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产品型号	品牌	数据表	库存	价格(含增值税)	数量	触点镀层	底架	安装类型	包装/外壳	表面安装	供应商器件包装	终端数量																	厂商																													操作温度	包装	系列	尺寸/尺寸	容差	零件状态	终止次数	终端	温度系数	连接器类型	类型	电阻	定位的数量	最高工作温度	最小工作温度	组成	性别	功率(瓦特)	HTS代码	紧固类型	子类别	技术	电压 - 供电	端子位置	方向	终端形式	峰值回流焊温度（摄氏度）	端子间距	深度	Reach合规守则	输出量	引脚数量	终端样式	JESD-30代码	输出的数量	资历状况	接头数量	电源	内存大小	极数	周边设备	程序内存大小	输入数量	可编程逻辑类型	输入
XC7Z035-1FFG900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	AMD			275,000	FCBGA	1.0000 V	0.95 V	362	1.05 V	表面贴装	130	Tray	XC7Z035	活跃	Industrial grade				-40 to 100 °C		Zynq®-7000																								900											667MHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Industrial	1	Kintex™-7 FPGA, 275K Logic Cells	343,800			-
AGIB019R18A2I3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1805-BBGA Exposed Pad	1805-BGA (42.5x42.5)					480			-40°C ~ 100°C (TJ)	Tray	Agilex I			活跃																																1.4GHz	256KB	Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point		DMA, WDT		EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA										FPGA - 1.9M Logic Elements
SOM-2533AN0C-S0A1	Advantech Corp	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Module					8				0°C ~ 60°C	Box	SMARC			活跃																																3.4GHz	4GB	Intel® N50		HDMI, LCD, LVDS, SATA		CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB	MPU
AMA3B1KK-KQR-B0	Ambiq Micro, Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	64-WFQFN Exposed Pad	64-QFN (8x8)					37			-40°C ~ 85°C (TA)	Tape & Reel (TR);Cut Tape (CT);Digi-Reel®	Apollo3 Blue			活跃																																96MHz	384KB	ARM® Cortex®-M4F		Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT		I2C, SPI, UART/USART	MCU														1MB
XCZU3CG-1SFVC784E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD		Non-Compliant	252	Tray	XCZU3	活跃					0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC CG																																			500MHz, 1.2GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Zynq®UltraScale+™ FPGA, 154K+ Logic Cells				-
XCVE1752-2MLEVSVA1596	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA, FCBGA	AMD						+ 85 C	3.174657 oz	- 40 C	3	面板安装	Sensata	不发光	AIRPAX	AIRPAX	500	Tray	活跃				IAL/IDL/IML/IUL								Hydraulic-Magnetic										断路器							Stud					Handle					600MHz, 1.4GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	1 Pole	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					磁性断路器									-	断路器		断路器
XCZU3CG-1SBVA484I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA, FCBGA	484-FCBGA (19x19)	AMD	- 40 C	3	面板安装	Sensata	不发光	AIRPAX	82	Tray	XCZU3	活跃						+ 85 C	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC CG																		断路器							Push-On					Toggle					500MHz, 1.2GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	2 Pole	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA									Zynq®UltraScale+™ FPGA, 154K+ Logic Cells				-	断路器		断路器
XCZU19EG-2FFVB1517I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD	TE Connectivity	5000	644	Tray	XCZU19	活跃						TE Connectivity / AMP	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																		Wire & Cable Management																	533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Wire Labels & Markers					Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells				-			Wire Labels & Markers
10AS016E3F29I1SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	780-BBGA, FCBGA	780-FBGA (29x29)					288	Non-Compliant			-40°C ~ 100°C (TJ)	Tray	Arria 10 SX			Discontinued at Digi-Key																																1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										FPGA - 160K Logic Elements				--
10AS027H3F34I2SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-1152	YES	1152	Arria 10 SoC	Details	2 x 32 kB	-		BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS027H3F34I2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45					384	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	270000 LE	1	SMD/SMT	33750 LAB	964831	Intel	Intel / Altera	-40°C ~ 100°C (TJ)	Tray	Arria 10 SX	活跃										8542.39.00.01		SOC - Systems on a Chip	CMOS		BOTTOM		BALL	未说明	1 mm		compliant				S-PBGA-B1152	384	不合格			0.9 V	INDUSTRIAL			1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	384	3.65 mm	现场可编程门阵列	SoC FPGA	FPGA - 270K Logic Elements	270000	2 Core	--	SoC FPGA	35 mm	35 mm
