类别是'category.片上系统(SoC)' (7720)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 供应商器件包装 | Core | 厂商 | 操作温度 | 包装 | 系列 | 类型 | 电压 - 供电 | Reach合规守则 | 频率 | 引脚数量 | 工作电源电压 | 通道数量 | 内存大小 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序存储器类型 | 程序内存大小 | 连接方式 | 输出功率 | 数据率 | 建筑学 | 数据总线宽度 | 使用的 IC/零件 | 议定书 | 频率范围 | 筛选水平 | 通信IC类型 | 功率 - 输出 | 无线电频率系列/标准 | 收发器数量 | 天线类型 | 敏感度 | ADC通道数量 | 主要属性 | 串行接口 | 接收电流 | 传输电流 | 调制 | 核数量 | 闪光大小 | ADC Resolution | 高度 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||
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![]() | XCZU19EG-1FFVC1760I4498 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FCBGA-1760 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 600 MHz, 667 MHz, 1.5 GHz | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | - | 1143450 LE | 512 I/O | - 40 C | + 100 C | 9.8 Mbit | 34.6 Mbit | 65340 LAB | 1 | Zynq UltraScale+ | This product may require additional documentation to export from the United States. | SMD/SMT | XCZU19EG | 0.85 V | - | 48 Transceiver | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU15EG-1FFVC900I4524 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FCBGA-900 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 600 MHz, 667 MHz, 1.5 GHz | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | - | 746550 LE | 204 I/O | - 40 C | + 100 C | 11.3 Mbit | 26.2 Mbit | 42660 LAB | 1 | Zynq UltraScale+ | Details | SMD/SMT | XCZU15EG | 0.85 V | - | 16 Transceiver | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU6CG-1FFVB1156E4825 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FCBGA-1156 | ARM Cortex A53, ARM Cortex R5 | 600 MHz, 1.5 GHz | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | - | 469446 LE | 328 I/O | 0 C | + 100 C | 6.9 Mbit | 25.1 Mbit | 26825.5 LAB | 1 | Zynq UltraScale+ | This product may require additional documentation to export from the United States. | SMD/SMT | XCZU6CG | 0.85 V | - | 24 Transceiver | 4 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XAZU4EV-1SFVC784Q4867 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FCBGA-784 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 500 MHz, 600 MHz, 1.2 GHz | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | - | 192150 LE | 252 I/O | - 40 C | + 125 C | 2.6 Mbit | 4.5 Mbit | 10980 LAB | 300 | Zynq | This product may require additional documentation to export from the United States. | SMD/SMT | XAZU4EV | 0.85 V | - | 4 Transceiver | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XA7Z010-1CLG400Q4835 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ARM Cortex A9 | 2800 LE | - | 2 x 32 kB | 2 x 32 kB | 667 MHz | Zynq | 750 | 2200 LAB | XA7Z010 | - | 2 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU2EG-L1SFVC784I4560 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FCBGA-784 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 600 MHz, 667 MHz, 1.5 GHz | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | - | 103320 LE | 252 I/O | - 40 C | + 100 C | 1.2 Mbit | 5.3 Mbit | 5904 LAB | 1 | Zynq UltraScale+ | This product may require additional documentation to export from the United States. | SMD/SMT | XCZU2EG | 720 mV/850 mV | - | 7 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7CG-L1FFVF1517I4560 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FCBGA-1517 | ARM Cortex A53, ARM Cortex R5 | 600 MHz, 1.5 GHz | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | - | 504000 LE | 464 I/O | - 40 C | + 100 C | 6.2 Mbit | 11 Mbit | 28800 LAB | 1 | Zynq UltraScale+ | This product may require additional documentation to export from the United States. | SMD/SMT | XCZU7CG | 720 mV/850 mV | - | 24 Transceiver | 4 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU17EG-L1FFVB1517I4560 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FCBGA-1517 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 926194 LE | 644 I/O | - 40 C | + 100 C | 8 Mbit | 28 Mbit | 52925.38 LAB | 1 | Zynq UltraScale+ | 2 x 32 kB, 4 x 32 kB | 600 MHz, 667 MHz, 1.5 GHz | SMD/SMT | This product may require additional documentation to export from the United States. | 2 x 32 kB, 4 x 32 kB | - | XCZU17EG | 720 