类别是'category.片上系统(SoC)' (7720)

  • 所有品牌

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

包装/外壳

表面安装

供应商器件包装

终端数量

厂商

操作温度

包装

系列

JESD-609代码

零件状态

端子表面处理

HTS代码

子类别

技术

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

基本部件号

JESD-30代码

输出的数量

资历状况

电源

温度等级

速度

内存大小

核心处理器

周边设备

连接方式

建筑学

输入数量

组织结构

座位高度-最大

可编程逻辑类型

主要属性

逻辑块数量

逻辑单元数

闪光大小

长度

宽度

5ASXMB5E4F31I3N
5ASXMB5E4F31I3N
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

896-BBGA, FCBGA

YES

896-FBGA (31x31)

896

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.15 V

未说明

1.12 V

100 °C

有

5ASXMB5E4F31I3N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

1.18 V

5.28

MCU - 208, FPGA - 250

BGA, BGA896,30X30,40

网格排列

-40°C ~ 100°C (TJ)

Tray

Arria V SX

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

未说明

1 mm

compliant

5ASXMB5

S-PBGA-B896

540

INDUSTRIAL

800MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

540

17434 CLBS

2.7 mm

现场可编程门阵列

FPGA - 462K Logic Elements

17434

462000

--

31 mm

31 mm

5ASTFD3G3F35I3N
5ASTFD3G3F35I3N
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

YES

1152-FBGA (35x35)

1152

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

1.15 V

未说明

1.12 V

100 °C

有

5ASTFD3G3F35I3N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

1.18 V

5.29

MCU - 208, FPGA - 385

FBGA-1152

网格排列

-40°C ~ 100°C (TJ)

Tray

Arria V ST

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

未说明

1 mm

compliant

5ASTFD3

S-PBGA-B1152

385

INDUSTRIAL

1.05GHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

385

13207 CLBS

2.7 mm

现场可编程门阵列

FPGA - 350K Logic Elements

13207

350000

--

35 mm

35 mm

5CSXFC6C6U23C7N
5CSXFC6C6U23C7N
ALTERA 数据表

2542 In Stock

-

最小起订量: 1

最小包装量: 1

672-FBGA

YES

672-UBGA (23x23)

672

BGA672,28X28,32

1.1 V

未说明

1.07 V

85 °C

有

5CSXFC6C6U23C7N

FBGA

SQUARE

Intel Corporation

活跃

INTEL CORP

1.13 V

5.56

MCU - 181, FPGA - 145

FBGA, BGA672,28X28,32

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

0°C ~ 85°C (TJ)

Tray

Cyclone® V SX

活跃

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

0.8 mm

compliant

5CSXFC6

S-PBGA-B672

145

不合格

1.1,1.2/3.3,2.5 V

OTHER

800MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

145

1.85 mm

现场可编程门阵列

FPGA - 110K Logic Elements

110000

--

23 mm

23 mm

XCVM1802-2LLIVSVD1760
XCVM1802-2LLIVSVD1760
AMD 数据表

663 In Stock

-

最小起订量: 1

最小包装量: 1

-

-

AMD

活跃

500

Tray

-40°C ~ 100°C (TJ)

Versal™ Prime

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

XC7Z030-2SBG485I
XC7Z030-2SBG485I
AMD 数据表

41 In Stock

-

最小起订量: 1

最小包装量: 1

484-FBGA, FCBGA

484-FCBGA (19x19)

AMD

130

Tray

XC7Z030

活跃

-40°C ~ 100°C (TJ)

Zynq®-7000

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 125K Logic Cells

-

XCVP1802-2MSELSVC4072
XCVP1802-2MSELSVC4072
AMD 数据表

960 In Stock

-

最小起订量: 1

最小包装量: 1

AMD

Tray

活跃

780

0°C ~ 100°C (TJ)

Versal® Premium

-

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

-

AGFB014R24C2E3V
AGFB014R24C2E3V
Intel 数据表

612 In Stock

-

最小起订量: 1

最小包装量: 1

-

-

Intel

活跃

744

Tray

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.4M Logic Elements

-

XCZU3CG-1SFVC784I
XCZU3CG-1SFVC784I
AMD 数据表

50 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

活跃

XCZU3

Bulk

252

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

XA7Z020-1CLG484Q
XA7Z020-1CLG484Q
AMD 数据表

2270 In Stock

-

最小起订量: 1

最小包装量: 1

484-LFBGA, CSPBGA

484-CSPBGA (19x19)

AMD

130

Tray

XA7Z020

活跃

-40°C ~ 125°C (TJ)

Automotive, AEC-Q100, Zynq®-7000 XA

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 85K Logic Cells

-

AGFD023R25A2E4F
AGFD023R25A2E4F
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

活跃

480

Tray

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

XCVC1502-2MSEVSVA1596
XCVC1502-2MSEVSVA1596
AMD 数据表

545 In Stock

-

最小起订量: 1

最小包装量: 1

AMD

Tray

活跃

*

AGFA014R24B1E1V
AGFA014R24B1E1V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

活跃

768

Tray

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.4M Logic Elements

-

AGFA027R31C2E2V
AGFA027R31C2E2V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

活跃

720

Tray

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

10AS057
10AS057
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Intel

Bulk

活跃

-

XCVC1502-2MSIVSVA1596
XCVC1502-2MSIVSVA1596
AMD 数据表

752 In Stock

-

最小起订量: 1

最小包装量: 1

1596-BFBGA, FCBGA

AMD

活跃

Tray

478

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 800k Logic Cells

-

XCVE1752-1MSEVSVA1596
XCVE1752-1MSEVSVA1596
AMD 数据表

856 In Stock

-

最小起订量: 1

最小包装量: 1

1596-BFBGA, FCBGA

AMD

500

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

-

XCVM1802-1LLIVSVD1760
XCVM1802-1LLIVSVD1760
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD 赛灵思

活跃

726

Tray

-40°C ~ 100°C (TJ)

Versal™ Prime

400MHz, 1GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

XCVM1802-1LSIVSVD1760
XCVM1802-1LSIVSVD1760
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD 赛灵思

活跃

726

Tray

-40°C ~ 100°C (TJ)

Versal™ Prime

400MHz, 1GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

XCVM1802-1LSEVSVA2197
XCVM1802-1LSEVSVA2197
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD 赛灵思

活跃

770

Tray

0°C ~ 100°C (TJ)

Versal™ Prime

400MHz, 1GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

XCVC1802-2LLEVSVD1760
XCVC1802-2LLEVSVD1760
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD 赛灵思

活跃

692

Tray

0°C ~ 100°C (TJ)

Versal™ AI Core

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

XCVC1802-2LSEVSVD1760
XCVC1802-2LSEVSVD1760
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD 赛灵思

692

活跃

0°C ~ 100°C (TJ)

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

AGFA008R16A3E3E
AGFA008R16A3E3E
Intel 数据表

746 In Stock

-

最小起订量: 1

最小包装量: 1

-

-

Intel

活跃

384

Tray

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 764K Logic Elements

-

XCVE1752-2MLIVSVA1596
XCVE1752-2MLIVSVA1596
AMD 数据表

720 In Stock

-

最小起订量: 1

最小包装量: 1

AMD

Tray

活跃

*

AGFD019R25A2E4X
AGFD019R25A2E4X
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

活跃

480

Tray

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

XCZU2EG-3SFVA625E
XCZU2EG-3SFVA625E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

AMD

Obsolete

180

Tray

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

600MHz, 667MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-