类别是'category.片上系统(SoC)' (7720)

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XCVC1902-2LSEVSVD1760
XCVC1902-2LSEVSVD1760
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD 赛灵思

+ 110 C

1

692

Tray

活跃

Details

0 C

0°C ~ 100°C (TJ)

Versal™ AI Core

700 mV

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

XCZU49DR-2FSVF1760I5149
XCZU49DR-2FSVF1760I5149
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-1760

ARM Cortex A53, ARM Cortex R5F

SMD/SMT

2 x 32 kB, 2 x 32 kB

2 x 32 kB, 2 x 32 kB

256 kB

930300 LE

674 I/O

- 40 C

+ 100 C

13 Mb

53160 LAB

1

850 mV

16 Transceiver

6 Core

XCVM1802-1LSEVFVC1760
XCVM1802-1LSEVFVC1760
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD 赛灵思

活跃

Details

0 C

+ 100 C

1

500

0°C ~ 100°C (TJ)

700 mV

400MHz, 1GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

XCVM1802-2MSEVFVC1760
XCVM1802-2MSEVFVC1760
Xilinx 数据表

3000 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD 赛灵思

+ 110 C

1

活跃

Tray

500

Details

0 C

0°C ~ 100°C (TJ)

Versal™ Prime

800 mV

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

XCVC1902-2MLIVIVA1596
XCVC1902-2MLIVIVA1596
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1596-BFBGA, FCBGA

1596-FCBGA (40x40)

AMD 赛灵思

- 40 C

Details

500

Tray

活跃

1

+ 110 C

-40°C ~ 100°C (TJ)

Versal™ AI Core

800 mV

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

XCZU15EG-2FFVB1156E4498
XCZU15EG-2FFVB1156E4498
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-1156

ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2

1

42660 LAB

11.3 Mb

+ 100 C

0 C

353 I/O

746550 LE

256 kB

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

SMD/SMT

850 mV

24 Transceiver

7 Core

PIC32CX1025SG41100T-I/E5X
PIC32CX1025SG41100T-I/E5X
Microchip Technology 数据表

690 In Stock

-

最小起订量: 1

最小包装量: 1

TQFP-100

微芯片技术

活跃

EV06X38A

120 MHz

PIC32CX

81 I/O

3.63 V

1.71 V

Details

- 40 C

+ 85 C

CAN, Ethernet, USB

SMD/SMT

90

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

Reel

-

1.71 V to 3.63 V

Flash

1 MB

- 40 C to + 85 C

32 Channel

PIC32CX1025SG41100T-E/E5X
PIC32CX1025SG41100T-E/E5X
Microchip Technology 数据表

802 In Stock

-

最小起订量: 1

最小包装量: 1

TQFP-100

微芯片技术

活跃

EV06X38A

120 MHz

PIC32CX

81 I/O

3.63 V

1.71 V

Details

- 40 C

+ 125 C

CAN, Ethernet, USB

SMD/SMT

90

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

Reel

-

1.71 V to 3.63 V

Flash

1 MB

- 40 C to + 125 C

32 Channel

PIC32CX1025SG41100-E/E5X
PIC32CX1025SG41100-E/E5X
Microchip Technology 数据表

276 In Stock

-

最小起订量: 1

最小包装量: 1

TQFP-100

微芯片技术

活跃

EV06X38A

120 MHz

PIC32CX

81 I/O

3.63 V

1.71 V

Details

- 40 C

+ 125 C

CAN, Ethernet, USB

SMD/SMT

1000

Tray

Tray

-

1.71 V to 3.63 V

Flash

1 MB

- 40 C to + 125 C

32 Channel

PIC32CX1025SG41128T-E/Z2X
PIC32CX1025SG41128T-E/Z2X
Microchip Technology 数据表

923 In Stock

-

最小起订量: 1

最小包装量: 1

TQFP-128

微芯片技术

活跃

EV06X38A

120 MHz

PIC32CX

99 I/O

3.63 V

1.71 V

Details

- 40 C

+ 125 C

CAN, Ethernet, USB

SMD/SMT

1000

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

Reel

-

1.71 V to 3.63 V

Flash

1 MB

- 40 C to + 125 C

32 Channel

PIC32CX1025SG41128T-I/Z2X
PIC32CX1025SG41128T-I/Z2X
Microchip Technology 数据表

1173 In Stock

-

最小起订量: 1

最小包装量: 1

TQFP-128

微芯片技术

活跃

EV06X38A

120 MHz

PIC32CX

99 I/O

3.63 V

1.71 V

Details

- 40 C

+ 85 C

CAN, Ethernet, USB

SMD/SMT

1000

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

Reel

-

1.71 V to 3.63 V

Flash

1 MB

- 40 C to + 85 C

32 Channel

A2F200M3F-1FG484
A2F200M3F-1FG484
Microchip Technology 数据表

2308 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

64 kB

2000 LE

161 I/O

0 C

+ 85 C

有

-

60

SmartFusion

Tray

A2F200

活跃

N

SMD/SMT

100 MHz

-

-

0°C ~ 85°C (TJ)

Tray

A2F200

1 mA

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

256 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

200000

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

1 Core

256KB

A2F200M3F-1CSG288
A2F200M3F-1CSG288
Microchip Technology 数据表

48 In Stock

-

最小起订量: 1

最小包装量: 1

288-TFBGA, CSPBGA

YES

288-CSP (11x11)

288

ARM Cortex M3

A2F200

活跃

TFBGA, BGA288,21X21,20

微芯片技术

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA288,21X21,20

1.5 V

未说明

1.425 V

85 °C

有

A2F200M3F-1CSG288

100 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

Details

100 MHz

-

-

64 kB

2000 LE

有

-

176

SmartFusion

MCU - 31, FPGA - 78

Tray

0°C ~ 85°C (TJ)

Tray

A2F200

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B288

78

不合格

1.5,1.8,2.5,3.3 V

OTHER

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

256 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

78

4608 CLBS, 200000 GATES

1.05 mm

现场可编程门阵列

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

1 Core

200000

256KB

11 mm

11 mm

M2S090-FG676
M2S090-FG676
Microchip Technology 数据表

2000 In Stock

-

最小起订量: 1

最小包装量: 1

676-BGA

YES

676-FBGA (27x27)

676

ARM Cortex M3

Tray

M2S090

活跃

微芯片技术

FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

30

1.14 V

85 °C

无

M2S090-FG676

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.83

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

86316 LE

有

7193 LAB

40

1.2000 V

425

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B676

425

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

425

2.44 mm

现场可编程门阵列

STD

FPGA - 90K Logic Modules

86316

1 Core

512KB

27 mm

27 mm

M2S060-1FG484I
M2S060-1FG484I
Microchip Technology 数据表

2415 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

484-BGA

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

267

Tray

M2S060

活跃

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

60

SmartFusion2

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

M2S150TS-FCS536I
M2S150TS-FCS536I
Microchip Technology 数据表

2224 In Stock

-

最小起订量: 1

最小包装量: 1

536-LFBGA, CSPBGA

YES

536-CSPBGA (16x16)

536

ARM Cortex M3

微芯片技术

BGA,

网格排列

PLASTIC/EPOXY

1.2 V

30

1.14 V

无

M2S150TS-FCS536I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

146124 LE

有

12177 LAB

90

1.2000 V

293

Tray

M2S150

活跃

-40 to 100 °C

Tray

SmartFusion2

e0

无

Tin/Lead (Sn/Pb)

8542.39.00.01

BOTTOM

BALL

240

not_compliant

536

S-PBGA-B536

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

现场可编程门阵列

STD

FPGA - 150K Logic Modules

1 Core

512KB

M2S090T-FCS325
M2S090T-FCS325
Microchip Technology 数据表

2331 In Stock

-

最小起订量: 1

最小包装量: 1

325-TFBGA, FCBGA

YES

325-FCBGA (11x13.5)

