筑学 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 速度等级 | 主要属性 | 逻辑单元数 | 核数量 | 闪光大小 | 长度 | 宽度 | ||||||||||||||||||||||||||||||||||||||||||
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![]() | M2S060T-1VF400I | Microchip Technology | 数据表 | 2826 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | ARM Cortex M3 | 微芯片技术 | Tray | M2S060 | 活跃 | VFBGA-400 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 30 | 1.14 V | 无 | M2S060T-1VF400I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.87 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 56520 LE | 有 | 4710 LAB | 90 | SmartFusion2 | 207 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 207 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 17 mm | 17 mm | ||||||||||||||||||||
![]() | M2S090T-1FGG484M | Microchip Technology | 数据表 | 625 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 有 | 7193 LAB | 60 | 微芯片技术 | 267 | Tray | M2S090 | 活跃 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | -55 °C | 1.2 V | 40 | 1.14 V | 125 °C | 有 | M2S090T-1FGG484M | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.78 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 86316 LE | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | 现场可编程门阵列 | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 23 mm | 23 mm | ||||||||||||||||
![]() | M2S010TS-VF256I | Microchip Technology | 数据表 | 46 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | VFPBGA-256 | YES | 256-FPBGA (14x14) | 256 | ARM Cortex M3 | 微芯片技术 | Tray | M2S010 | 活跃 | VFBGA-256 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA256,16X16,32 | 1.2 V | 30 | 1.14 V | 无 | M2S010TS-VF256I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.87 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 12084 LE | 有 | 1007 LAB | 119 | 138 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B256 | 138 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 14 mm | 14 mm | |||||||||||||||||||
![]() | M2S025TS-FCSG325I | Microchip Technology | 数据表 | 22 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | ARM Cortex M3 | 微芯片技术 | 180 | Tray | M2S025 | 活跃 | FBGA-325 | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 40 | 1.14 V | 有 | M2S025TS-FCSG325I | TFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.81 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 176 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 180 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.01 mm | 现场可编程门阵列 | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 11 mm | 11 mm | ||||||||||||||||||
![]() | M2S050-1FCS325 | Microchip Technology | 数据表 | 2141 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | ARM Cortex M3 | 微芯片技术 | 200 | Tray | M2S050 | 活跃 | FBGA-325 | GRID ARRAY, THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S050-1FCS325 | TFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.81 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 56340 LE | 有 | 4695 LAB | 176 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | S-PBGA-B325 | 200 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | 现场可编程门阵列 | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 11 mm | 11 mm | |||||||||||||||||
![]() | M2S025T-VFG256 | Microchip Technology | 数据表 | 2322 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 256-LFBGA | YES | 256-FPBGA (14x14) | 256 | ARM Cortex M3 | 138 I/O | 0 C | + 85 C | 微芯片技术 | 有 | 2308 LAB | 119 | Tray | M2S025 | 活跃 | VFBGA-256 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA256,16X16,32 | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M2S025T-VFG256 | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.77 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 27696 LE | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B256 | 138 | 不合格 | 1.2 V | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | 现场可编程门阵列 | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 14 mm | 14 mm | ||||||||||||||
![]() | M2S025-1FGG484I | Microchip Technology | 数据表 | 2069 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | 64 kB | 27696 LE | 有 | 2308 LAB | 60 | 267 | Tray | M2S025 | 活跃 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025TS-1FCSG325 | Microchip Technology | 数据表 | 2144 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | FCBGA-325 | 325-FCBGA (11x11) | ARM Cortex M3 | 微芯片技术 | 有 | 2308 LAB | 176 | 180 | Tray | M2S025 | 活跃 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 27696 LE | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025TS-1VF256 | Microchip Technology | 数据表 | 2270 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | VFPBGA-256 | 256-FPBGA (14x14) | ARM Cortex M3 | 微芯片技术 | 有 | 2308 LAB | 119 | 138 | Tray | M2S025 | 活跃 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 27696 LE | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S005S-1FG484 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 505 LAB | 60 | 微芯片技术 | 209 | Tray | M2S005 | 活跃 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S005S-1FG484 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.87 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 6060 LE | 有 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 209 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 209 | 2.44 mm | 现场可编程门阵列 | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 23 mm | 23 mm | ||||||||||||||||||
![]() | M2S060TS-1FGG484I | Microchip Technology | 数据表 | 2607 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 484-BGA | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 4710 LAB | 60 | SmartFusion2 | 微芯片技术 | 0.418384 oz | 1.2000 V | 活跃 | M2S060 | Tray | 267 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 40 | 1.14 V | 有 | M2S060TS-1FGG484I | BGA | SQUARE | 活跃 | IC FPGA SOC 60K LUTS | MICROSEMI CORP | 1.26 V | 5.81 | This product may require additional documentation to export from the United States. | Details | 166 MHz | - | - | 64 kB | 56520 LE | 有 | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | 现场可编程门阵列 | 1 | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||
![]() | M2S060T-1VF400 | Microchip Technology | 数据表 | 2644 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | ARM Cortex M3 | 微芯片技术 | 207 | Tray | M2S060 | 活跃 | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 30 | GRID ARRAY, LOW PROFILE, FINE PITCH | VFBGA-400 | 5.88 | 1.26 V | MICROSEMI CORP | 活跃 | SQUARE | LFBGA | M2S060T-1VF400 | 无 | 85 °C | 1.14 V | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 56520 LE | 有 | 4710 LAB | 90 | SmartFusion2 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 207 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 17 mm | 17 mm | ||||||||||||||||||
![]() | M2S090T-FGG484 | Microchip Technology | 数据表 | 2220 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BGA | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | 7193 LAB | 60 | 267 | Tray | M2S090 | 活跃 | This product may require additional documentation to export from the United States. | Details | 166 MHz | - | - | 64 kB | 86316 LE | 有 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 90K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150TS-1FCV484 | Microchip Technology | 数据表 | 2078 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BFBGA | 484-FBGA (19x19) | ARM Cortex M3 | 微芯片技术 | 12177 LAB | 84 | 273 | Tray | M2S150 | 活跃 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 146124 LE | 有 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050T-1FG484I | Microchip Technology | 数据表 | 2975 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 56340 LE | 有 | 4695 LAB | 60 | 1.2000 V | 1.14 V | 1.26 V | 267 | Tray | M2S050 | 活跃 | -40 to 100 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 50K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090T-1FG484 | Microchip Technology | 数据表 | 2688 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | 64 kB | 86316 LE | 有 | 7193 LAB | 60 | 267 | Tray | M2S090 | 活跃 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 90K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090-FGG484I | Microchip Technology | 数据表 | 2916 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 86316 LE | 273 I/O | - 40 C | + 100 C | 有 | 7193 LAB | 60 | 0.766018 oz | 1.2000 V | Tray | M2S090 | 活跃 | -40 to 100 °C | Tray | SmartFusion2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 90K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060-1FG676 | Microchip Technology | 数据表 | 2953 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 676-BGA | YES | 676-FBGA (27x27) | 676 | ARM Cortex M3 | SmartFusion2 | 微芯片技术 | 活跃 | M2S060 | Tray | 387 | FBGA-676 | 网格排列 | 3 | PLASTIC/EPOXY | BGA676,26X26,40 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S060-1FG676 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.88 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 56520 LE | 有 | 4710 LAB | 40 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B676 | 387 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 387 | 2.44 mm | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 27 mm | 27 mm | |||||||||||||||||
![]() | M2S025-1VFG256 | Microchip Technology | 数据表 | 10 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | VFPBGA-256 | 256-FPBGA (17x17) | ARM Cortex M3 | 微芯片技术 | 有 | 2308 LAB | 119 | 138 | Tray | M2S025 | 活跃 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 27696 LE | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050TS-1VF400I | Microchip Technology | 数据表 | 2323 In Stock |
- | 最小起订量: 1 最小包装量: 1 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | ARM Cortex M3 | 微芯片技术 | Tray | M2S050 | 活跃 | VFBGA-400 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | 1.2 V | 30 | 1.14 V | 无 | M2S050TS-1VF400I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.84 | 90 | 4695 LAB | 有 | 56340 LE | 64 kB | - | - | 166 MHz | SMD/SMT | N | This product may require additional documentation to export from the United States. | 207 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1.51 mm | 现场可编程门阵列 | 1 | FPGA - 50K Logic Modules | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||
![]() | M2S090T-FG484I | Microchip Technology | 数据表 | 2764 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 60 | 微芯片技术 | 267 | Tray | M2S090 | 活跃 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 30 | 1.14 V | 无 | M2S090T-FG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.83 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 86316 LE | 有 | 7193 LAB | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | 现场可编程门阵列 | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 23 mm | 23 mm | ||||||||||||||||||||
![]() | M2S150-FC1152 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | ARM Cortex M3 | 1.2000 V | 微芯片技术 | 574 | Tray | M2S150 | 活跃 | FBGA-1152 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S150-FC1152 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.81 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 146124 LE | 有 | 12177 LAB | 24 | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | 现场可编程门阵列 | STD | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 35 mm | 35 mm | ||||||||||||||||||
![]() | M2S090TS-FCSG325I | Microchip Technology | 数据表 | 2263 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FCBGA-325 | YES | 325-FCBGA (11x13.5) | 325 | ARM Cortex M3 | 7193 LAB | 176 | 微芯片技术 | 1.2, 1.5, 1.8, 2.5, 3.3 V | 180 | Tray | M2S090 | 活跃 | FBGA-325 | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 40 | 1.14 V | 有 | M2S090TS-FCSG325I | TFBGA | RECTANGULAR | 活跃 | MICROSEMI CORP | 1.26 V | 5.8 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 86316 LE | 有 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | R-PBGA-B325 | 180 | 不合格 | 1.2 V | CAN/Ethernet/Serial | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.16 mm | 现场可编程门阵列 | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 13.5 mm | 11 mm | |||||||||||||||||
![]() | M2S060T-FG676I | Microchip Technology | 数据表 | 2772 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 676-BGA | 676-FBGA (27x27) | ARM Cortex M3 | 微芯片技术 | 4710 LAB | 40 | SmartFusion2 | 387 | Tray | M2S060 | 活跃 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 56520 LE | 有 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050TS-1VFG400 | Microchip Technology | 数据表 | 2952 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | VFPBGA-400 | 400-VFBGA (17x17) | ARM Cortex M3 | 微芯片技术 | 有 | 4695 LAB | 90 | 207 | Tray | M2S050 | 活跃 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 56340 LE | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 50K Logic Modules | 1 Core | 256KB |
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分类:Embedded - System On Chip (SoC)
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分类:Embedded - System On Chip (SoC)
2,163.640433
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1,773.842379
