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类别是'category.片上系统（SoC）' (7720)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 供应商器件包装 | 第一种连接器安装类型 | 第二个连接器安装类型 | 厂商 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | 终止次数 | 终端 | 温度系数 | 连接器类型 | 类型 | 电阻 | 定位的数量 | 最高工作温度 | 最小工作温度 | 组成 | 颜色 | 应用 | 性别 | 功率(瓦特) | 电容量 | 紧固类型 | 电压 - 供电 | 方向 | 入口保护 | 深度 | 样式 | 输出量 | 功能 | 输出的数量 | 接头数量 | 电压 - 输入（最大值） | 输出类型 | 电压 - 输入（最小值） | 失败率 | 引线间距 | 电路数量 | 镀层 | 速度 | 输出配置 | 内存大小 | 引线样式 | 输出电流 | 核心处理器 | 周边设备 | 连接方式 | 重置 | 电压 - 输出（最小值/固定） | 拓扑 | 建筑学 | 电压 - 阈值 | 监测的电压数量 | 重置超时 | 频率开关 | 同步整流器 | 输入 | 比率-输入：输出 | 第一个连接器 | 第二个连接器 | 电压 - 输出（最大值） | 差分 - 输入：输出 | 主要属性 | 闪光大小 | 特征 | 座位高度(最大) | 长度 | 厚度（最大） | 辐射硬化 | 评级结果 | |||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | XCZU46DR-2FSVH1760E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | NXP USA Inc. | Tube | BLF6 | 活跃 | 574 | 0°C ~ 100°C (TJ) | * | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU47DR-L2FFVE1156I | Xilinx | 数据表 | 5000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 24-VFQFN Exposed Pad | 24-QFN (4x4) | 366 | Skyworks Solutions Inc. | Tray | SI5330 | Obsolete | 350 MHz | -40°C ~ 85°C | - | Fanout Buffer (Distribution), Translator | 1.71V ~ 3.63V | LVPECL | 1 | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | CMOS, HSTL, LVTTL, SSTL | 1:4 | No/Yes | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU48DR-L1FSVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Molex | Bulk | 120084 | 活跃 | 366 | -40°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU48DR-L1FFVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | TE Connectivity Deutsch 连接器 | Bag | YDL68G | 活跃 | 366 | -40°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU49DR-L1FSVF1760I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | Molex | Bulk | 073404 | 活跃 | 622 | -40°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU48DR-2FSVG1517I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | Molex | Bulk | 098853 | 活跃 | 561 | -40°C ~ 100°C (TJ) | * | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU49DR-1FFVF1760E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Surface Mount, MLCC | 1206 (3216 Metric) | 1760-FCBGA (42.5x42.5) | Vishay Vitramon | Tape & Reel (TR) | 活跃 | 100V | 622 | -55°C ~ 150°C | GA | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±20% | X7R | 汽车 | 0.18 µF | - | - | 500MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | - | - | 0.067 (1.70mm) | AEC-Q200 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU49DR-2FSVF1760E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | SC-74A, SOT-753 | SOT-23-5 | Analog Devices Inc./Maxim Integrated | Tape & Reel (TR) | MAX6307 | Obsolete | 622 | 0°C ~ 70°C (TA) | - | Multi-Voltage Supervisor | 开路漏极或开路集电极 | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 低电平有效 | MCU, FPGA | 4.1V, Adj | 2 | 1ms Minimum | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU43DR-L2FFVG1517I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Axial | Axial | TT Electronics/IRC | Cut Tape (CT) | SPP2UL | Discontinued at Digi-Key | 561 | -55°C ~ 200°C | SPP | 0.169 Dia x 0.571 L (4.30mm x 14.50mm) | ±5% | 2 | ±300ppm/°C | 6.8 Ohms | Wirewound | 2W | - | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Fusible, Moisture Resistant, Safety, Weldable | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU43DR-2FSVE1156E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 16-WQFN Exposed Pad | 16-TQFN (5x5) | Analog Devices Inc./Maxim Integrated | Tape & Reel (TR) | MAX5097 | 活跃 | 366 | -40°C ~ 125°C (TJ) | - | Step-Down | 1 | 40V | Adjustable (Fixed) | 5V | 533MHz, 1.333GHz | Positive | 256KB | 600mA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.24V (3.3V) | 巴克 | MCU, FPGA | 330kHz | 无 | 11V | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU48DR-L1FSVG1517I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | Molex | Bulk | 120066 | 活跃 | 561 | -40°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU48DR-L2FFVG1517I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | Molex | Bulk | 055935 | 活跃 | 561 | -40°C ~ 100°C (TJ) | * | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU43DR-L2FSVG1517I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | 面板安装 | Free Hanging (In-Line) | Female | Bag | 50 Ohms | Q-1S05D0 | Bulkhead - Front Side Nut | 活跃 | Female | Amphenol Custom Cable | 3 GHz | - | RG-58 | 561 | - | - | Black | - | N-Type to Fakra | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | N-Type Jack, Right Angle | Fakra Jack, Right Angle | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Shielded | 36.00 (914.40mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU43DR-L1FFVG1517I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Axial | Axial | Vishay Dale | Tape & Reel (TR) | RLR20 | 活跃 | 561 | -65°C ~ 150°C | Military, MIL-PRF-39017/02, RLR20 | 0.138 Dia x 0.375 L (3.51mm x 9.53mm) | ±2% | 2 | ±100ppm/°C | 1.6 kOhms | Metal Film | 0.5W, 1/2W | M (1%) | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Military, Moisture Resistant, Weldable | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU43DR-2FSVG1517I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | Vishay Vitramon | Bulk | Obsolete | 561 | -40°C ~ 100°C (TJ) | * | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU48DR-1FSVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Molex | Bulk | 121055 | 活跃 | 366 | -40°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU43DR-1FSVG1517E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1206 (3216 Metric) | 1206 | TT Electronics/IRC | Cut Tape (CT) | PFC-W1206 | Discontinued at Digi-Key | 561 | -65°C ~ 150°C | PFC - Precision | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±0.1% | 2 | ±25ppm/°C | 2.49 kOhms | Thin Film | 0.333W, 1/3W | - | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Anti-Sulfur, Moisture Resistant | 0.028 (0.71mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU3CG-1SFVC784E | AMD | 数据表 | 2185 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU3 | 活跃 | AMD | Non-Compliant | 252 | Tray | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFB006R24C3E3V | Intel | 数据表 | 799 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Gold | Bulkhead, Front Side Nut, Jam Nut, Panel | - | - | Intel | Compliant | 576 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Bulk | Agilex F | Crimp | Crimp, Receptacle | 66 | 175 °C | -65 °C | Female | Threaded | Straight | 46.02 mm | 66 | Cadmium | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | 31.57 mm | 无 | 抗环境干扰 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFA027R25A3E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Non-Compliant | 624 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1802-1LSEVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 770 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LH79525N0Q100A0，55 | NXP | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU3EG-1SFVC784E | AMD | 数据表 | 2576 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 252 | Tray | XCZU3 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFB006R24C2I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 576 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFA012R24C3E3V | Intel | 数据表 | 924 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Non-Compliant | 744 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - |
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XCZU46DR-2FSVH1760E
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU47DR-L2FFVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU48DR-L1FSVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU48DR-L1FFVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU49DR-L1FSVF1760I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU48DR-2FSVG1517I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU49DR-1FFVF1760E
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU49DR-2FSVF1760E
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU43DR-L2FFVG1517I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU43DR-2FSVE1156E
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU48DR-L1FSVG1517I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU48DR-L2FFVG1517I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU43DR-L2FSVG1517I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU43DR-L1FFVG1517I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU43DR-2FSVG1517I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU48DR-1FSVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU43DR-1FSVG1517E
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU3CG-1SFVC784E
AMD
分类:Embedded - System On Chip (SoC)
3,314.975277
-
AGFB006R24C3E3V
Intel
分类:Embedded - System On Chip (SoC)
36,906.704668
-
AGFA027R25A3E3E
Intel
分类:Embedded - System On Chip (SoC)
-
XCVC1802-1LSEVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
-
LH79525N0Q100A0，55
NXP
分类:Embedded - System On Chip (SoC)
-
XCZU3EG-1SFVC784E
AMD
分类:Embedded - System On Chip (SoC)
3,868.616833
-
AGFB006R24C2I3E
Intel
分类:Embedded - System On Chip (SoC)
-
AGFA012R24C3E3V
Intel
分类:Embedded - System On Chip (SoC)
54,617.524551