category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

类别是'category.应用特定微控制器' (5057)

所有品牌

产品型号	品牌	数据表	库存	价格(含增值税)	数量	表面安装	终端数量																				JESD-609代码	无铅代码	ECCN 代码	端子表面处理	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	资历状况	温度等级	端口的数量	uPs/uCs/外围ICs类型	比特数	电源电流-最大值	座位高度-最大	地址总线宽度	主时钟/晶体频率-名	边界扫描	低功率模式	外部数据总线宽度	输出时钟频率-最大值	串行I/O数	定时器数量	总线兼容性	最大数据传输率	通信协议	信息访问方法
P1817BF-08ST	Alliance Semiconductor Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	8	RECTANGULAR	小概要	5.5 V	2.7 V	3.3 V	Transferred	ALLIANCE SEMICONDUCTOR CORP	SOIC	SOP,	70 °C	PLASTIC/EPOXY	SOP			EAR99		8542.39.00.01	DUAL	鸥翼	未说明	1.27 mm	unknown	未说明	8	R-PDSO-G8	不合格	COMMERCIAL		CLOCK GENERATOR, VIDEO			1.8 mm		20 MHz				20 MHz							4.92 mm	3.95 mm
P1817BF-08ST	Pulsecore Semiconductor	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	8	RECTANGULAR	小概要	5.5 V	2.7 V	3.3 V	有	Transferred	PULSECORE SEMICONDUCTOR	SOIC-8	70 °C	PLASTIC/EPOXY	SOP						DUAL	鸥翼	未说明	1.27 mm	unknown	未说明		R-PDSO-G8	不合格	COMMERCIAL		CLOCK GENERATOR, VIDEO			1.8 mm		20 MHz				20 MHz							4.92 mm	3.95 mm
ISP1583ET2	NXP Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	64	SOT543-1	12 MHz	85 °C	-40 °C	PLASTIC/EPOXY	LFBGA	SQUARE	网格排列	3.6 V	3 V	3.3 V	Transferred	NXP SEMICONDUCTORS	BGA	LFBGA,					8542.31.00.01	BOTTOM	BALL		0.5 mm	unknown		64	S-PBGA-B64	不合格	INDUSTRIAL		BUS CONTROLLER, UNIVERSAL SERIAL BUS			1.5 mm	8				16								6 mm	6 mm
ISP1583ET2	STMicroelectronics	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	64	BGA64,10X10,20	SQUARE	GRID ARRAY, FINE PITCH	有	Obsolete	STMICROELECTRONICS	FBGA, BGA64,10X10,20	85 °C	-40 °C	PLASTIC/EPOXY	FBGA					8542.31.00.01	BOTTOM	BALL		0.5 mm	compliant			S-PBGA-B64	不合格	INDUSTRIAL				60 mA
R65/41EB	Conexant Systems Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	40	无	IN-LINE	RECTANGULAR	DIP40,.6	DIP	CERAMIC	70 °C	DIP, DIP40,.6	康讯系统	Obsolete	e0			Tin/Lead (Sn/Pb)	8542.31.00.01	DUAL	THROUGH-HOLE		2.54 mm	unknown			R-XDIP-T40	不合格	COMMERCIAL
PAS5001	Microsemi Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1		,	MICROSEMI CORP	Obsolete						8542.31.00.01					compliant
MK0220-01S	Integrated Device Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	16	PLASTIC/EPOXY	SOP	RECTANGULAR	小概要	5.5 V	2.7 V	3 V	无	Obsolete	INTEGRATED DEVICE TECHNOLOGY INC	SOIC	SOP,	70 °C	e0	无	EAR99	锡铅	8542.39.00.01	DUAL	鸥翼		1.27 mm	compliant		16	R-PDSO-G16	不合格	COMMERCIAL		CLOCK GENERATOR, VIDEO			1.778 mm		2.1168 MHz				40 MHz							9.9695 mm	3.937 mm
XCZU6EG-2LFFVB1156E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1156	BGA	BGA1156,34X34,40	SQUARE	网格排列	0.85 V	有	活跃	ADVANCED MICRO DEVICES INC	FCBGA-1156	4	110 °C	PLASTIC/EPOXY	e1			锡银铜		BOTTOM	BALL		1 mm	compliant			S-PBGA-B1156		OTHER		PROGRAMMABLE SoC			3.42 mm									CAN, I2C, SPI, UART				35 mm	35 mm
XQ7Z030-1RF900Q	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	BGA900,30X30,40	SQUARE	网格排列	无	Transferred	XILINX INC	31 X 31 MM, 1 MM PITCH, BGA-900	125 °C	-40 °C	PLASTIC/EPOXY	BGA	e0			锡铅	8542.31.00.01	BOTTOM	BALL		1 mm	not_compliant			S-PBGA-B900	不合格	AUTOMOTIVE		PROGRAMMABLE SoC			3.44 mm													31 mm	31 mm
XCZU9CG-2LFFVC900E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有	活跃	ADVANCED MICRO DEVICES INC	FCBGA-900	4	110 °C	PLASTIC/EPOXY	e1			锡银铜		BOTTOM	BALL		1 mm	compliant			S-PBGA-B900		OTHER		PROGRAMMABLE SoC			3.42 mm									CAN, I2C, SPI, UART				31 mm	31 mm
MD2202-D32-V3-X-P	SanDisk Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	32	85 °C	-40 °C	PLASTIC/EPOXY	DIP	RECTANGULAR	IN-LINE	3.6 V	3 V	3.3 V	有	Obsolete	SANDISK CORP	DIP	DIP,					8542.31.00.01	DUAL	THROUGH-HOLE	未说明		unknown	未说明	32	R-PDIP-T32	不合格	INDUSTRIAL		SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE								8
XCZU6CG-2SBVA484I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	484	-40 °C	PLASTIC/EPOXY	FBGA	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	有	Transferred	XILINX INC	FBGA, BGA484,22X22,32	100 °C					8542.31.00.01	BOTTOM	BALL		0.8 mm	unknown			S-PBGA-B484		INDUSTRIAL		PROGRAMMABLE SoC			2.61 mm									I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)				19 mm	19 mm