LH79525N0Q100A0，55	NXP	数据表	N/A	-	最小起订量: 1 最小包装量: 1
AGFB006R24C3E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Gold	Bulkhead, Front Side Nut, Jam Nut, Panel	-	-	Intel	Compliant	576	Tray	活跃				0°C ~ 100°C (TJ)	Bulk	Agilex F					Crimp		Crimp, Receptacle			66	175 °C	-65 °C		Female			Threaded					Straight				46.02 mm					66			Cadmium	1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point		DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA										FPGA - 573K Logic Elements				-					31.57 mm		无	抗环境干扰
AGFB006R24C2I3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	Tray	活跃						576	-40°C ~ 100°C (TJ)		Agilex F																																			1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point		DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA										FPGA - 573K Logic Elements				-
AGFA012R24C3E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel						Non-Compliant	744	Tray	活跃	0°C ~ 100°C (TJ)		Agilex F																																			1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point		DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA										FPGA - 1.2M Logic Elements				-
XCZU3EG-1SFVC784E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD						252	Tray	XCZU3	活跃	0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																																			500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Zynq®UltraScale+™ FPGA, 154K+ Logic Cells				-
XCZU47DR-L2FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	Panduit Corp	Obsolete	366						Bulk	-40°C ~ 100°C (TJ)		*																																			533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
XCZU47DR-2FSVE1156E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	0805 (2012 Metric)	0805	KOA Speer Electronics, Inc.						Tape & Reel (TR)	RN732A	Obsolete	366	-55°C ~ 155°C		RN73	0.079 L x 0.049 W (2.00mm x 1.25mm)	±0.5%		2		±25ppm/°C			1.18 kOhms				Thin Film		0.1W, 1/10W																				533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-		Moisture Resistant		0.024 (0.60mm)
XCZU47DR-L2FFVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	Molex						Bulk	505433	活跃	561	-40°C ~ 100°C (TJ)		*																																			533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
XCZU48DR-1FFVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	Pulse Electronics	Obsolete	366						Bulk	-40°C ~ 100°C (TJ)		-																																			500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
XCZU46DR-2FSVH1760E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	NXP USA Inc.						Tube	BLF6	活跃	574	0°C ~ 100°C (TJ)		*																																			533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
XCZU47DR-L2FFVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	24-VFQFN Exposed Pad	24-QFN (4x4)	Skyworks Solutions Inc.	366					Tray	SI5330	Obsolete	350 MHz	-40°C ~ 85°C		-								Fanout Buffer (Distribution), Translator												1.71V ~ 3.63V								LVPECL					1		533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				CMOS, HSTL, LVTTL, SSTL		1:4	No/Yes			Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
XCZU48DR-L1FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	Molex						Bulk	120084	活跃	366	-40°C ~ 100°C (TJ)		*																																			500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
XCZU48DR-L1FFVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	TE Connectivity Deutsch 连接器						Bag	YDL68G	活跃	366	-40°C ~ 100°C (TJ)		*																																			500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
XCZU49DR-L1FSVF1760I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	Molex						Bulk	073404	活跃	622	-40°C ~ 100°C (TJ)		*																																			500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
XCZU48DR-2FSVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	Molex						Bulk	098853	活跃	561	-40°C ~ 100°C (TJ)		*																																			533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-