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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	包装/外壳	表面安装	引脚数	供应商器件包装	终端数量		Core										厂商																												操作温度	包装	系列	JESD-609代码	端子表面处理	最高工作温度	最小工作温度	附加功能	HTS代码	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	频率	时间@峰值回流温度-最大值(s)	JESD-30代码	输出的数量	资历状况	电源	温度等级	界面	速度	内存大小	核心处理器	周边设备	程序内存大小	连接方式	建筑学	输入数量	座位高度-最大	可编程逻辑类型	核心架构	速度等级	主要属性	逻辑单元数	核数量
M2S025TS-1FCSG325I	Microchip Technology	数据表	2681 In Stock	1: ¥985.139941 10: ¥929.377308 100: ¥876.771043 500: ¥827.142496 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325-FCBGA (11x11)	325	ARM Cortex M3	-	64 kB	27696 LE	有	2308 LAB	微芯片技术	176	180	Tray	M2S025	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	40	1.14 V	有	M2S025TS-1FCSG325I	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN		CMOS	BOTTOM	BALL	250	0.5 mm	compliant			S-PBGA-B325	180	不合格	1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	180	1.01 mm	现场可编程门阵列			FPGA - 25K Logic Modules	27696	1 Core	256KB	11 mm	11 mm
M2S090TS-FG676	Microchip Technology	数据表	2320 In Stock	1: ¥3,147.740700 10: ¥2,969.566702 100: ¥2,801.478018 500: ¥2,642.903792 查看所有的价格 -	最小起订量: 1 最小包装量: 1	676-BGA	YES	676-FBGA (27x27)	676	ARM Cortex M3	-	64 kB	86316 LE	有	7193 LAB	40	微芯片技术	425	Tray	M2S090	活跃	FBGA-676	网格排列	3	PLASTIC/EPOXY	BGA676,26X26,40	1.2 V	30	1.14 V	85 °C	无	M2S090TS-FG676	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84			This product may require additional documentation to export from the United States.	N	166 MHz	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant			S-PBGA-B676	425	不合格	1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	425	2.44 mm	现场可编程门阵列			FPGA - 90K Logic Modules	86316	1 Core	512KB	27 mm	27 mm
M2S090TS-1FG676	Microchip Technology	数据表	2895 In Stock	1: ¥3,503.946402 10: ¥3,305.609814 100: ¥3,118.499822 500: ¥2,941.980967 查看所有的价格 -	最小起订量: 1 最小包装量: 1	BGA-676	YES	676-FBGA (27x27)	676	ARM Cortex M3	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	微芯片技术	40	425	Tray	M2S090	活跃	FBGA-676	网格排列	3	PLASTIC/EPOXY	BGA676,26X26,40	1.2 V	30	1.14 V	85 °C	无	M2S090TS-1FG676	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84			This product may require additional documentation to export from the United States.	N	SMD/SMT	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant			S-PBGA-B676	425	不合格	1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	425	2.44 mm	现场可编程门阵列			FPGA - 90K Logic Modules	86316	1 Core	512KB	27 mm	27 mm
M2S050-1FGG896I	Microchip Technology	数据表	2356 In Stock	1: ¥2,020.788645 10: ¥1,906.404384 100: ¥1,798.494698 500: ¥1,696.693113 查看所有的价格 -	最小起订量: 1 最小包装量: 1	FPBGA-896	YES	896-FBGA (31x31)	896	ARM Cortex M3	-	-	64 kB	56340 LE	有	4695 LAB	微芯片技术	27	1.2000 V	377	Tray	M2S050	活跃	BGA, BGA896,30X30,40	网格排列	PLASTIC/EPOXY	BGA896,30X30,40	1.2 V	40	1.14 V	有	M2S050-1FGG896I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.76			This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-40 to 100 °C	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant			S-PBGA-B896	377	不合格	1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	377	2.44 mm	现场可编程门阵列		1	FPGA - 50K Logic Modules	56340	1 Core	256KB	31 mm	31 mm
M2S090-FGG676I	Microchip Technology	数据表	2129 In Stock	1: ¥2,911.617834 10: ¥2,746.809280 100: ¥2,591.329504 500: ¥2,444.650478 查看所有的价格 -	最小起订量: 1 最小包装量: 1	BGA-676	YES	676-FBGA (27x27)	676	ARM Cortex M3	-	-	64 kB	86316 LE	有	7193 LAB	微芯片技术	40	425	Tray	M2S090	活跃	BGA, BGA676,26X26,40	网格排列	3	PLASTIC/EPOXY	BGA676,26X26,40	1.2 V	40	1.14 V	有	M2S090-FGG676I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.78			This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant			S-PBGA-B676	425	不合格	1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	425	2.44 mm	现场可编程门阵列			FPGA - 90K Logic Modules	86316	1 Core	512KB	27 mm	27 mm