XCZU6CG-2SBVA484I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	484	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	有	活跃	ADVANCED MICRO DEVICES INC	BGA-484	e1			锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B484		INDUSTRIAL		PROGRAMMABLE SoC			2.61 mm									I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)				19 mm	19 mm
XCZU9CG-1SFVC784I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA78428X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	有	Transferred	XILINX INC	FBGA, BGA78428X28,32				锡银铜	8542.31.00.01	BOTTOM	BALL	250	0.8 mm	unknown	30		S-PBGA-B784		INDUSTRIAL		PROGRAMMABLE SoC			3.32 mm									I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)				23 mm	23 mm
XCZU9CG-1SFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA78428X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	有	活跃	ADVANCED MICRO DEVICES INC	BGA-784	e1			锡银铜		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B784		INDUSTRIAL		PROGRAMMABLE SoC			3.32 mm									I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)				23 mm	23 mm
PSD813F2-12JI	Waferscale Integration Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	52	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	SQUARE	CHIP CARRIER	5.5 V	4.5 V	5 V	Obsolete	WAFERSCALE INTEGRATION INC	PLASTIC, LDCC-52	26.3 MHz	27						QUAD	J BEND			unknown			S-PQCC-J52	不合格	INDUSTRIAL	4	PARALLEL IO PORT, GENERAL PURPOSE			4.57 mm					16								19.1 mm	19.1 mm
SCC66470AAB	NXP Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	120	SQUARE	FLATPACK	5 V	Obsolete	NXP SEMICONDUCTORS	QFP, QFP120,1.2SQ,32	85 °C	-40 °C	PLASTIC/EPOXY	QFP	QFP120,1.2SQ,32					8542.31.00.01	QUAD	鸥翼		0.8 mm	unknown			S-PQFP-G120	不合格	INDUSTRIAL				100 mA
SCC66470AAB	Philips Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	120	QFP	QFP120,1.2SQ,32	SQUARE	FLATPACK	5 V	无	Transferred	飞利浦半导体	QFP, QFP120,1.2SQ,32	85 °C	-40 °C	PLASTIC/EPOXY	e0			Tin/Lead (Sn/Pb)	8542.31.00.01	QUAD	鸥翼		0.8 mm	unknown			S-PQFP-G120	不合格	INDUSTRIAL				100 mA
S1100	Desco Industries Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1
UPD65881GB-P01-3BS-A	NEC Electronics Group	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	85 °C	-40 °C	PLASTIC/EPOXY	QFP	SQUARE	FLATPACK	5.5 V	4.5 V	5 V	有	Obsolete	NEC ELECTRONICS CORP	QFP	QFP,	e6	有	EAR99	锡铋	8542.39.00.01	QUAD	鸥翼		0.8 mm	compliant		44	S-PQFP-G44	不合格	INDUSTRIAL		TIMER, PROGRAMMABLE	16		2.8 mm					8			3				PARALLEL, DIRECT ADDRESS	10 mm	10 mm
PEX8632-BB50RBC	Broadcom Limited	数据表	N/A	-	最小起订量: 1 最小包装量: 1
SAE81C91	Infineon Technologies AG	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	28	QLCC	PLASTIC, LCC-28	20 MHz	110 °C	-40 °C	PLASTIC/EPOXY	QCCJ	LDCC28,.4X.6	RECTANGULAR	CHIP CARRIER	5.5 V	4.5 V	5 V	无	Obsolete	INFINEON TECHNOLOGIES AG	e0			Tin/Lead (Sn/Pb)	8542.31.00.01	QUAD	J BEND		1.27 mm	not_compliant		28	R-PQCC-J28	不合格	INDUSTRIAL		SERIAL IO/COMMUNICATION CONTROLLER, LAN			3.8 mm	8		NO	NO	8		2			0.125 MBps	MIL STD 1553		14.05 mm	8.95 mm
PCA6408ABS	NXP Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	16	HVQCCN,	0.4 MHz	1	8	85 °C	-40 °C	PLASTIC/EPOXY	HVQCCN	SQUARE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	5.5 V	1.65 V	1.8 V	有	活跃	NXP SEMICONDUCTORS			EAR99		8542.39.00.01	QUAD	无铅	未说明	0.5 mm	compliant	未说明		S-PQCC-N16		INDUSTRIAL	1	PARALLEL IO PORT, GENERAL PURPOSE			1 mm													3 mm	3 mm
RB5C478A	Ricoh Electronic Devices Co Ltd	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	261	RICOH ELECTRONIC DEVICES CO LTD	BGA	BGA, BGA261,19X19,50	33 MHz	1	85 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA261,19X19,50	SQUARE	网格排列	3.6 V	3 V	3.3 V	无	Obsolete	e0	无	3A991.A.2	锡铅	8542.31.00.01	BOTTOM	BALL		1.27 mm	unknown		261	S-PBGA-B261	不合格	INDUSTRIAL		BUS CONTROLLER, PCI		50 mA	2.06 mm	32				32				PCI				25 mm	25 mm
P2010AF-08TR	onsemi	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	8	70 °C	PLASTIC/EPOXY	TSSOP	TSSOP8,.25	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	5.5 V	2.7 V	3.3 V	有	Obsolete	ON SEMICONDUCTOR	SOIC	TSSOP, TSSOP8,.25	e3	有	EAR99	TIN	8542.39.00.01	DUAL	鸥翼		0.65 mm	compliant		8	R-PDSO-G8	不合格	COMMERCIAL		CLOCK GENERATOR, OTHER		8 mA	1.1 mm		35 MHz				35 MHz							4.4 mm	3 mm

