类别是'category.片上系统(SoC)' (7720)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 零件状态 | 端子表面处理 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 温度等级 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 连接方式 | 建筑学 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 主要属性 | 逻辑块数量 | 逻辑单元数 | 闪光大小 | 长度 | 宽度 | ||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | 5ASXMB5E4F31I3N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 896-BBGA, FCBGA | YES | 896-FBGA (31x31) | 896 | PLASTIC/EPOXY | BGA896,30X30,40 | -40 °C | 1.15 V | 未说明 | 1.12 V | 100 °C | 有 | 5ASXMB5E4F31I3N | BGA | SQUARE | Intel Corporation | 生命周期结束 | INTEL CORP | 1.18 V | 5.28 | MCU - 208, FPGA - 250 | BGA, BGA896,30X30,40 | 网格排列 | -40°C ~ 100°C (TJ) | Tray | Arria V SX | e1 | 活跃 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5ASXMB5 | S-PBGA-B896 | 540 | INDUSTRIAL | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 17434 CLBS | 2.7 mm | 现场可编程门阵列 | FPGA - 462K Logic Elements | 17434 | 462000 | -- | 31 mm | 31 mm | ||||||||||
![]() | 5ASTFD3G3F35I3N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 1.15 V | 未说明 | 1.12 V | 100 °C | 有 | 5ASTFD3G3F35I3N | BGA | SQUARE | Intel Corporation | 生命周期结束 | INTEL CORP | 1.18 V | 5.29 | MCU - 208, FPGA - 385 | FBGA-1152 | 网格排列 | -40°C ~ 100°C (TJ) | Tray | Arria V ST | e1 | 活跃 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5ASTFD3 | S-PBGA-B1152 | 385 | INDUSTRIAL | 1.05GHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 385 | 13207 CLBS | 2.7 mm | 现场可编程门阵列 | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 35 mm | 35 mm | ||||||||||
![]() | 5CSXFC6C6U23C7N | ALTERA | 数据表 | 2542 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 672-FBGA | YES | 672-UBGA (23x23) | 672 | BGA672,28X28,32 | 1.1 V | 未说明 | 1.07 V | 85 °C | 有 | 5CSXFC6C6U23C7N | FBGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.13 V | 5.56 | MCU - 181, FPGA - 145 | FBGA, BGA672,28X28,32 | GRID ARRAY, FINE PITCH | PLASTIC/EPOXY | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SX | 活跃 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | 5CSXFC6 | S-PBGA-B672 | 145 | 不合格 | 1.1,1.2/3.3,2.5 V | OTHER | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | 现场可编程门阵列 | FPGA - 110K Logic Elements | 110000 | -- | 23 mm | 23 mm | |||||||||||
![]() | XCVM1802-2LLIVSVD1760 | AMD | 数据表 | 663 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | AMD | 活跃 | 500 | Tray | -40°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z030-2SBG485I | AMD | 数据表 | 41 In Stock | - | 最小起订量: 1 最小包装量: 1 | 484-FBGA, FCBGA | 484-FCBGA (19x19) | AMD | 130 | Tray | XC7Z030 | 活跃 | -40°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVP1802-2MSELSVC4072 | AMD | 数据表 | 960 In Stock |
- | 最小起订量: 1 最小包装量: 1 | AMD | Tray | 活跃 | 780 | 0°C ~ 100°C (TJ) | Versal® Premium | - | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB014R24C2E3V | Intel | 数据表 | 612 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 744 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU3CG-1SFVC784I | AMD | 数据表 | 50 In Stock | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 活跃 | XCZU3 | Bulk | 252 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XA7Z020-1CLG484Q | AMD | 数据表 | 2270 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) | AMD | 130 | Tray | XA7Z020 | 活跃 | -40°C ~ 125°C (TJ) | Automotive, AEC-Q100, Zynq®-7000 XA | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 85K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFD023R25A2E4F | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 480 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1502-2MSEVSVA1596 | AMD | 数据表 | 545 In Stock |
- | 最小起订量: 1 最小包装量: 1 | AMD | Tray | 活跃 | * | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA014R24B1E1V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 768 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA027R31C2E2V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 720 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057 | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Intel | Bulk | 活跃 | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1502-2MSIVSVA1596 | AMD | 数据表 | 752 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | AMD | 活跃 | Tray | 478 | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 800k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVE1752-1MSEVSVA1596 | AMD | 数据表 | 856 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | AMD | 500 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | - | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-1LLIVSVD1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD 赛灵思 | 活跃 | 726 | Tray | -40°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-1LSIVSVD1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD 赛灵思 | 活跃 | 726 | Tray | -40°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-1LSEVSVA2197 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD 赛灵思 | 活跃 | 770 | Tray | 0°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1802-2LLEVSVD1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD 赛灵思 | 活跃 | 692 | Tray | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1802-2LSEVSVD1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD 赛灵思 | 692 | 活跃 | 0°C ~ 100°C (TJ) | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA008R16A3E3E | Intel | 数据表 | 746 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 384 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVE1752-2MLIVSVA1596 | AMD | 数据表 | 720 In Stock |
- | 最小起订量: 1 最小包装量: 1 | AMD | Tray | 活跃 | * | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFD019R25A2E4X | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 480 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU2EG-3SFVA625E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | Obsolete | 180 | Tray | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - |
5ASXMB5E4F31I3N
ALTERA
分类:Embedded - System On Chip (SoC)
5ASTFD3G3F35I3N
ALTERA
分类:Embedded - System On Chip (SoC)
5CSXFC6C6U23C7N
ALTERA
分类:Embedded - System On Chip (SoC)
2,918.596351
XCVM1802-2LLIVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
139,788.818566
XC7Z030-2SBG485I
AMD
分类:Embedded - System On Chip (SoC)
XCVP1802-2MSELSVC4072
AMD
分类:Embedded - System On Chip (SoC)
364,296.024853
AGFB014R24C2E3V
Intel
分类:Embedded - System On Chip (SoC)
106,850.415950
XCZU3CG-1SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
XA7Z020-1CLG484Q
AMD
分类:Embedded - System On Chip (SoC)
1,533.061922
AGFD023R25A2E4F
Intel
分类:Embedded - System On Chip (SoC)
XCVC1502-2MSEVSVA1596
AMD
分类:Embedded - System On Chip (SoC)
133,192.535677
AGFA014R24B1E1V
Intel
分类:Embedded - System On Chip (SoC)
AGFA027R31C2E2V
Intel
分类:Embedded - System On Chip (SoC)
10AS057
Intel
分类:Embedded - System On Chip (SoC)
XCVC1502-2MSIVSVA1596
AMD
分类:Embedded - System On Chip (SoC)
166,766.036549
XCVE1752-1MSEVSVA1596
AMD
分类:Embedded - System On Chip (SoC)
98,435.488385
XCVM1802-1LLIVSVD1760
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1802-1LSIVSVD1760
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1802-1LSEVSVA2197
Xilinx
分类:Embedded - System On Chip (SoC)
XCVC1802-2LLEVSVD1760
Xilinx
分类:Embedded - System On Chip (SoC)
XCVC1802-2LSEVSVD1760
Xilinx
分类:Embedded - System On Chip (SoC)
AGFA008R16A3E3E
Intel
分类:Embedded - System On Chip (SoC)
44,854.609670
XCVE1752-2MLIVSVA1596
AMD
分类:Embedded - System On Chip (SoC)
184,642.909569
AGFD019R25A2E4X
Intel
分类:Embedded - System On Chip (SoC)
XCZU2EG-3SFVA625E
AMD
分类:Embedded - System On Chip (SoC)