M2S010TS-1FG484I	Microchip Technology	数据表	44 In Stock	1: ¥678.397620 10: ¥639.997760 100: ¥603.771468 500: ¥569.595727 查看所有的价格 -	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	微芯片技术	60	1.2000 V	1.14 V	1.26 V	233	Tray	M2S010	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	1.2 V	30	1.14 V	无	M2S010TS-1FG484I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.8			This product may require additional documentation to export from the United States.	N	-40 to 100 °C	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)				8542.39.00.01		BOTTOM	BALL	240	1 mm	not_compliant			S-PBGA-B484						166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		2.44 mm	现场可编程门阵列		1	FPGA - 10K Logic Modules		1 Core	256KB	23 mm	23 mm
M2S060T-1FCS325I	Microchip Technology	数据表	2553 In Stock	1: ¥1,434.789590 10: ¥1,353.575086 100: ¥1,276.957628 500: ¥1,204.677006 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	ARM Cortex M3	56520 LE	有	4710 LAB	176	微芯片技术	SmartFusion2	200	Tray	M2S060	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	30	1.14 V	无	M2S060T-1FCS325I	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.87		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant			S-PBGA-B325	200	不合格	1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200	1.01 mm	现场可编程门阵列			FPGA - 60K Logic Modules	56520	1 Core	256KB	11 mm	11 mm
A2F500M3G-1FGG256M	Microchip Technology	数据表	932 In Stock	1: ¥8,683.748861 10: ¥8,398.209736 25: ¥8,339.830916 50: ¥8,281.857911 查看所有的价格 -	最小起订量: 1 最小包装量: 1	256-LBGA	256	256-FPBGA (17x17)	ARM Cortex M3	90	微芯片技术	SmartFusion	1.5000 V	1.425 V	500000	1.575 V	MCU - 25, FPGA - 66	Tray	A2F500	活跃	3	有	A2F500M3G-1FGG256M	活跃	MICROSEMI CORP	5.79				This product may require additional documentation to export from the United States.	Details	100 MHz	-	-	64 kB	6000 LE	有	-	0 to 85 °C	Tray	A2F500			125 °C	-55 °C		8542.39.00.01						compliant	100 MHz							EBI/EMI, Ethernet, I2C, SPI, UART, USART	100MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	512 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA				ARM	1	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops		1 Core	512KB
M2S010T-1VFG256	Microchip Technology	数据表	5 In Stock	1: ¥522.496568 10: ¥492.921291 100: ¥465.020083 500: ¥438.698191 查看所有的价格 -	最小起订量: 1 最小包装量: 1	VFPBGA-256	YES	256-FPBGA (17x17)	256	ARM Cortex M3	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	微芯片技术	119	138	Tray	M2S010	活跃	VFBGA-256	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA256,16X16,32	1.2 V	40	1.14 V	85 °C	有	M2S010T-1VFG256	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.77			This product may require additional documentation to export from the United States.	Details	SMD/SMT	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant			S-PBGA-B256	138	不合格	1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	138	1.56 mm	现场可编程门阵列			FPGA - 10K Logic Modules	12084	1 Core	256KB	14 mm	14 mm
M2S150TS-FCG1152I	Microchip Technology	数据表	888 In Stock	1: ¥4,149.553289 10: ¥3,914.672917 100: ¥3,693.087654 500: ¥3,484.044964 查看所有的价格 -	最小起订量: 1 最小包装量: 1	FCBGA-1152	YES	1152-FCBGA (35x35)	1152	ARM Cortex M3	-	64 kB	146124 LE	有	12177 LAB	微芯片技术	24	574	Tray	M2S150	活跃	BGA, BGA1152,34X34,40	网格排列	4	PLASTIC/EPOXY	BGA1152,34X34,40	1.2 V	1.14 V	有	M2S150TS-FCG1152I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81			This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant		40	S-PBGA-B1152	574	不合格	1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	574	2.9 mm	现场可编程门阵列			FPGA - 150K Logic Modules	146124	1 Core	512KB	35 mm	35 mm