P1817BF-08ST

Alliance Semiconductor Corporation

分类:Embedded - Microcontrollers - Application Specific
P1817BF-08ST

Pulsecore Semiconductor

分类:Embedded - Microcontrollers - Application Specific
ISP1583ET2

NXP Semiconductors

分类:Embedded - Microcontrollers - Application Specific
ISP1583ET2

STMicroelectronics

分类:Embedded - Microcontrollers - Application Specific
R65/41EB

Conexant Systems Inc

分类:Embedded - Microcontrollers - Application Specific
PAS5001

Microsemi Corporation

分类:Embedded - Microcontrollers - Application Specific
MK0220-01S

Integrated Device Technology Inc

分类:Embedded - Microcontrollers - Application Specific
XCZU6EG-2LFFVB1156E

AMD

分类:Embedded - Microcontrollers - Application Specific
XQ7Z030-1RF900Q

AMD Xilinx

分类:Embedded - Microcontrollers - Application Specific
XCZU9CG-2LFFVC900E

AMD

分类:Embedded - Microcontrollers - Application Specific
MD2202-D32-V3-X-P

SanDisk Corporation

分类:Embedded - Microcontrollers - Application Specific
XCZU6CG-2SBVA484I

AMD Xilinx

分类:Embedded - Microcontrollers - Application Specific
XCZU6CG-2SBVA484I

AMD

分类:Embedded - Microcontrollers - Application Specific
XCZU9CG-1SFVC784I

AMD Xilinx

分类:Embedded - Microcontrollers - Application Specific
XCZU9CG-1SFVC784I

AMD

分类:Embedded - Microcontrollers - Application Specific
PSD813F2-12JI

Waferscale Integration Inc

分类:Embedded - Microcontrollers - Application Specific
SCC66470AAB

NXP Semiconductors

分类:Embedded - Microcontrollers - Application Specific
SCC66470AAB

Philips Semiconductors

分类:Embedded - Microcontrollers - Application Specific
S1100

Desco Industries Inc

分类:Embedded - Microcontrollers - Application Specific
UPD65881GB-P01-3BS-A

NEC Electronics Group

分类:Embedded - Microcontrollers - Application Specific
PEX8632-BB50RBC

Broadcom Limited

分类:Embedded - Microcontrollers - Application Specific
SAE81C91

Infineon Technologies AG

分类:Embedded - Microcontrollers - Application Specific
PCA6408ABS

NXP Semiconductors

分类:Embedded - Microcontrollers - Application Specific
RB5C478A

Ricoh Electronic Devices Co Ltd

分类:Embedded - Microcontrollers - Application Specific
P2010AF-08TR

onsemi

分类:Embedded - Microcontrollers - Application Specific