N/A

-

YES

118

DIE

DIE,

0.35 MHz

75 °C

-20 °C

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

5.5 V

4.5 V

5 V

有

Obsolete

NEW JAPAN RADIO CO LTD

ALSO OPERATES AT 3V SUPPLY

8542.31.00.01

UPPER

无铅

260

unknown

10

118

R-XUUC-N118

不合格

商业扩展

DISPLAY CONTROLLER, DOT MATRIX LCD DRIVER

1 mA

1

8

Z80

32 X 60 DOTS

N/A

-

Obsolete

CIRRUS LOGIC INC

,

8542.31.00.01

compliant

N/A

-

YES

516

有

Transferred

FREESCALE SEMICONDUCTOR INC

BGA, BGA516,26X26,40

PLASTIC/EPOXY

BGA

BGA516,26X26,40

SQUARE

网格排列

8542.31.00.01

BOTTOM

BALL

1 mm

unknown

S-PBGA-B516

不合格

N/A

-

YES

516

有

Transferred

MOTOROLA INC

BGA, BGA516,26X26,40

PLASTIC/EPOXY

BGA

BGA516,26X26,40

SQUARE

网格排列

8542.31.00.01

BOTTOM

BALL

1 mm

unknown

S-PBGA-B516

不合格

N/A

-

YES

44

-40 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

5.5 V

4.5 V

5 V

Obsolete

WAFERSCALE INTEGRATION INC

PLASTIC, LDCC-44

19

85 °C

QUAD

J BEND

unknown

S-PQCC-J44

不合格

INDUSTRIAL

3

PARALLEL IO PORT, GENERAL PURPOSE

4.57 mm

16

16.56 mm

16.56 mm

N/A

-

YES

208

FLATPACK, FINE PITCH

5 V

Obsolete

INTEL CORP

QFP

QFP-208

33 MHz

PLASTIC/EPOXY

FQFP

SQUARE

3A991.A.2

SMM POWER MANAGEMENT

8542.31.00.01

QUAD

鸥翼

0.5 mm

unknown

208

S-PQFP-G208

不合格

BUS CONTROLLER, EISA

3.75 mm

PCI

28 mm

28 mm

N/A

-

NO

20

-20 °C

PLASTIC/EPOXY

SDIP

RECTANGULAR

IN-LINE, SHRINK PITCH

5.25 V

4.75 V

5 V

Transferred

MITSUBISHI ELECTRIC CORP

DIP

SDIP,

85 °C

8542.31.00.01

DUAL

THROUGH-HOLE

1.778 mm

unknown

20

R-PDIP-T20

不合格

OTHER

DISPLAY CONTROLLER, CRT CHARACTER DISPLAY

50 mA

4.5 mm

1

24 X 12 CHARACTERS

19 mm

7.62 mm

N/A

-

YES

52

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

5.5 V

4.5 V

5 V

Obsolete

WAFERSCALE INTEGRATION INC

PLASTIC, LDCC-52

25 MHz

27

QUAD

J BEND

unknown

S-PQCC-J52

不合格

COMMERCIAL

4

PARALLEL IO PORT, GENERAL PURPOSE

4.57 mm

16

19.1 mm

19.1 mm

N/A

-

YES

784

PLASTIC/EPOXY

-40 °C

100 °C

4

FCBGA-784

ADVANCED MICRO DEVICES INC

活跃

有

0.85 V

GRID ARRAY, FINE PITCH

SQUARE

BGA784,28X28,32

FBGA

e1

锡银铜

BOTTOM

BALL

250

0.8 mm

compliant

30

S-PBGA-B784

INDUSTRIAL

PROGRAMMABLE SoC

3.32 mm

CAN, I2C, SPI, UART

23 mm

23 mm

N/A

-

N/A

-

N/A

-

NO

18

RECTANGULAR

IN-LINE

无

Obsolete

TEXAS INSTRUMENTS INC

DIP, DIP18,.3

70 °C

CERAMIC

DIP

DIP18,.3

8542.31.00.01

DUAL

THROUGH-HOLE

2.54 mm