mV/850 mV | - | 16 Transceiver | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4EV-1SFVC784I4879 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FCBGA-784 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 192150 LE | 252 I/O | 2.6 Mbit | 4.5 Mbit | 10980 LAB | 1 | Zynq UltraScale+ | This product may require additional documentation to export from the United States. | SMD/SMT | 600 MHz, 667 MHz, 1.5 GHz | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | - | XCZU4EV | - | 4 Transceiver | 7 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU5EV-1SFVC784I4863 | Xilinx | 数据表 | 54 In Stock | - | 最小起订量: 1 最小包装量: 1 | FCBGA-784 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 600 MHz, 667 MHz, 1.5 GHz | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | - | 256200 LE | 252 I/O | - 40 C | + 100 C | 3.5 Mbit | 5.1 Mbit | 14640 LAB | 1 | Zynq UltraScale+ | This product may require additional documentation to export from the United States. | SMD/SMT | XCZU15EG | 0.85 V | - | 4 Transceiver | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | UC200TGLAA-N06-MN0AA | Quectel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | Module | Quectel | Details | 100 | 无线通信模块 | 0.370377 oz | LCC | 表面贴装 | Tray | UC200 | Obsolete | - | 32 mm x 29 mm x 2.4 mm | + 75 C | 4.5 V | - 35 C | 3.4 V | ADC, I2C, PCM, SDIO, UART, USB 2.0 | Industrial grade | -35 to 75 °C | 切割胶带 | UC200T | UMTS/HSPA Module | 3.4V ~ 4.5V | 850MHz, 900MHz, 1.8GHz, 1.9GHz | 3.8 V | - | - | 21Mbps | - | EDGE, GPRS, GSM, HSPA+, LTE, UMTS, WCDMA | 2100/1900/850/900/850/900/1800/1900 MHz | Industrial | - | Cellular | 不包括天线 | - | ADC, I²C, PCM, SDIO, UART, USB | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | EM05EFA-512-SGAS | Quectel | 数据表 | 500 In Stock | - | 最小起订量: 1 最小包装量: 1 | 卡边缘 | Module | Quectel | USB 2.0 | Socket Mount | Tray | EM05 | 活跃 | Details | 100 | 无线通信模块 | 0.222931 oz | -40 to 85 °C | Reel | - | IoT/M2M-Optimized LTE Cat 4 M.2 Module | 3.135V ~ 4.4V | - | 3.6, 3 V | - | 150 Mbps | - | BeiDou, Galileo, GLONASS, GPS, GNSS, HSPA+, LTE, WCDMA | 700, 800, 900, 1800, 2100, 2600 MHz | Extended | - | Cellular, Navigation | 不包括天线 | -109.5 dBm | USB | 20mA | 20mA | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | DA14585-00T00AT2 | Dialog Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 有 | 5000 | , | DA14585-00T00AT2 | 活跃 | DIALOG SEMICONDUCTOR GMBH | 5.65 | Details | Reel | unknown | 电信电路 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS095T-1FCVG484I | Microchip Technology | 数据表 | 2339 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | 微芯片技术 | + 100 C | 1 | Tray | 活跃 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 93000 LE | 276 I/O | 0 C | -40°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS095TL-FCSG536E | Microchip Technology | 数据表 | 2876 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-536 | 536-LFBGA | RV64GC, RV64IMAC | 微芯片技术 | + 100 C | 1 | Tray | 活跃 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 93000 LE | 276 I/O | 0 C | 0°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS250TS-1FCVG784I | Microchip Technology | 数据表 | 2388 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-784 | 784-FCBGA (23x23) | RV64GC, RV64IMAC | 微芯片技术 | + 100 C | 1 | Tray | 活跃 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 254000 LE | 372 I/O | - 40 C | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS250TLS-FCVG784I | Microchip Technology | 数据表 | 2551 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-784 | 784-FCBGA (23x23) | RV64GC, RV64IMAC | 微芯片技术 | + 100 C | 1 | Tray | 活跃 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 254000 LE | 372 I/O | - 40 C | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS095TS-FCSG325I | Microchip Technology | 数据表 | 2029 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-325 | 325-LFBGA (11x14.5) | RV64GC, RV64IMAC | 微芯片技术 | + 100 C | 1 | Bulk | 活跃 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 93000 LE | 276 I/O | - 40 C | -40°C ~ 100°C | Tray | - | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU47DR-2FSVE1156I5112 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-1156 | ARM Cortex