M2S060T-VF400	Microchip Technology	数据表	2320 In Stock	1: ¥1,538.817516 10: ¥1,451.714637 100: ¥1,369.542110 500: ¥1,292.020859 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	400-LFBGA	YES	400-VFBGA (17x17)	400	ARM Cortex M3	64 kB	56520 LE	有	4710 LAB	90	微芯片技术	SmartFusion2	207	Tray	M2S060	活跃	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	85 °C	无	M2S060T-VF400	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.87		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant			S-PBGA-B400	207	不合格	1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	207	1.51 mm	现场可编程门阵列			FPGA - 60K Logic Modules	56520	1 Core	256KB	17 mm	17 mm
M2S010T-1VF400	Microchip Technology	数据表	5 In Stock	1: ¥404.279503 10: ¥381.395755 100: ¥359.807317 500: ¥339.440865 查看所有的价格 -	最小起订量: 1 最小包装量: 1	VFPBGA-400	YES	400-VFBGA (17x17)	400	ARM Cortex M3	N	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	微芯片技术	90	1.2000 V	1.14 V	1.26 V	195	Tray	M2S010	活跃	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	85 °C	无	M2S010T-1VF400	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84			This product may require additional documentation to export from the United States.	0 to 85 °C	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant			S-PBGA-B400	160	不合格	1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	160	1.51 mm	现场可编程门阵列		1	FPGA - 10K Logic Modules	9744	1 Core	256KB	17 mm	17 mm
M2S150-FCS536	Microchip Technology	数据表	2560 In Stock	1: ¥3,860.599589 10: ¥3,642.075087 100: ¥3,435.919892 500: ¥3,241.433862 查看所有的价格 -	最小起订量: 1 最小包装量: 1	536-LFBGA, CSPBGA	536-CSPBGA (16x16)	ARM Cortex M3	微芯片技术	N	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	90	293	Tray	M2S150	活跃					This product may require additional documentation to export from the United States.	0°C ~ 85°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						FPGA - 150K Logic Modules		1 Core	512KB
M2S060-FGG484I	Microchip Technology	数据表	2710 In Stock	1: ¥1,618.791769 10: ¥1,527.162048 100: ¥1,440.718914 500: ¥1,359.168783 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术		This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	60	SmartFusion2	1.2000 V	267	Tray	M2S060	活跃			-40 to 100 °C	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					STD	FPGA - 60K Logic Modules		1 Core	256KB
M2S090TS-FG484I	Microchip Technology	数据表	2103 In Stock	1: ¥2,736.889147 10: ¥2,581.970891 100: ¥2,435.821592 500: ¥2,297.944902 查看所有的价格 -	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	60	267	Tray	M2S090	活跃				-40°C ~ 100°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						FPGA - 90K Logic Modules		1 Core	512KB
M2S050-VF400I	Microchip Technology	数据表	2213 In Stock	1: ¥1,520.939089 10: ¥1,434.848199 100: ¥1,353.630371 500: ¥1,277.009785 查看所有的价格 -	最小起订量: 1 最小包装量: 1	VFPBGA-400	YES	400-VFBGA (17x17)	400	ARM Cortex M3	-	64 kB	56340 LE	有	4695 LAB	微芯片技术	90	207	Tray	M2S050	活跃	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	无	M2S050-VF400I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81			This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant			S-PBGA-B400	207	不合格	1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	207	1.51 mm	现场可编程门阵列			FPGA - 50K Logic Modules	56340	1 Core	256KB	17 mm	17 mm
M2S025T-VF256I	Microchip Technology	数据表	2316 In Stock	1: ¥1,012.912034 10: ¥955.577392 100: ¥901.488106 500: ¥850.460473 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	256-LFBGA	256-FPBGA (14x14)	ARM Cortex M3	微芯片技术	-	-	64 kB	27696 LE	有	2308 LAB	119	138	Tray	M2S025	活跃				This product may require additional documentation to export from the United States.	N	166 MHz	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						FPGA - 25K Logic Modules		1 Core	256KB
M2S025T-1VFG400	Microchip Technology	数据表	36 In Stock	1: ¥777.000391 10: ¥733.019235 100: ¥691.527580 500: ¥652.384509 查看所有的价格 -	最小起订量: 1 最小包装量: 1	VFPBGA-400	400-VFBGA (17x17)	ARM Cortex M3	微芯片技术		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	90	207	Tray	M2S025	活跃				0°C ~ 85°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						FPGA - 25K Logic Modules		1 Core	256KB
M2S090-1FCS325	Microchip Technology	数据表	2813 In Stock	1: ¥1,428.600397 10: ¥1,347.736229 100: ¥1,271.449272 500: ¥1,199.480440 查看所有的价格 -	最小起订量: 1 最小包装量: 1	FCBGA-325	YES	325-FCBGA (11x13.5)	325	ARM Cortex M3	-	-	64 kB	86316 LE	有	7193 LAB	微芯片技术	176	180	Tray	M2S090	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	30	1.14 V	85 °C	无	M2S090-1FCS325	TFBGA	RECTANGULAR	活跃	MICROSEMI CORP	1.26 V	5.83			This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant			R-PBGA-B325	180	不合格	1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	180	1.16 mm	现场可编程门阵列			FPGA - 90K Logic Modules	86316	1 Core	512KB	13.5 mm	11 mm
M2S050TS-VF400I	Microchip Technology	数据表	2999 In Stock	1: ¥1,771.890447 10: ¥1,671.594760 100: ¥1,576.976192 500: ¥1,487.713389 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	VFPBGA-400	400-VFBGA (17x17)	ARM Cortex M3	微芯片技术	N	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	90	207	Tray	M2S050	活跃				This product may require additional documentation to export from the United States.	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						FPGA - 50K Logic Modules		1 Core	256KB
M2S025TS-1FG484I	Microchip Technology	数据表	2570 In Stock	1: ¥1,034.757079 10: ¥976.185923 100: ¥920.930115 500: ¥868.801994 查看所有的价格 -	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	Tray	M2S025	活跃					This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	60	1.2000 V	1.14 V	1.26 V	267	-40 to 100 °C	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					1	FPGA - 25K Logic Modules		1 Core	256KB
M2S050TS-FG896	Microchip Technology	数据表	2300 In Stock	1: ¥2,017.550247 10: ¥1,903.349294 100: ¥1,795.612537 500: ¥1,693.974091 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	896-BGA	896-FBGA (31x31)	ARM Cortex M3	微芯片技术	-	-	64 kB	56340 LE	有	4695 LAB	27	377	Tray	M2S050	活跃				This product may require additional documentation to export from the United States.	N	166 MHz	0°C ~ 85°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						FPGA - 50K Logic Modules		1 Core	256KB
M2S010TS-1VFG256	Microchip Technology	数据表	28 In Stock	1: ¥478.284027 10: ¥451.211345 100: ¥425.671083 500: ¥401.576493 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 1 month ago)	VFPBGA-256	YES	256-FPBGA (17x17)	256	ARM Cortex M3	-	-	64 kB	12084 LE	有	1007 LAB	微芯片技术	119	138	Tray	M2S010	活跃	VFBGA-256	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA256,16X16,32	1.2 V	40	1.14 V	85 °C	有	M2S010TS-1VFG256	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant			S-PBGA-B256	138	不合格	1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	138	1.56 mm	现场可编程门阵列			FPGA - 10K Logic Modules	12084	1 Core	256KB	14 mm	14 mm
M2S050TS-1FCS325I	Microchip Technology	数据表	2265 In Stock	1: ¥1,552.224787 10: ¥1,464.363004 100: ¥1,381.474532 500: ¥1,303.277865 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325-FCBGA (11x11)	325	ARM Cortex M3	64 kB	56340 LE	有	4695 LAB	微芯片技术	176	200	Tray	M2S050	活跃	FBGA-325	5.88	1.26 V	MICROSEMI CORP	活跃	SQUARE	TFBGA	M2S050TS-1FCS325I	无	1.14 V	30	1.2 V	BGA325,21X21,20	PLASTIC/EPOXY	GRID ARRAY, THIN PROFILE, FINE PITCH		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant			S-PBGA-B325	200	不合格	1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200	1.01 mm	现场可编程门阵列			FPGA - 50K Logic Modules	56340	1 Core	256KB	11 mm	11 mm
M2S025-1FCS325	Microchip Technology	数据表	2520 In Stock	1: ¥806.974400 10: ¥761.296607 100: ¥718.204342 500: ¥677.551264 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FCBGA-325	325-FCBGA (11x11)	ARM Cortex M3	微芯片技术	N	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	176	180	Tray	M2S025	活跃				This product may require additional documentation to export from the United States.	0°C ~ 85°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						FPGA - 25K Logic Modules		1 Core	256KB