not_compliant

R-XDIP-T18

不合格

COMMERCIAL

N/A

-

YES

564

BGA

SQUARE

网格排列

Obsolete

MARVELL SEMICONDUCTOR INC

BGA,

PLASTIC/EPOXY

8542.31.00.01

BOTTOM

BALL

compliant

S-PBGA-B564

微处理器电路

N/A

-

YES

564

BGA

SQUARE

网格排列

Transferred

CAVIUM NETWORKS

BGA,

PLASTIC/EPOXY

8542.31.00.01

BOTTOM

BALL

unknown

S-PBGA-B564

微处理器电路

N/A

-

YES

144

QFP

SQUARE

FLATPACK

5.25 V

3 V

5 V

Obsolete

DIGITAL EQUIPMENT CORP

,

33.33 MHz

70 °C

PLASTIC/EPOXY

8542.31.00.01

QUAD

鸥翼

unknown

S-PQFP-G144

不合格

COMMERCIAL

SERIAL IO/COMMUNICATION CONTROLLER, LAN

200 mA

32

YES

YES

32

0

3

PCI

12.5 MBps

1

ASYNC, BIT; ETHERNET

NRZ

N/A

-

YES

625

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

0.742 V

0.698 V

0.72 V

有

Transferred

XILINX INC

FBGA, BGA625,25X25,32

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

8542.31.00.01

BOTTOM

BALL

0.8 mm

unknown

S-PBGA-B625

INDUSTRIAL

PROGRAMMABLE SoC

3.43 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

21 mm

21 mm

N/A

-

YES

60

PLASTIC/EPOXY

QFP

QFP60,.77X1.0,40

RECTANGULAR

FLATPACK

5 V

无

活跃

SEIKO EPSON CORP

QFP, QFP60,.77X1.0,40

70 °C

-20 °C

e0

Tin/Lead (Sn/Pb)

8542.31.00.01

QUAD

鸥翼

1 mm

unknown

R-PQFP-G60

不合格

COMMERCIAL

12 mA

N/A

-

Obsolete

THOMSON CONSUMER ELECTRONICS

,

8542.31.00.01

unknown

N/A

-

N/A

-

NO

20

PLASTIC/EPOXY

DIP

DIP20,.3

RECTANGULAR

IN-LINE

5.5 V

4.5 V

5 V

无

Obsolete

TEXAS INSTRUMENTS INC

DIP, DIP20,.3

70 °C

DUAL

THROUGH-HOLE

未说明

2.54 mm

not_compliant

未说明

R-PDIP-T20

不合格

COMMERCIAL

CLOCK GENERATOR, OTHER

85 mA

12 MHz

16 MHz

N/A

-

无

活跃

CIRRUS LOGIC INC

8542.31.00.01

compliant

N/A

-

N/A

-

YES

784

4

100 °C

0.85 V

0.825 V

0.876 V

GRID ARRAY, FINE PITCH

SQUARE

BGA78428X28,32

FBGA

PLASTIC/EPOXY

有

活跃

ADVANCED MICRO DEVICES INC

BGA-784

e1

锡银铜

BOTTOM

BALL

250

0.8 mm

compliant

30

S-PBGA-B784

OTHER

PROGRAMMABLE SoC

3.32 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

23 mm

23 mm

N/A

-

YES

784

BGA78428X28,32

SQUARE

GRID ARRAY, FINE PITCH

0.876 V

0.825 V

0.85 V

FBGA, BGA78428X28,32

XILINX INC

Transferred

有

4

100 °C

PLASTIC/EPOXY

FBGA

锡银铜

8542.31.00.01

BOTTOM

BALL

250

0.8 mm

unknown

30

S-PBGA-B784

OTHER

PROGRAMMABLE SoC

3.32 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

23 mm

23 mm

N/A

-

Transferred

HAMLIN ELECTRONICS EUROPE LTD

,

8542.31.00.01

unknown