325

ARM Cortex M3

FBGA-325

微芯片技术

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

85 °C

无

M2S090T-FCS325

TFBGA

RECTANGULAR

活跃

MICROSEMI CORP

1.26 V

5.83

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

86316 LE

有

7193 LAB

176

180

Tray

M2S090

活跃

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

R-PBGA-B325

180

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.16 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

13.5 mm

11 mm

M2S010-VFG400
M2S010-VFG400
Microchip Technology 数据表

170 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-400

400-VFBGA (17x17)

ARM Cortex M3

微芯片技术

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

233 I/O

0 C

+ 85 C

有

1007 LAB

90

0.034371 oz

1.26 V

1.14 V

Tray

M2S010

活跃

0°C ~ 85°C (TJ)

Tray

SmartFusion2

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 10K Logic Modules

1 Core

256KB

M2S060TS-VF400
M2S060TS-VF400
Microchip Technology 数据表

2563 In Stock

-

最小起订量: 1

最小包装量: 1

400-LFBGA

YES

400-VFBGA (17x17)

400

ARM Cortex M3

M2S060

活跃

微芯片技术

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

85 °C

5.87

1.26 V

MICROSEMI CORP

活跃

SQUARE

LFBGA

M2S060TS-VF400

无

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

90

SmartFusion2

207

Tray

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

207

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

207

1.51 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

17 mm

17 mm

M2S025-1VFG256
M2S025-1VFG256
Microchip Technology 数据表

10 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

VFPBGA-256

256-FPBGA (17x17)

ARM Cortex M3

微芯片技术

138

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

有

2308 LAB

119

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S050TS-1VF400I
M2S050TS-1VF400I
Microchip Technology 数据表

2323 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-400

YES

400-VFBGA (17x17)

400

ARM Cortex M3

微芯片技术

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

30

1.14 V

无

M2S050TS-1VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

90

4695 LAB

有

56340 LE

64 kB

-

-

166 MHz

SMD/SMT

N

This product may require additional documentation to export from the United States.

207

Tray

M2S050

活跃

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1.51 mm

现场可编程门阵列

1

FPGA - 50K Logic Modules

1 Core

256KB

17 mm

17 mm

M2S090T-FG484I
M2S090T-FG484I
Microchip Technology 数据表

2764 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

M2S090

活跃

微芯片技术

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

1.14 V

无

M2S090T-FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.83

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

有

7193 LAB

60

267

Tray

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

267

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

23 mm

23 mm

M2S150-FC1152
M2S150-FC1152
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

ARM Cortex M3

M2S150

活跃

微芯片技术

FBGA-1152

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

1.2 V

30

1.14 V

85 °C

无

M2S150-FC1152

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

146124 LE

有

12177 LAB

24

1.2000 V

574

Tray

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B1152

574

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

574

2.9 mm

现场可编程门阵列

STD

FPGA - 150K Logic Modules

146124

1 Core

512KB

35 mm

35 mm

M2S090TS-FCSG325I
M2S090TS-FCSG325I
Microchip Technology 数据表

2263 In Stock

-

最小起订量: 1

最小包装量: 1

FCBGA-325

YES

325-FCBGA (11x13.5)

325

ARM Cortex M3

180

Tray

M2S090

微芯片技术

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

40

1.14 V

有

M2S090TS-FCSG325I

TFBGA

RECTANGULAR

活跃

MICROSEMI CORP

1.26 V

5.8

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

有

7193 LAB

176

1.2, 1.5, 1.8, 2.5, 3.3 V

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

R-PBGA-B325

180

不合格

1.2 V

CAN/Ethernet/Serial

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.16 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

13.5 mm

11 mm

M2S060T-FG676I
M2S060T-FG676I
Microchip Technology 数据表

2772 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

676-BGA

676-FBGA (27x27)

ARM Cortex M3

微芯片技术

387

Tray

M2S060

活跃

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

40

SmartFusion2

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB