类别是'category.片上系统(SoC)' (7720)
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![]() | XCVC1902-2LSEVSVD1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD 赛灵思 | + 110 C | 1 | 692 | Tray | 活跃 | Details | 0 C | 0°C ~ 100°C (TJ) | Versal™ AI Core | 700 mV | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU49DR-2FSVF1760I5149 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-1760 | ARM Cortex A53, ARM Cortex R5F | SMD/SMT | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 256 kB | 930300 LE | 674 I/O | - 40 C | + 100 C | 13 Mb | 53160 LAB | 1 | 850 mV | 16 Transceiver | 6 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-1LSEVFVC1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD 赛灵思 | 活跃 | Details | 0 C | + 100 C | 1 | 500 | 0°C ~ 100°C (TJ) | 700 mV | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-2MSEVFVC1760 | Xilinx | 数据表 | 3000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD 赛灵思 | + 110 C | 1 | 活跃 | Tray | 500 | Details | 0 C | 0°C ~ 100°C (TJ) | Versal™ Prime | 800 mV | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1902-2MLIVIVA1596 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD 赛灵思 | - 40 C | Details | 500 | Tray | 活跃 | 1 | + 110 C | -40°C ~ 100°C (TJ) | Versal™ AI Core | 800 mV | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU15EG-2FFVB1156E4498 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-1156 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 1 | 42660 LAB | 11.3 Mb | + 100 C | 0 C | 353 I/O | 746550 LE | 256 kB | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | SMD/SMT | 850 mV | 24 Transceiver | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PIC32CX1025SG41100T-I/E5X | Microchip Technology | 数据表 | 690 In Stock |
- | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 微芯片技术 | 活跃 | EV06X38A | 120 MHz | PIC32CX | 81 I/O | 3.63 V | 1.71 V | Details | - 40 C | + 85 C | CAN, Ethernet, USB | SMD/SMT | 90 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Reel | - | 1.71 V to 3.63 V | Flash | 1 MB | - 40 C to + 85 C | 32 Channel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PIC32CX1025SG41100T-E/E5X | Microchip Technology | 数据表 | 802 In Stock |
- | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 微芯片技术 | 活跃 | EV06X38A | 120 MHz | PIC32CX | 81 I/O | 3.63 V | 1.71 V | Details | - 40 C | + 125 C | CAN, Ethernet, USB | SMD/SMT | 90 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Reel | - | 1.71 V to 3.63 V | Flash | 1 MB | - 40 C to + 125 C | 32 Channel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PIC32CX1025SG41100-E/E5X | Microchip Technology | 数据表 | 276 In Stock |
- | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 微芯片技术 | 活跃 | EV06X38A | 120 MHz | PIC32CX | 81 I/O | 3.63 V | 1.71 V | Details | - 40 C | + 125 C | CAN, Ethernet, USB | SMD/SMT | 1000 | Tray | Tray | - | 1.71 V to 3.63 V | Flash | 1 MB | - 40 C to + 125 C | 32 Channel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PIC32CX1025SG41128T-E/Z2X | Microchip Technology | 数据表 | 923 In Stock |
- | 最小起订量: 1 最小包装量: 1 | TQFP-128 | 微芯片技术 | 活跃 | EV06X38A | 120 MHz | PIC32CX | 99 I/O | 3.63 V | 1.71 V | Details | - 40 C | + 125 C | CAN, Ethernet, USB | SMD/SMT | 1000 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Reel | - | 1.71 V to 3.63 V | Flash | 1 MB | - 40 C to + 125 C | 32 Channel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PIC32CX1025SG41128T-I/Z2X | Microchip Technology | 数据表 | 1173 In Stock |
- | 最小起订量: 1 最小包装量: 1 | TQFP-128 | 微芯片技术 | 活跃 | EV06X38A | 120 MHz | PIC32CX | 99 I/O | 3.63 V | 1.71 V | Details | - 40 C | + 85 C | CAN, Ethernet, USB | SMD/SMT | 1000 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Reel | - | 1.71 V to 3.63 V | Flash | 1 MB | - 40 C to + 85 C | 32 Channel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F200M3F-1FG484 | Microchip Technology | 数据表 | 2308 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | 64 kB | 2000 LE | 161 I/O | 0 C | + 85 C | 有 | - | 60 | SmartFusion | Tray | A2F200 | 活跃 | N | SMD/SMT | 100 MHz | - | - | 0°C ~ 85°C (TJ) | Tray | A2F200 | 1 mA | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 256 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 200000 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F200M3F-1CSG288 | Microchip Technology | 数据表 | 48 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 288-TFBGA, CSPBGA | YES | 288-CSP (11x11) | 288 | ARM Cortex M3 | A2F200 | 活跃 | TFBGA, BGA288,21X21,20 | 微芯片技术 | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA288,21X21,20 | 1.5 V | 未说明 | 1.425 V | 85 °C | 有 | A2F200M3F-1CSG288 | 100 MHz | TFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | 5.24 | Details | 100 MHz | - | - | 64 kB | 2000 LE | 有 | - | 176 | SmartFusion | MCU - 31, FPGA - 78 | Tray | 0°C ~ 85°C (TJ) | Tray | A2F200 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 未说明 | 0.5 mm | compliant | S-PBGA-B288 | 78 | 不合格 | 1.5,1.8,2.5,3.3 V | OTHER | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 256 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 78 | 4608 CLBS, 200000 GATES | 1.05 mm | 现场可编程门阵列 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 1 Core | 200000 | 256KB | 11 mm | 11 mm | ||||||||||||||||||||||||||||
![]() | M2S090-FG676 | Microchip Technology | 数据表 | 2000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 676-BGA | YES | 676-FBGA (27x27) | 676 | ARM Cortex M3 | Tray | M2S090 | 活跃 | 微芯片技术 | FBGA-676 | 网格排列 | 3 | PLASTIC/EPOXY | BGA676,26X26,40 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S090-FG676 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.83 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 86316 LE | 有 | 7193 LAB | 40 | 1.2000 V | 425 | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B676 | 425 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 425 | 2.44 mm | 现场可编程门阵列 | STD | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 27 mm | 27 mm | ||||||||||||||||||||||||||||||
![]() | M2S060-1FG484I | Microchip Technology | 数据表 | 2415 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | 267 | Tray | M2S060 | 活跃 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 56520 LE | 有 | 4710 LAB | 60 | SmartFusion2 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150TS-FCS536I | Microchip Technology | 数据表 | 2224 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | ARM Cortex M3 | 微芯片技术 | BGA, | 网格排列 | PLASTIC/EPOXY | 1.2 V | 30 | 1.14 V | 无 | M2S150TS-FCS536I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.84 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 146124 LE | 有 | 12177 LAB | 90 | 1.2000 V | 293 | Tray | M2S150 | 活跃 | -40 to 100 °C | Tray | SmartFusion2 | e0 | 无 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | not_compliant | 536 | S-PBGA-B536 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 现场可编程门阵列 | STD | FPGA - 150K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090T-FCS325 | Microchip Technology | 数据表 | 2331 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x13.5) | 325 | ARM Cortex M3 | FBGA-325 | 微芯片技术 | GRID ARRAY, THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S090T-FCS325 | TFBGA | RECTANGULAR | 活跃 | MICROSEMI CORP | 1.26 V | 5.83 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 86316 LE | 有 | 7193 LAB | 176 | 180 | Tray | M2S090 | 活跃 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | R-PBGA-B325 | 180 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.16 mm | 现场可编程门阵列 | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 13.5 mm | 11 mm | ||||||||||||||||||||||||||||||||
![]() | M2S010-VFG400 | Microchip Technology | 数据表 | 170 In Stock |
- | 最小起订量: 1 最小包装量: 1 | VFPBGA-400 | 400-VFBGA (17x17) | ARM Cortex M3 | 微芯片技术 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 12084 LE | 233 I/O | 0 C | + 85 C | 有 | 1007 LAB | 90 | 0.034371 oz | 1.26 V | 1.14 V | Tray | M2S010 | 活跃 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 10K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060TS-VF400 | Microchip Technology | 数据表 | 2563 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | ARM Cortex M3 | M2S060 | 活跃 | 微芯片技术 | VFBGA-400 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 30 | 1.14 V | 85 °C | 5.87 | 1.26 V | MICROSEMI CORP | 活跃 | SQUARE | LFBGA | M2S060TS-VF400 | 无 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 56520 LE | 有 | 4710 LAB | 90 | SmartFusion2 | 207 | Tray | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 207 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||
![]() | M2S025-1VFG256 | Microchip Technology | 数据表 | 10 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | VFPBGA-256 | 256-FPBGA (17x17) | ARM Cortex M3 | 微芯片技术 | 138 | Tray | M2S025 | 活跃 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 119 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050TS-1VF400I | Microchip Technology | 数据表 | 2323 In Stock |
- | 最小起订量: 1 最小包装量: 1 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | ARM Cortex M3 | 微芯片技术 | VFBGA-400 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | 1.2 V | 30 | 1.14 V | 无 | M2S050TS-1VF400I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.84 | 90 | 4695 LAB | 有 | 56340 LE | 64 kB | - | - | 166 MHz | SMD/SMT | N | This product may require additional documentation to export from the United States. | 207 | Tray | M2S050 | 活跃 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1.51 mm | 现场可编程门阵列 | 1 | FPGA - 50K Logic Modules | 1 Core | 256KB | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | M2S090T-FG484I | Microchip Technology | 数据表 | 2764 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | M2S090 | 活跃 | 微芯片技术 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 30 | 1.14 V | 无 | M2S090T-FG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.83 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 86316 LE | 有 | 7193 LAB | 60 | 267 | Tray | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | 现场可编程门阵列 | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||
![]() | M2S150-FC1152 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | ARM Cortex M3 | M2S150 | 活跃 | 微芯片技术 | FBGA-1152 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S150-FC1152 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.81 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 146124 LE | 有 | 12177 LAB | 24 | 1.2000 V | 574 | Tray | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | 现场可编程门阵列 | STD | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 35 mm | 35 mm | |||||||||||||||||||||||||||||||
![]() | M2S090TS-FCSG325I | Microchip Technology | 数据表 | 2263 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FCBGA-325 | YES | 325-FCBGA (11x13.5) | 325 | ARM Cortex M3 | 180 | Tray | M2S090 | 微芯片技术 | 活跃 | FBGA-325 | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 40 | 1.14 V | 有 | M2S090TS-FCSG325I | TFBGA | RECTANGULAR | 活跃 | MICROSEMI CORP | 1.26 V | 5.8 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 86316 LE | 有 | 7193 LAB | 176 | 1.2, 1.5, 1.8, 2.5, 3.3 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | R-PBGA-B325 | 180 | 不合格 | 1.2 V | CAN/Ethernet/Serial | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.16 mm | 现场可编程门阵列 | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 13.5 mm | 11 mm | ||||||||||||||||||||||||||||||
![]() | M2S060T-FG676I | Microchip Technology | 数据表 | 2772 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 676-BGA | 676-FBGA (27x27) | ARM Cortex M3 | 微芯片技术 | 387 | Tray | M2S060 | 活跃 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 56520 LE | 有 | 4710 LAB | 40 | SmartFusion2 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB |
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