A53, ARM Cortex R5F | 1 | SMD/SMT | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 256 kB | 930300 LE | 394 I/O | - 40 C | + 100 C | 13 Mb | 53160 LAB | 850 mV | 16 Transceiver | 6 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IS2083BM-232 | Microchip Technology | 数据表 | 681 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA-82 | 8051 | 微芯片技术 | 3.2 V | - 40 C | + 85 C | 96 kB | SRAM | I2C, UART, USB | SMD/SMT | 19 I/O | 3000 | VFBGA | 2 Mbps | Class I/Class II | 表面贴装 | 4.2 V | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | IS2083 | 活跃 | Industrial grade | -40 to 85 °C | Reel | - | Bluetooth | 3.2V ~ 4.2V | 2.4GHz | 82 | 3.3 V | 2 | 16MB Flash, 512kB RAM, 832kB ROM | Flash | 2 MB | 9.5 dBm | 3Mbps | 8 bit | IS2083BM | Bluetooth v5.0 | Industrial | - | Bluetooth | 不包括天线 | - 90 dBm | 2 Channel | GPIO, I²C, I²S, PWM, UART, USB | - | - | 8DPSK, DQPSK, GFSK | 10 bit, 16 bit | 0.9 mm | 5.5 mm | 5.5 mm | |||||||||||||||||||||||||||||||||||
![]() | XCZU3EG-1SFVC784I5165 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-784 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 1 | SMD/SMT | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 256 kB | 154350 LE | 252 I/O | - 40 C | + 100 C | 1.8 Mb | 8820 LAB | 850 mV | 7 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-2MLIVFVC1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD 赛灵思 | + 110 C | 1 | 500 | Tray | 活跃 | Details | - 40 C | -40°C ~ 100°C (TJ) | Versal™ Prime | 800 mV | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1902-2MSEVIVA1596 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD 赛灵思 | + 110 C | 1 | 500 | Tray | 活跃 | Details | 0 C | 0°C ~ 100°C (TJ) | Versal™ AI Core | 800 mV | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU43DR-1FFVE1156I5082 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-1156 | ARM Cortex A53, ARM Cortex R5F | 1 | SMD/SMT | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 256 kB | 930300 LE | 386 I/O | - 40 C | + 100 C | 13 Mb | 53160 LAB | 850 mV | 16 Transceiver | 6 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1802-2HSIVIVA1596 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD 赛灵思 | + 110 C | 1 | 500 | Tray | 活跃 | Details | - 40 C | -40°C ~ 100°C (TJ) | Versal™ AI Core | 880 mV | 800MHz, 1.65GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - |
XCZU19EG-1FFVC1760I4498
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU15EG-1FFVC900I4524
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU6CG-1FFVB1156E4825
Xilinx
分类:Embedded - System On Chip (SoC)
XAZU4EV-1SFVC784Q4867
Xilinx
分类:Embedded - System On Chip (SoC)
XA7Z010-1CLG400Q4835
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU2EG-L1SFVC784I4560
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU7CG-L1FFVF1517I4560
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU17EG-L1FFVB1517I4560
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU4EV-1SFVC784I4879
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU5EV-1SFVC784I4863
Xilinx
分类:Embedded - System On Chip (SoC)
UC200TGLAA-N06-MN0AA
Quectel
分类:Embedded - System On Chip (SoC)
EM05EFA-512-SGAS
Quectel
分类:Embedded - System On Chip (SoC)
DA14585-00T00AT2
Dialog Semiconductor
分类:Embedded - System On Chip (SoC)
MPFS095T-1FCVG484I
Microchip Technology
分类:Embedded - System On Chip (SoC)
1,708.936606
MPFS095TL-FCSG536E
Microchip Technology
分类:Embedded - System On Chip (SoC)
1,403.828825
MPFS250TS-1FCVG784I
Microchip Technology
分类:Embedded - System On Chip (SoC)
3,788.754237
MPFS250TLS-FCVG784I
Microchip Technology
分类:Embedded - System On Chip (SoC)
3,477.704282
MPFS095TS-FCSG325I
Microchip Technology
分类:Embedded - System On Chip (SoC)
1,808.763210
XCZU47DR-2FSVE1156I5112
Xilinx
分类:Embedded - System On Chip (SoC)
IS2083BM-232
Microchip Technology
分类:Embedded - System On Chip (SoC)
XCZU3EG-1SFVC784I5165
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1802-2MLIVFVC1760
Xilinx
分类:Embedded - System On Chip (SoC)
XCVC1902-2MSEVIVA1596
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU43DR-1FFVE1156I5082
Xilinx
分类:Embedded - System On Chip (SoC)
XCVC1802-2HSIVIVA1596
Xilinx
分类:Embedded - System On Chip (SoC)