M2S025TS-1FCSG325I

Microchip Technology

分类:Embedded - System On Chip (SoC)

985.139941
M2S090TS-FG676

Microchip Technology

分类:Embedded - System On Chip (SoC)

3,147.740700
M2S090TS-1FG676

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分类:Embedded - System On Chip (SoC)

3,503.946402
M2S050-1FGG896I

Microchip Technology

分类:Embedded - System On Chip (SoC)

2,020.788645
M2S090-FGG676I

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分类:Embedded - System On Chip (SoC)

2,911.617834
M2S010TS-1FG484I

Microchip Technology

分类:Embedded - System On Chip (SoC)

678.397620
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分类:Embedded - System On Chip (SoC)

1,434.789590
A2F500M3G-1FGG256M

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分类:Embedded - System On Chip (SoC)

8,683.748861
M2S010T-1VFG256

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分类:Embedded - System On Chip (SoC)

522.496568
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分类:Embedded - System On Chip (SoC)

4,149.553289
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分类:Embedded - System On Chip (SoC)

1,538.817516
M2S010T-1VF400

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分类:Embedded - System On Chip (SoC)

404.279503
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分类:Embedded - System On Chip (SoC)

3,860.599589
M2S060-FGG484I

Microchip Technology

分类:Embedded - System On Chip (SoC)

1,618.791769
M2S090TS-FG484I

Microchip Technology

分类:Embedded - System On Chip (SoC)

2,736.889147
M2S050-VF400I

Microchip Technology

分类:Embedded - System On Chip (SoC)

1,520.939089
M2S025T-VF256I

Microchip Technology

分类:Embedded - System On Chip (SoC)

1,012.912034
M2S025T-1VFG400

Microchip Technology

分类:Embedded - System On Chip (SoC)

777.000391
M2S090-1FCS325

Microchip Technology

分类:Embedded - System On Chip (SoC)

1,428.600397
M2S050TS-VF400I

Microchip Technology

分类:Embedded - System On Chip (SoC)

1,771.890447
M2S025TS-1FG484I

Microchip Technology

分类:Embedded - System On Chip (SoC)

1,034.757079
M2S050TS-FG896

Microchip Technology

分类:Embedded - System On Chip (SoC)

2,017.550247
M2S010TS-1VFG256

Microchip Technology

分类:Embedded - System On Chip (SoC)

478.284027
M2S050TS-1FCS325I

Microchip Technology

分类:Embedded - System On Chip (SoC)

1,552.224787
M2S025-1FCS325

Microchip Technology

分类:Embedded - System On Chip (SoC)

806.974400